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Микропроцессорная техника Сторожок / Datasheet.hk_dspic33fj32mc204_1234824

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dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 23-38: ADC MODULE SPECIFICATIONS

			Standard Operating Conditions: 3.0V to 3.6V
AC CHARACTERISTICS			(unless otherwise stated)
AC CHARACTERISTICS			Operating temperature -40°C			≤ TA ≤ +85°C for Industrial
			Operating temperature -40°C			≤ TA ≤ +85°C for Industrial
					-40°C ≤ TA ≤ +125°C for Extended
Param	Symbol	Characteristic	Min.	Typ	Max.		Units	Conditions
No.

			Device Supply
AD01	AVDD	Module VDD Supply	Greater of	—	Lesser of		V
			VDD – 0.3		VDD + 0.3			—
			or 3.0		or 3.6
AD02	AVSS	Module VSS Supply	VSS – 0.3	—	VSS + 0.3		V	—
			Reference Inputs
AD05	VREFH	Reference Voltage High	AVSS + 2.7	—	AVDD		V	See Note 1
AD05a			3.0	—	3.6		V	VREFH = AVDD
								VREFL = AVSS = 0
AD06	VREFL	Reference Voltage Low	AVSS	—	AVDD – 2.7		V	See Note 1
AD06a			0	—	0		V	VREFH = AVDD
								VREFL = AVSS = 0
AD07	VREF	Absolute Reference Voltage	2.7	—	3.6		V	VREF = VREFH - VREFL
AD08	IREF	Current Drain	—	400	550		μA	ADC operating
				—	10		μA	ADC off
			Analog Input
AD12	VINH	Input Voltage Range VINH	VINL	—	VREFH		V	This voltage reflects
								Sample and Hold Channels
								0, 1, 2, and 3 (CH0-CH3),
								positive input
AD13	VINL	Input Voltage Range VINL	VREFL	—	AVSS + 1V		V	This voltage reflects
								Sample and Hold Channels
								0, 1, 2, and 3 (CH0-CH3),
								negative input
AD17	RIN	Recommended Impedance	—	—	200		Ω	10-bit ADC
		of Analog Voltage Source	—	—	200		Ω	12-bit ADC

Note 1:	These parameters are not characterized or tested in manufacturing.

♥ 2007 Microchip Technology Inc.

Preliminary

DS70283B-page 269

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 23-39: ADC MODULE SPECIFICATIONS (12-BIT MODE)

			Standard Operating Conditions: 3.0V to 3.6V
AC CHARACTERISTICS			(unless otherwise stated)
AC CHARACTERISTICS			Operating temperature				-40°C ≤ TA ≤ +85°C for Industrial
			Operating temperature				-40°C ≤ TA ≤ +85°C for Industrial
							-40°C ≤ TA ≤ +125°C for Extended
Param	Symbol	Characteristic	Min.		Typ	Max.		Units	Conditions
No.	Symbol	Characteristic	Min.		Typ	Max.		Units	Conditions
No.

		ADC Accuracy (12-bit Mode) – Measurements with external VREF+/VREF-
AD20a	Nr	Resolution		12 data bits				bits
AD21a	INL	Integral Nonlinearity	-2		—	+2		LSb	VINL = AVSS = VREFL = 0V, AVDD
									= VREFH = 3.6V
AD22a	DNL	Differential Nonlinearity	>-1		—	<1		LSb	VINL = AVSS = VREFL = 0V, AVDD
									= VREFH = 3.6V
AD23a	GERR	Gain Error	1.25		1.5	3		LSb	VINL = AVSS = VREFL = 0V, AVDD
									= VREFH = 3.6V
AD24a	EOFF	Offset Error	1.25		1.52	2		LSb	VINL = AVSS = VREFL = 0V, AVDD
									= VREFH = 3.6V
AD25a	—	Monotonicity	—		—	—		—	Guaranteed
		ADC Accuracy (12-bit Mode) – Measurements with internal VREF+/VREF-
AD20a	Nr	Resolution		12 data bits				bits
AD21a	INL	Integral Nonlinearity	-2		—	+2		LSb	VINL = AVSS = 0V, AVDD = 3.6V
AD22a	DNL	Differential Nonlinearity	>-1		—	<1		LSb	VINL = AVSS = 0V, AVDD = 3.6V
AD23a	GERR	Gain Error	2		3	7		LSb	VINL = AVSS = 0V, AVDD = 3.6V
AD24a	EOFF	Offset Error	2		3	5		LSb	VINL = AVSS = 0V, AVDD = 3.6V
AD25a	—	Monotonicity	—		—	—		—	Guaranteed
		Dynamic Performance (12-bit Mode)
AD30a	THD	Total Harmonic Distortion	-77		-69	-61		dB	—
AD31a	SINAD	Signal to Noise and	59		63	64		dB	—
		Distortion
AD32a	SFDR	Spurious Free Dynamic	63		72	74		dB	—
		Range
AD33a	FNYQ	Input Signal Bandwidth	—		—	250		kHz	—
AD34a	ENOB	Effective Number of Bits	10.95		11.1	—		bits	—

DS70283B-page 270

Preliminary

♥ 2007 Microchip Technology Inc.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 23-40: ADC MODULE SPECIFICATIONS (10-BIT MODE)

Standard Operating Conditions: 3.0V to 3.6V

AC CHARACTERISTICS

(unless otherwise stated)

Operating temperature

-40°C ≤ TA ≤ +85°C for Industrial

-40°C ≤ TA ≤ +125°C for Extended

Param

Symbol

Characteristic

Min.

Typ

Max.

Units

Conditions

No.

ADC Accuracy (10-bit Mode) – Measurements with external VREF+/VREF-

AD20b

Resolution

10 data bits

bits

AD21b

INL

Integral Nonlinearity

-1.5

—

+1.5

LSb

VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD22b

DNL

Differential Nonlinearity

>-1

—

LSb

VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD23b

GERR

Gain Error

LSb

VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD24b

EOFF

Offset Error

LSb

VINL = AVSS = VREFL = 0V,

AVDD = VREFH = 3.6V

AD25b

—

Monotonicity

—

Guaranteed

ADC Accuracy (10-bit Mode) – Measurements with internal VREF+/VREF-

AD20b

Resolution

10 data bits

bits

AD21b

INL

Integral Nonlinearity

-1

—

LSb

VINL = AVSS = 0V, AVDD = 3.6V

AD22b

DNL

Differential Nonlinearity

>-1

—

LSb

VINL = AVSS = 0V, AVDD = 3.6V

AD23b

GERR

Gain Error

LSb

VINL = AVSS = 0V, AVDD = 3.6V

AD24b

EOFF

Offset Error

LSb

VINL = AVSS = 0V, AVDD = 3.6V

AD25b

—

Monotonicity

—

Guaranteed

Dynamic Performance (10-bit Mode)

AD30b

THD

Total Harmonic Distortion

—

-64

-67

—

AD31b

SINAD

Signal to Noise and

—

Distortion

AD32b

SFDR

Spurious Free Dynamic

—

Range

AD33b

FNYQ

Input Signal Bandwidth

—

550

kHz

—

AD34b

ENOB

Effective Number of Bits

9.1

9.7

9.8

bits

—

♥ 2007 Microchip Technology Inc.

Preliminary

DS70283B-page 271

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 23-22: ADC CONVERSION (12-BIT MODE) TIMING CHARACTERISTICS (ASAM = 0, SSRC<2:0> = 000)

AD50

ADCLK

Instruction

Execution

Set SAMP

Clear SAMP

SAMP

AD61

AD60

DONE

TSAMP

AD55

AD1IF

– Software sets AD1CON. SAMP to start sampling.

– Convert bit 11.

– Sampling starts after discharge period. TSAMP is described in

– Convert bit 10.

Section 28. “10/12-bit ADC without DMA” in the

– Convert bit 1.

“dsPIC33F Family Reference Manual”.

– Convert bit 0.

– Software clears AD1CON. SAMP to start conversion.

– Sampling ends, conversion sequence starts.

– One TAD for end of conversion.

TABLE 23-41: ADC CONVERSION (12-BIT MODE) TIMING REQUIREMENTS

			Standard Operating Conditions: 3.0V to 3.6V
AC CHARACTERISTICS			(unless otherwise stated)
AC CHARACTERISTICS			Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
			Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
					-40°C ≤ TA ≤ +125°C for Extended
Param	Symbol	Characteristic	Min.	Typ	Max.	Units	Conditions
No.

		Clock Parameters
AD50	TAD	ADC Clock Period	117.6	—	—	ns
AD51	tRC	ADC Internal RC Oscillator	—	250	—	ns
		Period
		Conversion Rate
AD55	tCONV	Conversion Time	—	14 TAD		ns
AD56	FCNV	Throughput Rate	—	—	500	Ksps
AD57	TSAMP	Sample Time	3 TAD	—	—	—
		Timing Parameters
AD60	tPCS	Conversion Start from Sample	—	1.0 TAD	—	—	Auto convert trigger not
		Trigger(2)					selected
AD61	tPSS	Sample Start from Setting	0.5 TAD	—	1.5 TAD	—	—
		Sample (SAMP) bit(2)
AD62	tCSS	Conversion Completion to	—	0.5 TAD	—	—	—
		Sample Start (ASAM = 1)(2)
AD63	tDPU	Time to Stabilize Analog Stage	1	—	5	μs	—
		from ADC Off to ADC On(2)

Note 1: Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity performance, especially at elevated temperatures.

2:These parameters are characterized but not tested in manufacturing.

DS70283B-page 272

Preliminary

♥ 2007 Microchip Technology Inc.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

FIGURE 23-23: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 0, SSRC<2:0> = 000)

AD50
ADCLK
Instruction
Execution Set SAMP	Clear SAMP

SAMP

AD61

AD60

TSAMP AD55 AD55

DONE

AD1IF

1– Software sets AD1CON. SAMP to start sampling.

2– Sampling starts after discharge period. TSAMP is described in

Section 28. “10/12-bit ADC without DMA” in the

“dsPIC33F Family Reference Manual”.

3– Software clears AD1CON. SAMP to start conversion.

4– Sampling ends, conversion sequence starts.

5– Convert bit 9.

6– Convert bit 8.

7– Convert bit 0.

8– One TAD for end of conversion.

FIGURE 23-24: ADC CONVERSION (10-BIT MODE) TIMING CHARACTERISTICS (CHPS<1:0> = 01, SIMSAM = 0, ASAM = 1, SSRC<2:0> = 111, SAMC<4:0> = 00001)

AD50

ADCLK

InstructionExecution Set ADON

SAMP

TSAMP		AD55		AD55		TSAMP	AD55

AD1IF

DONE

1– Software sets AD1CON. ADON to start AD operation.

2– Sampling starts after discharge period. TSAMP is described in

Section 28. “10/12-bit ADC without DMA” in the

“dsPIC33F Family Reference Manual”.

3– Convert bit 9.

4– Convert bit 8.

5 – Convert bit 0.

6 – One TAD for end of conversion.

7 – Begin conversion of next channel.

8 – Sample for time specified by SAMC<4:0>.

♥ 2007 Microchip Technology Inc.

Preliminary

DS70283B-page 273

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

TABLE 23-42: ADC CONVERSION (10-BIT MODE) TIMING REQUIREMENTS

			Standard Operating Conditions: 3.0V to 3.6V
AC CHARACTERISTICS			(unless otherwise stated)
AC CHARACTERISTICS			Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
			Operating temperature -40°C ≤ TA ≤ +85°C for Industrial
					-40°C ≤ TA ≤ +125°C for Extended
Param	Symbol	Characteristic	Min.	Typ(1)	Max.	Units	Conditions
No.

		Clock Parameters
AD50	TAD	ADC Clock Period	76	—	—	ns
AD51	tRC	ADC Internal RC Oscillator Period	—	250	—	ns
		Conversion Rate
AD55	tCONV	Conversion Time	—	12 TAD	—	—
AD56	FCNV	Throughput Rate	—	—	1.1	Msps
AD57	TSAMP	Sample Time	2 TAD	—	—	—
		Timing Parameters
AD60	tPCS	Conversion Start from Sample	—	1.0 TAD	—	—	Auto-Convert Trigger
		Trigger(1)					not selected
AD61	tPSS	Sample Start from Setting	0.5 TAD	—	1.5 TAD	—	—
		Sample (SAMP) bit(1)
AD62	tCSS	Conversion Completion to	—	0.5 TAD	—	—	—
		Sample Start (ASAM = 1)(1)
AD63	tDPU	Time to Stabilize Analog Stage	1	—	5	μs	—
		from ADC Off to ADC On(1)
Note 1:	These parameters are characterized but not tested in manufacturing.

2:Because the sample caps will eventually lose charge, clock rates below 10 kHz may affect linearity performance, especially at elevated temperatures.

DS70283B-page 274

Preliminary

♥ 2007 Microchip Technology Inc.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

24.0PACKAGING INFORMATION

24.1Package Marking Information

28-Lead SPDIP

XXXXXXXXXXXXXXXXX

YYWWNNN

28-Lead SOIC

XXXXXXXXXXXXXXXXXXXX

YYWWNNN

28-Lead QFN

Example

dsPIC33FJ32MC 202-E/SP e3

0730235

Example

dsPIC33FJ32MC 202-E/SO e3

0730235

Example

XXXXXXXX	33FJ32MC
XXXXXXXX	202EML	e3
YYWWNNN
	0730235
44-Lead QFN	Example

XXXXXXXXXX		dsPIC33FJ32
XXXXXXXXXX		MC204-E/ML e3
XXXXXXXXXX		0730235
YYWWNNN		0730235
YYWWNNN

44-Lead TQFP

XXXXXXXXXX

YYWWNNN

Example

dsPIC33FJ

32MC204

-E/PT e3

0730235

Legend: XX...X	Customer-specific information
Y	Year code (last digit of calendar year)
YY	Year code (last 2 digits of calendar year)
WW	Week code (week of January 1 is week ‘01’)
NNN	Alphanumeric traceability code
e3	Pb-free JEDEC designator for Matte Tin (Sn)
*	This package is Pb-free. The Pb-free JEDEC designator ( e3 )
	can be found on the outer packaging for this package.

Note: If the full Microchip part number cannot be marked on one line, it is carried over to the next line, thus limiting the number of available characters for customer-specific information.

♥ 2007 Microchip Technology Inc.

Preliminary

DS70283B-page 275

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

24.2Package Details

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

NOTE 1

				E1
1	2	3
		D
						E
A				A2
					L	c
						c
A1		b1
		b	e			eB
			Units		INCHES
			Dimension Limits	MIN	NOM	MAX
		Number of Pins	N		28
		Pitch	e		.100 BSC
		Top to Seating Plane	A	–	–	.200
		Molded Package Thickness	A2	.120	.135	.150
		Base to Seating Plane	A1	.015	–	–
		Shoulder to Shoulder Width	E	.290	.310	.335
		Molded Package Width	E1	.240	.285	.295
		Overall Length	D	1.345	1.365	1.400
		Tip to Seating Plane	L	.110	.130	.150
		Lead Thickness	c	.008	.010	.015
		Upper Lead Width	b1	.040	.050	.070
		Lower Lead Width	b	.014	.018	.022
		Overall Row Spacing §	eB	–	–	.430

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.§ Significant Characteristic.

3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4.Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-070B

DS70283B-page 276

Preliminary

♥ 2007 Microchip Technology Inc.

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging
		D
N
		E
		E1
NOTE 1
1	2	3
		e
		b

Units

MILLMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

Pitch

1.27 BSC

Overall Height

–

2.65

Molded Package Thickness

2.05

–

Standoff §

0.10

–

0.30

Overall Width

10.30 BSC

Molded Package Width

7.50 BSC

Overall Length

17.90 BSC

Chamfer (optional)

0.25

–

0.75

Foot Length

0.40

–

1.27

Footprint

1.40 REF

Foot Angle Top

0°

–

8°

Lead Thickness

0.18

–

0.33

Lead Width

0.31

–

0.51

Mold Draft Angle Top

5°

–

15°

Mold Draft Angle Bottom

5°

–

15°

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.§ Significant Characteristic.

3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4.Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-052B

♥ 2007 Microchip Technology Inc.

Preliminary

DS70283B-page 277

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304

28-Lead Plastic Quad Flat, No Lead Package (ML) – 6x6 mm Body [QFN] with 0.55 mm Contact Length

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

D	EXPOSED		D2
D			D2

		PAD
		PAD

	E
	E2				b
	E2
	2	2
		2
	1	1			K
		1			K
	N		N
	NOTE 1				L
					L
TOP VIEW				BOTTOM VIEW
	A
A3	A1
	A1
	Units			MILLIMETERS
	Dimension Limits		MIN	NOM	MAX
Number of Pins	N			28
Pitch	e			0.65 BSC
Overall Height	A		0.80	0.90	1.00
Standoff	A1		0.00	0.02	0.05
Contact Thickness	A3			0.20 REF
Overall Width	E			6.00 BSC
Exposed Pad Width	E2		3.65	3.70	4.20
Overall Length	D			6.00 BSC
Exposed Pad Length	D2		3.65	3.70	4.20
Contact Width	b		0.23	0.30	0.35
Contact Length	L		0.50	0.55	0.70
Contact-to-Exposed Pad	K		0.20	–	–

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.Package is saw singulated.

3.Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-105B

DS70283B-page 278

Preliminary

♥ 2007 Microchip Technology Inc.

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