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S29AL032D |
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18. Erase and Programming Performance |
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Parameter |
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Typ (Note 1) |
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Max (Note 2) |
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Unit |
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Comments |
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Sector Erase Time (Note 7) |
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0.7 |
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10 |
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s |
Excludes 00h programming |
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Chip Erase Time (Note 8) |
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45 |
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s |
prior to erasure (Note 4) |
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Byte Programming Time |
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9 |
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300 |
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µs |
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Word Programming Time |
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11 |
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360 |
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µs |
Excludes system level overhead |
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Accelerated Byte/Word Programming Time |
7 |
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210 |
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µs |
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(Note 5) |
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Chip Programming Time |
Byte Mode |
36 |
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108 |
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s |
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(Note 3) |
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Word Mode |
24 |
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72 |
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s |
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Notes |
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1. |
Typical program and erase times assume the following conditions: 25 C, VCC = 3.0 V, 100,000 cycles, checkerboard data pattern. |
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2. |
Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles. |
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Design |
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3. |
The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes pro ram faster than |
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the maximum program times listed. |
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4. |
In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure. |
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5. |
System-level overhead is the time required to execute the twoor four-bus-cycle sequence for the program command. See Table 13 for further |
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information on command definitions. |
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New |
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6. |
The device has a minimum erase and program cycle endurance of 100,000 cycles per sector. |
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7. |
At extended temperature range (>+85°C), typical erase time is 1.75 s and maximum erase time is 25 s. |
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8. |
At extended temperature range (>+85°C), typical erase time is 112 s. |
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for |
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19. TSOP and BGA Pin Capacitance |
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Parameter Symbol |
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Recommended |
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Test Setup |
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Package |
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Typ |
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Max |
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Unit |
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Parameter Description |
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CIN |
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Input Capacitance |
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VIN = 0 |
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TSOP |
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6 |
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7.5 |
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pF |
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BGA |
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4.2 |
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5.0 |
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pF |
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COUT |
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Output Capacitance |
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VOUT = 0 |
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TSOP |
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8.5 |
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12 |
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pF |
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BGA |
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5.4 |
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6.5 |
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pF |
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CIN2 |
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Control Pin Capacitance |
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VIN = 0 |
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TSOP |
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7.5 |
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9 |
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pF |
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BGA |
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3.9 |
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4.7 |
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pF |
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Notes |
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1. |
Sampled, not 100% tested. |
Not |
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2. |
Test conditions TA = 25°C, f = 1.0 MHz.Physical Dimensions |
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Document Number: 002-02003 Rev. *B |
Page 57 of 64 |
S29AL032D
19.1TS040—40-Pin Standard TSOP
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New |
Design |
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for |
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Recommended |
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Dwg rev AA; 10/99 |
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Not |
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Document Number: 002-02003 Rev. *B |
Page 58 of 64 |
S29AL032D
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New |
Design |
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for |
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Recommended |
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Dwg rev AA; 10/99 |
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Not |
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Document Number: 002-02003 Rev. *B |
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Page 59 of 64 |
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S29AL032D
19.2TS 048—48-Pin Standard TSOP
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2X |
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STANDARD PIN OUT (TOP VIEW) |
0.10 |
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2X (N/2 TIPS) |
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2 |
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2X |
0.10 |
0.10 |
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A2 |
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1 |
N |
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REVERSE PIN OUT (TOP VIEW) |
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A |
SEE DETAIL B |
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B |
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3 |
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E |
5 |
1 |
N |
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N |
N |
+1 |
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e |
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2 |
2 |
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D1 |
5 |
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9 |
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4 |
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A1 N |
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D |
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Design |
N |
+1 |
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2 |
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2 |
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0.25 |
B |
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C |
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2X (N/2 TIPS) |
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A |
SEATING |
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PLANE |
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B |
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SEE DETAIL A |
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0.08MM (0.0031") |
M |
C A - B S |
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b |
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6 |
7 |
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New |
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WITH PLATING |
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7 |
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(c) |
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c1 |
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Recommended |
for |
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b1 |
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BASE METAL |
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SECTION B-B |
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R |
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(c) |
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e/2 |
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GAUGE PLANE |
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PARALLEL TO |
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q° |
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0.25MM (0.0098") BSC |
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X |
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C |
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SEATING PLANE |
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L |
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X = A OR B |
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DETAIL A |
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DETAIL B |
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Not |
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NOTES:
Jedec |
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MO-142 (D) DD |
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Symbol |
MIN |
NOM |
MAX |
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A |
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1.20 |
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A1 |
0.05 |
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0.15 |
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A2 |
0.95 |
1.00 |
1.05 |
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b1 |
0.17 |
0.20 |
0.23 |
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b |
0.17 |
0.22 |
0.27 |
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c1 |
0.10 |
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0.16 |
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c |
0.10 |
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0.21 |
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D19.80 20.00 20.20
D1 18.30 18.40 18.50
E11.90 12.00 12.10
e |
0.50 BASIC |
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L |
0.50 0.60 |
0.70 |
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0 |
0° |
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8˚ |
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R |
0.08 |
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0.20 |
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N |
48 |
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1CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm). (DIMENSIONING AND TOLERANCING CONFORMS TO ANSI Y14.5M-1982)
2PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE UP).
3PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN), INK OR LASER MARK.
4TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
5DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD PROTUSION IS 0.15mm (.0059") PER SIDE.
6DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR PROTUSION SHALL BE 0.08 (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX. MATERIAL CONDITION. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT LEAD TO BE 0.07 (0.0028").
7THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10MM (.0039") AND 0.25MM (0.0098") FROM THE LEAD TIP.
8LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM THE SEATING PLANE.
9DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
3355 \ 16-038.10c
* For reference only. BSC is an ANSI standard for Basic Space Centering.
Document Number: 002-02003 Rev. *B |
Page 60 of 64 |