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!

Note

• This PDF catalogeaise•P downloadedadr

rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope

rating,co., ltdsoldTherefore,ring,.

mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.

without advance notice. Please check with our

C02E.pdf

 

sales

or

 

.

 

 

 

 

!Note

 

 

 

 

 

 

 

 

 

representativess• Th catalogproductnlyhas engineerscaltyp

spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

 

 

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

07.2.6

Notice

Notice (Soldering and Mounting)

1.Construction of Board Pattern

After installing chips, if solder is excessively applied to the circuit board, mechanical stress will cause destruction resistance characteristics to lower. To prevent this, be extremely careful in determining shape and dimension before designing the circuit board diagram.

Construction and Dimensions of Pattern (Example)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Flow Soldering

 

 

Chip Capacitor

 

 

 

 

Slit

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Solder Resist

LgW

a

b

c

 

 

 

 

 

 

 

 

 

 

 

 

 

c

 

 

 

 

 

 

 

 

1.6g0.8

0.6-1.0

0.8-0.9

0.6-0.8

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0g1.25

1.0-1.2

0.9-1.0

0.8-1.1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

d

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3.2g1.6

2.2-2.6

1.0-1.1

1.0-1.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

W Flow soldering : 3.2g1.6 or less available.

b

a

Land

 

 

 

 

 

 

 

 

 

Reflow Soldering

 

 

 

 

 

 

 

 

 

 

 

 

Preparing slit helps flux

 

LgW

a

b

c

d

e

 

1.6g0.8

0.6-0.8

0.6-0.7

0.6-0.8

-

-

cleaning and resin coating on

 

the back of the capacitor.

 

2.0g1.25

1.0-1.2

0.9-1.0

0.8-1.1

-

-

 

 

 

 

3.2g1.6

2.2-2.4

0.8-0.9

1.0-1.4

1.0-2.0

3.2-3.7

 

 

 

 

3.2g2.5

2.0-2.4

1.0-1.2

1.8-2.3

1.0-2.0

4.1-4.6

 

 

 

 

4.5g2.0

2.8-3.4

1.2-1.4

1.4-1.8

1.0-2.8

3.6-4.1

 

 

 

 

4.5g3.2

2.8-3.4

1.2-1.4

2.3-3.0

1.0-2.8

4.8-5.3

 

 

 

 

5.7g2.8

4.0-4.6

1.4-1.6

2.1-2.6

1.0-4.0

4.4-4.9

 

 

 

 

5.7g5.0

4.0-4.6

1.4-1.6

3.5-4.8

1.0-4.0

6.6-7.1

 

 

 

 

 

 

 

 

 

(in mm)

Land Layout to Prevent Excessive Solder

 

 

 

 

 

 

 

 

 

Mounting Close to a Chassis

Mounting with Leaded Components

Mounting Leaded Components Later

 

 

d1

 

 

Lead Wire Connected

 

 

Soldering Iron

 

 

Chassis

 

 

to a Part Provided

 

 

Lead Wire of

 

 

 

 

with Lead Wires.

 

 

Component to be

 

 

Solder (Ground solder)

 

 

 

 

 

Connected Later.

Examples of

 

 

 

 

 

 

 

 

 

Prohibition

 

 

 

 

 

 

 

 

 

 

 

Adhesive

 

 

 

 

 

 

 

 

 

Base board

in section

 

 

in section

 

 

in section

 

 

Land Pattern

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

d2

 

 

Solder Resist

 

 

 

 

 

 

d1<d2

 

 

 

 

Solder Resist

 

Examples of

 

 

 

 

 

 

 

 

 

Improvements

 

Solder Resist

 

 

 

 

 

 

 

by the Land

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Division

 

 

 

 

 

 

 

 

 

 

 

 

in section

 

 

in section

 

 

in section

 

 

 

 

 

 

 

 

Continued on the following page.

23

145

!

Note

• This PDF catalogeaise•P downloadedadr

rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope

rating,co., ltdsoldTherefore,ring,.

mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.

without advance notice. Please check with our

C02E.pdf

 

sales

or

 

.

 

 

 

 

!Note

 

 

 

 

 

 

 

 

 

representativess• Th catalogproductnlyhas engineerscaltyp

spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

 

 

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

07.2.6

Notice

Continued from the preceding page.

2. Mounting of Chips

Thickness of adhesives applied

Keep thickness of adhesives applied (50-105 m or more) to reinforce the adhesive contact considering the thickness of the termination or capacitor (20-70 m) and the land pattern (30-35 m).

Mechanical shock of the chip placer

When the positioning claws and pick-up nozzle are worn, the load is applied to the chip while positioning is concentrated in one position, thus causing cracks, breakage, faulty positioning accuracy, etc.

Careful checking and maintenance are necessary to prevent unexpected trouble.

An excessively low bottom dead point of the suction nozzle imposes great force on the chip during mounting, causing cracked chips. Please set the suction nozzle's bottom dead point on the upper surface of the board.

3. Soldering

(1) Limit of losing effective area of the terminations and conditions needed for soldering.

Depending on the conditions of the soldering temperature and/or immersion (melting time), effective areas may be lost in some part of the terminations.

To prevent this, be careful in soldering so that any possible loss of the effective area on the terminations will securely remain at a maximum of 25% on all edge length A-B-C-D-A of part with A, B, C, D, shown in the Figure below.

A

B

D

Termination

C

(2) Flux

Please use it after confirming there is no problem in the reliability of the product beforehand with the intended equipment. The residue of flux might cause a decrease in nonconductivity and the corrosion of an external electrode, etc.

Continued on the following page.

23

146

!

Note

• This PDF catalogeaise•P downloadedadr

rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope

rating,co., ltdsoldTherefore,ring,.

mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.

without advance notice. Please check with our

C02E.pdf

 

sales

or

 

.

 

 

 

 

!Note

 

 

 

 

 

 

 

 

 

representativess• Th catalogproductnlyhas engineerscaltyp

spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

 

 

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

07.2.6

Notice

Continued from the preceding page.

4.Cleaning

Please confirm there is no problem in the reliability of the product beforehand when cleaning it with the intended equipment.

The residue after cleaning it might cause the decrease in the surface resistance of the chip and the corrosion of the electrode part, etc. As a result it might cause reliability to deteriorate. Please confirm beforehand that there is no problem with the intended equipment in ultrasonic cleansing.

5.Resin Coating

Please use it after confirming there is no influence on the product with a intended equipment beforehand when the resin coating and molding.

A cracked chip might be caused at the cooling/heating cycle by the amount of resin spreading and/or bias thickness.

The resin for coating and molding must be selected as the stress is small when stiffening and the hygroscopic is low as possible.

Rating

1.Capacitance change of capacitor

(1)In case of X7R char.

Capacitors have an aging characteristic, whereby the capacitor continually decreases its capacitance slightly if the capacitor is left on

for a long time. Moreover, capacitance might change greatly depending on the surrounding temperature or an applied voltage. So, it is not likely to be suitable for use in a time constant circuit.

Please contact us if you need detailed information.

(2) In case of any char. except X7R

Capacitance might change a little depending on the surrounding temperature or an applied voltage. Please contact us if you intend to use this product in a strict time constant circuit.

2.Performance check by equipment

Before using a capacitor, check that there is no problem in the equipment's performance and the specifications.

Generally speaking, CLASS 2 (X7R char.) ceramic capacitors have voltage dependence characteristics and temperature dependence characteristics in capacitance. So, the capacitance value may change depending on the operating condition in the equipment. Therefore, be sure to confirm the apparatus performance of receiving influence in a capacitance value change of a capacitor, such as leakage current and noise suppression characteristics.

Moreover, check the surge-proof ability of a capacitor in the equipment, if needed, because the surge voltage may exceed specific value by the inductance of the circuit.

23

147

!

Note

• This PDF catalog• Pleaseis downloadedread rating andfrom!theCAUTIONwebsite(forof Muratastorage,Manufacturingoperating, rating,co. ltdsoldering,. Therefore,mountingit’s specificationsand handling)areinsubjectthis catalogto changeto preventor oursmokingproductsand/orin it mayburning,be discontinuedtc.

without advance notice. Please check with our

C02E.pdf

 

sales representatives or product engineers before ordering.

 

 

!Note

 

 

 

 

• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

 

 

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

07.2.6

ISO 9001 Certifications

■ Qualified Standards

The products listed here have been produced by ISO 9001 certified factory.

Plant

Fukui Murata Mfg. Co., Ltd.

Izumo Murata Mfg. Co., Ltd.

Okayama Murata Mfg. Co., Ltd.

Murata Electronics Singapore (Pte.) Ltd.

Murata Amazonia Industria E Comercio Ltda.

Suzhou Murata Electronics Co., Ltd.

Beijing Murata Electronics Co., Ltd.

148

!Note • This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

C02E.pdf

07.2.6

Note:

1.Export Control

<For customers outside Japan>

No muRata products should be used or sold, through any channels, for use in the design, development, production, utilization, maintenance or operation of, or otherwise contribution to (1) any weapons (Weapons of Mass Destruction (nuclear, chemical or biological weapons or missiles) or conventional weapons) or (2)

goods or systems specially designed or intended for military end-use or utilization by military end-users. <For customers in Japan>

For products which are controlled items subject to the “Foreign Exchange and Foreign Trade Law” of Japan, the export license specified by the law is required for export.

2.Please contact our sales representatives or product engineers before using the products in this catalog for the applications listed below, which require especially high reliability for the prevention of defects which might directly damage a third party's life, body or property, or when one of our products is intended for use in applications other than those specified in this catalog.

q Aircraft equipment

w Aerospace equipment

e Undersea equipment

r Power plant equipment

t Medical equipment

y Transportation equipment (vehicles, trains, ships, etc.)

u Traffic signal equipment

i Disaster prevention / crime prevention equipment

o Data-processing equipment !0Application of similar complexity and/or reliability requirements to the applications listed above

3.Product specifications in this catalog are as of July 2006. They are subject to change or our products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering. If there are any questions, please contact our sales representatives or product engineers.

4.Please read rating and CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

5.This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

6.Please note that unless otherwise specified, we shall assume no responsibility whatsoever for any conflict or dispute that may occur in connection with the effect of our and/or a third party's intellectual property rights and other related rights in consideration of your use of our products and/or information described or contained in our catalogs. In this connection, no representation shall be made to the effect that any third parties are authorized to use the rights mentioned above under licenses without our consent.

7.No ozone depleting substances (ODS) under the Montreal Protocol are used in our manufacturing process.

http://www.murata.com/

Head Office

International Division

1-10-1, Higashi Kotari, Nagaokakyo-shi, Kyoto 617-8555, Japan

3-29-12, Shibuya, Shibuya-ku, Tokyo 150-0002, Japan

Phone: 81-75-951-9111

Phone: 81-3-5469-6123 Fax: 81-3-5469-6155 E-mail: intl@murata.co.jp

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