Добавил:

Upload Опубликованный материал нарушает ваши авторские права? Сообщите нам.

Вуз:

Национальный университет Львовская политехника

Предмет:

[НЕСОРТИРОВАННОЕ]

Файл:

Розрахункова СЗіВІ / Розрахункова робота / Резистори, конденсатори, індуктивності / c02e13.pdf

Скачиваний:

Добавлен:

12.02.2016

Размер:

2.59 Mб

Скачать

☆

<<< < Предыдущая 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1516 / 2516 17 18 19 20 21 22 23 24 25 > Следующая >>>

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Reference Data

1. Solderability

(1) Test Method

Subject the chip capacitor to the following conditions. Then apply flux (an ethanol solution of 25% rosin) to the chip and dip it in 230D eutectic solder for 2 seconds. Conditions:

Expose prepared at room temperature (for 6 months and 12 months, respectively)

Prepared at high temperature (for 100 hours at 85D) Prepared left at high humidity (for 100 hours under 90%RH to 95%RH at 40D)

Table 1

(2) Test Samples

GRM21 : Products for flow/reflow soldering.

(3) Acceptance Criteria

With a 60-power optical microscope, measure the surface area of the outer electrode that is covered with solder.

(4) Results

Refer to Table 1.

Sample	Initial State	Prepared at Room Temperature		Prepared at High	Prepared at High Humidity
Sample	Initial State	6 months	12 months	Temperature for	for 100 Hours at 90 to
		6 months	12 months	100 Hours at 85D	95% RH and 40D
GRM21 for flow/reflow soldering	95 to 100%	95 to 100%	95%	90 to 95%	95%

2.Board Bending Strength for Solder Fillet Height

(1)Test Method

Solder the chip capacitor to the test PCB with the amount of solder paste necessary to achieve the fillet heights. Then bend the PCB using the method illustrated and measure capacitance.

			Capacitor		20	50	Pressurizing
							Speed : 1.0mm/sec.
						Pressurize
13				Supporting	R230			Note : The material of pressure application jig and
13	45		45	Supporting				support is the quenched metal.
	45		45	Base				(hardness HB 183-255 or superhardness
	,QRU¢£¶100							HRA90 or more)
							Flexure
								Thickness
	ST§•W®VYZ]ß™´Æ			1.65	Capacitance Meter			Thickness
	1.0	1.2		1.65
40					Solder Amount			Larger Fillet.
								Fillet up to Chip
				4.0	1.6
	Material : GlassX[\©¨Epoxy
	: Copper Foil (0.35mm thick)
	: Solder Resist							(in mm)
								(in mm)

(2) Test Samples

GRM21: 5C/R7/F5 Characteristics T=0.6mm

(3) Acceptance Criteria

Products should be determined to be defective if the change in capacitance has exceeded the values specified in Table 2.

Table 2

1 Characteristics	Change in Capacitance
5C	Within T5% or T0.5pF, whichever is greater
R7	Within T12.5%
F5	Within T20%

Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Reference Data

Continued from the preceding page.

(4) Results

	GRM21 5C (T=0.6)
	100
(%)	80			Fillet up to Chip	(%)
Rate				Fillet up to Chip	Rate
Rate	60			Thickness	Rate
Survival	40	Larger Fillet			Survival
		Larger Fillet

	20
	0
	0	2	4	6	8
			Flexure (mm)
	GRM21 F5 (T=0.6)
	100
(%)	80			Fillet up to Chip
Rate				Fillet up to Chip
Rate	60			Thickness
Survival	40	Larger Fillet
	40

	20
	0
	0	2	4	6	8
			Flexure (mm)

GRM21 R7 (T=0.6)

100
100
80
80			Fillet up to Chip
			Fillet up to Chip
60			Thickness
60
40
40	Larger Fillet
	Larger Fillet
20
20
0
0	2	4	6	8
		Flexure (mm)

3. Temperature Cycling for Solder Fillet Height
(1) Test Method		[Temperature Cycling]
Solder the chips to the substrate of various test fixtures		[Temperature Cycling]
Solder the chips to the substrate of various test fixtures
using sufficient amounts of solder to achieve the required				+125D						13
fillet height. Then subject the fixtures to the cycle										13
illustrated below 200 times.		Room Temperature							Time (min.)
illustrated below 200 times.

				-55D
				-55D
					5	30	5	30
					5	30	5	30


q Solder Amount		[Solder Amount]
Alumina substrates are typically designed for reflow		[Solder Amount]
Alumina substrates are typically designed for reflow									Glass Epoxy
soldering.		Substrate			Alumina				Glass Epoxy
soldering.		Substrate			Alumina				or Paper Phenol
Glass epoxy or paper phenol substrates are typically									or Paper Phenol
Glass epoxy or paper phenol substrates are typically							T0.7T 0.5T
used for flow soldering.		SolderAmount	q							1.6T1.3T T
Paper phenol	(Thickness: 1.64mm)	SolderAmount	e							1.6T1.3T T
w Material
Alumina	(Thickness: 0.64mm)		w
Glass epoxy	(Thickness: 1.64mm)
		Solder to be used				6Z4 Eutectic solder
		Solder to be used				6Z4 Eutectic solder


e Land Dimension		[Land Dimension]
		[Land Dimension]
						Land Pattern
		1.5					Alumina		Ag/Pd=72/28
							Substrate		Thickness: 10 to 12 m
			1.5	1.2	1.5		Glass Epoxy
							Substrate		Cu
				(in mm)					Cu
				(in mm)					Thickness: 35
							Paper Phenol		Thickness: 35	m
							Paper Phenol
							Substrate
								Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Reference Data

Continued from the preceding page.

(2) Test Samples

GRM21 5C/R7/F5 Characteristics T=0.6mm

(3) Acceptance Criteria

Products are determined to be defective if the change in capacitance has exceeded the values specified in Table 3.

Table 3

Characteristics					Change in Capacitance
	5C		Within T2.5% or T0.25pF, whichever is greater

	R7		Within T7.5%

	F5		Within T20%
(4) Results
									Alumina Substrate (Thickness 0.64mm)
		GRM21 5C (T=0.6)									GRM21 R7 (T=0.6)
	100									100
AccumulatedPer-	Defectivecent(%)	80							AccumulatedPer-	Defectivecent(%)	80						e
AccumulatedPer-	Defectivecent(%)	60							AccumulatedPer-	Defectivecent(%)	60						e
		60									60
		40									40
		20						e			20						w
		0						e			0						w
		0						qw			0						q
		0	50	100		150	200				0	50	100		150	200
					Number of Cycles									Number of Cycles

		GRM21 F5 (T=0.6)
	100
AccumulatedPer-	Defectivecent(%)	80					e
AccumulatedPer-	Defectivecent(%)	60					e
		40					w
		20					w
		20
		0					q
		0	50	100	150	200
					Number of Cycles

GRM21 5C (T=0.6)

	100
AccumulatedPer-	Defectivecent(%)	80
AccumulatedPer-	Defectivecent(%)	60
		40
		20
		0				e	qw
		0					qw
		0	50	100	150	200
					Number of Cycles

Glass Epoxy Substrate (Thickness 1.6mm)

GRM21 R7 (T=0.6)

	100
AccumulatedPer-	Defectivecent(%)	80
AccumulatedPer-	Defectivecent(%)	60
		40
		20					e
		0					qw
		0	50	100	150	200
					Number of Cycles

Accumulated Per-

GRM21 F5 (T=0.6)

100
(%)	80
Defective	60
	40
cent	20					e
cent	0					qw
	0	50	100	150	200
				Number of Cycles

Paper Phenol Substrate (Thickness 1.6mm)

GRM21 5C (T=0.6)

	100
AccumulatedPer-	Defectivecent(%)	80
AccumulatedPer-	Defectivecent(%)	60
		40
		20
		0					qwe
		0	50	100	150	200
					Number of Cycles

GRM21 R7 (T=0.6)

	100
AccumulatedPer-	Defectivecent(%)	80
AccumulatedPer-	Defectivecent(%)	60
		40
		20
		0				e	qw
		0					qw
		0	50	100	150	200
					Number of Cycles

		GRM21 F5 (T=0.6)
	100
Accumulated Per-	cent Defective (%)	80
		60
		40
		20
		0				e	qw


		0	50	100	150	200
					Number of Cycles

Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Continued from the preceding page.

4. Board Bending Strength for Board Material

(1) Test Method

Solder the chip to the test board. Then bend the board using the method illustrated below, to measure capacitance.

	Capacitor
45	45	Supporting
		Base

1.0	1.2	1.65
	1.2
40
		4.0	1.6
		100

ST§•±`: Copper Foil (0.035mm´®ßZWVthick)

: Solder Resist

(2) Test Samples

GRM21 5C/R7/F5 Characteristics T=0.6mm typical

(3) Acceptance Criteria

Products should be determined to be defective if the change in capacitance has exceeded the values specified in Table 4.

Table 4

Characteristics	Change in Capacitance
5C	Within T5% or T0.5pF, whichever is greater
R7	Within T12.5%
F5	Within T20%

(4) Results

	GRM21 5C (T=0.6)
	100			Paper Phenol
				Paper Phenol
(%)	80			,QRSUVY]^¢£§¶ß™ÆØ
(%)
Rate	60	Glass Epoxy
Rate		Glass Epoxy
Survival	40
Survival	20
	0

	0	2	4	WXZ[\®©´¨	8
	0	2	4	6	8

Flexure (mm)

	GRM21 F5 (T=0.6)
	100
(%)	80			Paper Phenol
	80

Rate	60
Rate
Survival	40
	20	Glass Epoxy
	20
	0
	0	2	4	6	8

Flexure (mm)

Reference Data

20	50	Pressurizing
		Speed : 1.0mm/sec.
		Speed : 1.0mm/sec.
	Pressurize

R230

Note : Material of the pressurizing jig and

the supporting base must be hardened steel (Hardness : HB183 to 255 or carbide Hardness

: HRA90 min.)

Flexure

Capacitance Meter

Solder Amount

Up to Chip

Thickness

(in mm)

	GRM21 R7 (T=0.6)
	100
	80				Paper Phenol
(%)	80
(%)
Rate	60
Rate
Survival	40
	20	Glass Epoxy
	20
	0
	0	2		4	6	8
				TWXZ[\`•®©´¨±,QRSUVY]^¢£§¶ß™ÆØ

			Flexure (mm)

Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Reference Data

Continued from the preceding page.

5. Break Strength

(1) Test Method

Place the chip on a steel plate as illustrated on the right. Increase load applied to a point near the center of the test sample.

(2) Test Samples

GRM21 5C/R7/F5 Characteristics

GRM31 5C/R7/F5 Characteristics

(3) Acceptance Criteria

Define the load that has caused the chip to break or crack, as the bending force.

	(4) Explanation
	Break strength, P, is proportionate to the square of the
	thickness of the ceramic element and is expressed as a
	curve of secondary degree.
	The formula is:
	P=	2γ WT2			(N)
	P=	3L			(N)
		3L
	W: Width of ceramic element						(mm)
	T: Thickness of element						(mm)
	L: Distance between fulcrums						(mm)
	γ: Bending stress						(N/mm2)
	(5) Results
13				GRM21
				GRM21
			140
		(N)	120				5C	R7		F5
		(N)	120				5C			F5
		Strength	100
			100
			80

		-break
			60
			60

		Bending	40
			40
			20
			20
			0

					0.4		0.8		1.2		1.6
			0		0.4		0.8		1.2		1.6
						Thickness of Ceramic Element (mm)

6. Thermal Shock

(1) Test method

After applying flux (an ethanol solution of 25% rosin), dip the chip in a solder bath (6Z4 eutectic solder) in accordance with the following

conditions:

(2) Test samples

GRM21 5C/R7/F5 Characteristics T=0.6mm typical

(3) Acceptance criteria

Visually inspect the test sample with a 60-power optical microscope. Chips exhibiting breaks or cracks should be determined to be defective.

Storage		P Pressurizing	Loading Jig End
Storage	Amplifier	speed : 2.5mm/sec.	φ1.0mm
scope		speed : 2.5mm/sec.
scope
	Load cell
		Sample
		Steel plate	P0.5mm

Chip Size

W 5C

Charac-

teristics

GRM21

1.5

1.2

300

180

160

GRM31

2.7

1.5

(in mm)

GRM31

(N)	140
(N)	120			5C
Strength

	100
	100				R7		F5
					R7
	80
break-	80
break-	60
Bending	60
Bending	40
	40
	20
	20
	0
	0	0.4	0.8			1.2		1.6
	0	0.4	0.8			1.2		1.6

Thickness of Ceramic Element (mm)

Chip Capacitor

Temperature

Dipping Speed : 25mm/sec.

Solder

Natural

Solder Bath

Cooling

25D

2 sec.

Time

Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Continued from the preceding page.

(4) Results

7. Solder Heat Resistance

(1) Test Method

qReflow soldering:

Apply about 300 m of solder paste over the alumina substrate. After reflow soldering, remove the chip and check for leaching that may have occurred on the

outer electrode.

wFlow soldering:

After dipping the test sample with a pair of tweezers in wave solder (eutectic solder), check for leaching that may have occurred on the outer electrode.

(2)Test samples

GRM21: For flow/reflow soldering T=0.6mm

(3) Acceptance criteria

The starting time of leaching should be defined as the time when the outer electrode has lost 25% of the total edge length of A-B-C-D as illustrated:

(4) Results

Reflow Soldering

D)	280
(	270
Temperature

	260
	260
	250
	250
	240
	240
Soldering	230
	230
	220
	220
	210
	0	60	120	180	240

Leaching Starting Time (sec.)

Dip Soldering

D)	280
(	270
Temperature

	260
	260
	250
	250
	240
	240
Soldering	230
	230
	220
	220
	210
	0	10	20	30	40	50	60

Leaching Starting Time (sec.)

Reference Data

(%)	100
(%)	80
Cracks	80
	60
	60
of						F5
Incidence	40					F5
Incidence

	20					R7
	20					5C
	0					5C
	0
	200	240	280	320	360
		Temperature Differential		T (D)

eDip soldering:

After dipping the test sample with a pair of tweezers in static solder (eutectic solder), check for leaching that

may have occurred on the outer electrode.

r Flux to be used: An ethanol solution of 25% rosin.

B	13
B
	D
C
	Outer Electrode

Flow Soldering

D)	280
(	270
Temperature

	260
	260
	250
	250
	240
	240
Soldering	230
	230
	220
	220
	210
	210
	0	10	20	30	40	50	60

Leaching Starting Time (sec.)

Continued on the following page.

!	Note	• This PDF catalogeaise•P downloadedadr		rating andfrom!theCAUTIONwebsite(oforMurataorage,s Manufacturingating,ope		rating,co., ltdsoldTherefore,ring,.	mounit’singspecificationsnd handling)areinsubjecthis catalochangeto to preventor oursmproductsking and/orin it mayburning,be discontinuedtc.	without advance notice. Please check with our	C02E.pdf
		sales	or		.				C02E.pdf
		!Note
			representativess• Th catalogproductnlyhas engineerscaltyp		spbeforecificatorderingons because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
		• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.							07.2.6

Reference Data

Continued from the preceding page.

8.Thermal Shock when Making Corrections with a Soldering Iron

(1) Test Method

Apply a soldering iron meeting the conditions below to the soldered joint of a chip that has been soldered to a paper phenol board, while supplying wire solder. (Note: the soldering iron tip should not directly touch the ceramic element of the chip.)

(2) Test Samples

GRM21 5C/R7/F5 Characteristics T=0.6mm

(3) Acceptance Criteria for Defects

Observe the appearance of the test sample with a 60-power optical microscope. Those units displaying any breaks or cracks are determined to be defective.

(4) Results

			GRM21 5C (T=0.6)
	(%)	100
	(%)	80
	Cracksof

		60
		60
	Incidence	40
		40
		20
		20
		0
		0
		200		240	280	320	360
				Soldering Iron Tip Temperature (D)
13			GRM21 F5 (T=0.6)
			GRM21 F5 (T=0.6)
	(%)	100
	(%)	80
	Cracksof

		60
		60
	Incidence	40
		40
		20
		20
		0
		0
		200		240	280	320	360
				Soldering Iron Tip Temperature (D)

Wire Solder	Soldering lron
Mounting Solder
	Duration of
	Touching :
	Approx. 3 sec.

Paper Phenol Substrate

Soldering Iron	Tip diameter
Ceramic heater 20W	φ3mm

GRM21 R7 (T=0.6)

(%)	100
	100
	80
Cracksof

	60
	60
Incidence	40
	40
	20
	20
	0
	0
	200	240	280	320	360

Soldering Iron Tip Temperature (D)

<<< < Предыдущая 1 2 3 4 5 6 7 8 9 10 11 12 13 14 1516 / 2516 17 18 19 20 21 22 23 24 25 > Следующая >>>

Соседние файлы в папке Резистори, конденсатори, індуктивності

#
12.02.20162.59 Mб9c02e13.pdf
#
12.02.201687.82 Кб8ccog.pdf
#
12.02.201666.58 Кб8cx5r.pdf
#
12.02.20162.37 Mб8F3102_T520.pdf
#
12.02.2016412.99 Кб8F3109_Kemet.pdf
#
12.02.2016124.27 Кб8PANASONIC Chip Resistor. weblc_qsg_res_0905.pdf