
- •Distinctive Characteristics
- •General Description
- •S29AL032D Features
- •1. Product Selector Guide
- •2. Block Diagram
- •3. Connection Diagrams
- •Figure 3.1 40-pin Standard TSOP
- •3.1 FBGA Package for Model 00 Only
- •Figure 3.3 Model 00 48-ball FBGA (Top View, Balls Facing Down)
- •3.2 FBGA Package for Models 03, 04 Only
- •Figure 3.4 Models 03, 04 48-ball FBGA (Top View, Balls Facing Down)
- •3.3 Special Handling Instructions
- •4. Pin Configuration
- •5. Logic Symbols
- •6. Ordering Information
- •6.1 S29AL032D Standard Products
- •6.2 Valid Combinations
- •7. Device Bus Operations
- •Table 8. S29AL032D Device Bus Operations
- •7.1 Word/Byte Configuration (Models 03, 04 Only)
- •7.2 Requirements for Reading Array Data
- •7.4 Program and Erase Operation Status
- •7.5 Accelerated Program Operation
- •7.6 Standby Mode
- •7.7 Automatic Sleep Mode
- •7.8 RESET#: Hardware Reset Pin
- •7.9 Output Disable Mode
- •7.10 Sector Addresss Tables
- •Table 8. Model 00 Sector Addresses (Sheet 1 of 2)
- •Table 9. Model 00 Secured Silicon Sector Addresses
- •Table 10. Model 03 Sector Addresses (Sheet 1 of 2)
- •Table 11. Model 03 Secured Silicon Sector Addresses
- •Table 12. Model 04 Sector Addresses (Sheet 1 of 2)
- •Table 13. Model 04 Secured Silicon Sector Addresses
- •7.11 Autoselect Mode
- •Table 8. S29AL032D Autoselect Codes (High Voltage Method)
- •7.12 Sector Protection/Unprotection
- •Table 8. Sector Block Addresses for Protection/Unprotection — Model 00
- •Table 9. Sector Block Addresses for Protection/Unprotection — Model 03 (Sheet 1 of 2)
- •7.13 Write Protect (WP#) — Models 03, 04 Only
- •7.14 Temporary Sector Unprotect
- •8. Secured Silicon Sector Flash Memory Region
- •Figure 8.1 Secured Silicon Sector Protect Verify
- •9. Hardware Data Protection
- •9.1 Low VCC Write Inhibit
- •9.2 Write Pulse “Glitch” Protection
- •9.3 Logical Inhibit
- •10. Common Flash Memory Interface (CFI)
- •Table 11. CFI Query Identification String
- •Table 12. System Interface String
- •Table 13. Device Geometry Definition
- •11. Command Definitions
- •11.1 Reading Array Data
- •11.2 Reset Command
- •11.3 Autoselect Command Sequence
- •11.6 Unlock Bypass Command Sequence
- •Figure 11.1 Program Operation
- •11.7 Chip Erase Command Sequence
- •11.8 Sector Erase Command Sequence
- •Figure 11.2 Erase Operation
- •11.10 Command Definitions Table
- •Table 12. S29AL032D Command Definitions — Model 00
- •12. Write Operation Status
- •12.1 DQ7: Data# Polling
- •Figure 12.1 Data# Polling Algorithm
- •12.2 RY/BY#: Ready/Busy#
- •12.3 DQ6: Toggle Bit I
- •12.4 DQ2: Toggle Bit II
- •12.5 Reading Toggle Bits DQ6/DQ2
- •Figure 12.2 Toggle Bit Algorithm
- •12.6 DQ5: Exceeded Timing Limits
- •12.7 DQ3: Sector Erase Timer
- •Table 13. Write Operation Status
- •13. Absolute Maximum Ratings
- •Table 14. Absolute Maximum Ratings
- •14. Operating Ranges
- •Table 15. Operating Ranges
- •15. DC Characteristics
- •Table 16. DC Characteristics, CMOS Compatible
- •15.1 Zero Power Flash
- •Figure 15.2 Typical ICC1 vs. Frequency
- •16. Test Conditions
- •16.1 Key to Switching Waveforms
- •Figure 16.1 Input Waveforms and Measurement Levels
- •17. AC Characteristics
- •17.1 Read Operations
- •Figure 17.1 Read Operations Timings
- •17.2 Hardware Reset (RESET#)
- •17.3 Word/Byte Configuration (BYTE#) (Models 03, 04 Only)
- •Figure 17.3 BYTE# Timings for Read Operations
- •Figure 17.4 BYTE# Timings for Write Operations
- •17.4 Erase/Program Operations
- •Table 18. Erase/Program Operations
- •Figure 18.1 Program Operation Timings
- •Figure 18.3 Back to Back Read/Write Cycle Timing
- •Figure 18.4 Data# Polling Timings (During Embedded Algorithms)
- •Figure 18.5 Toggle Bit Timings (During Embedded Algorithms)
- •17.5 Temporary Sector Unprotect
- •Table 18. Temporary Sector Unprotect
- •Figure 18.1 Temporary Sector Unprotect Timing Diagram
- •Figure 18.3 Sector Protect/Unprotect Timing Diagram
- •17.6 Alternate CE# Controlled Erase/Program Operations
- •Figure 18.1 Alternate CE# Controlled Write Operation Timings
- •18. Erase and Programming Performance
- •19. TSOP and BGA Pin Capacitance
- •19.3 VBN048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 10.0 x 6.0 mm
- •20. Document History Page
- •RYSU
- •RYSU
- •RYSU
- •RYSU
- •RYSU
- •RYSU
- •Sales, Solutions, and Legal Information
- •Worldwide Sales and Design Support
- •Products
- •PSoC® Solutions
- •Cypress Developer Community
- •Technical Support

S29AL032D
Sales, Solutions, and Legal Information
Worldwide Sales and Design Support
Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations.
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© Cypress Semiconductor Corporation, 2005-2016. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Any Source Code (software and/or firmware) is owned by Cypress Semiconductor Corporation (Cypress) and is protected by and subject to worldwide patent protection (United States and foreign), United States copyright laws and international treaty provisions. Cypress hereby grants to licensee a personal, non-exclusive, non-transferable license to copy, use, modify, create derivative works of, and compile the Cypress Source Code and derivative works for the sole purpose of creating custom software and or firmware in support of licensee product to be used only in conjunction with a Cypress integrated circuit as specified in the applicable agreement. Any reproduction, modification, translation, compilation, or representation of this Source Code except as specified above is prohibited without the express written permission of Cypress.
Disclaimer: CYPRESS MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Cypress reserves the right to make changes without further notice to the materials described herein. Cypress does not assume any liability arising out of the application or use of any product or circuit described herein. Cypress does not authorize its products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress’ product in a life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Use may be limited by and subject to the applicable Cypress software license agreement.
Document Number: 002-02003 Rev. *B |
Revised January 08, 2016 |
Page 64 of 64 |
Cypress®, Spansion®, MirrorBit®, MirrorBit® Eclipse™, ORNAND™, EcoRAM™, HyperBus™, HyperFlash™, and combinations thereof, are trademarks and registered trademarks of Cypress Semiconductor Corp. All products and company names mentioned in this document may be the trademarks of their respective holders.