IPC-QE-605A.Printed board quality evaluation handbook.1999
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February 1999 |
IPC-QE-605A |
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G Ð PLATED-THROUGH HOLES (continued)
G±43 Plating anomaly |
G±46 Horizontal microsection |
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Pink ring |
G±44 Plating anomaly |
G±47 Horizontal microsection |
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Plating anomaly |
G±45 Plating anomaly
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IPC-QE-605A |
February 1999 |
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H Ð MACHINING
H±1 Machining inconsistencies |
H±4 Missing hole |
H±2 Slot (protruding ®bers) |
H±5 Burr (drilling) |
H±3 Rough edges |
H±6 Edge condition - burrs (routing) |
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February 1999 |
IPC-QE-605A |
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H Ð MACHINING (continued)
H±7 Nicked edge on printed contact
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February 1999 |
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J Ð FLATNESS
J±1 Twist
J±2 Bow and twist
J±3 Bow and twist
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February 1999 |
IPC-QE-605A |
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K Ð SOLDER RESIST (Mask)
K±1 Typical solder resist |
K±4 Solder resist misregistration, surface mount |
K±2 Solder resist misregistration |
K±5 Solder resist misregistration, surface mount |
K±3 Solder resist misregistration |
K±6 Solder resist blisters |
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IPC-QE-605A |
February 1999 |
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K Ð SOLDER RESIST (Mask) (continued)
K±7 Solder resist blisters/delamination |
K±10 Skip coverage - solder resist bubbles |
K±8 Flaking/peeling |
K±11 Waves/ripples/wrinkles |
K±9 Flaking/peeling |
K±12 Incomplete via tenting |
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February 1999 |
IPC-QE-605A |
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K Ð SOLDER RESIST (Mask) (continued)
K±13 Soda strawing
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IPC-QE-605A |
February 1999 |
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L Ð MARKING
L±1 Good ink marking |
L±4 Impression stamped (illegible) |
L±2 Smeared marking |
L±5 Etched marking |
L±3 Impression stamp marking |
L±6 Etched marking (missing) |
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February 1999 |
IPC-QE-605A |
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M Ð RIGID MULTILAYERS
M±1 Innerlayer image reversed |
M±4 Delamination (thermal zone) |
M±2 Wrong layup, multilayer board |
M±5 Internal laminate delamination in prepreg area |
M±3 Wrong layup, multilayer board |
M±6 Missing or discolored oxide |
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IPC-QE-605A |
February 1999 |
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M Ð RIGID MULTILAYERS (continued)
M±7 Pink ring
M±8 Pink ring
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