Embedded system engineering magazine 2006.05,06
.pdf
X-Ray vision for your designs
Discover ease of use with agilent digital debug tools
Agilent 1680 Logic Analyser
Agilent Logic Analysers Family
•Designed for occasional users and digital experts
•Fast Scope correlation with LAN cable
•Flying leads available up to 1.5 Gb/s
From the Agilent 1690AD Firewire PC plug-in logic analyser family to the 16900 modular family, you can experience exceptional ease of use, triggering and analysis capabilities.
Choose between a broad range of flexible probing solutions that will help you to resolve your tough signal integrity issues. Our ViewScope feature allows you to use a simple LAN cable to ensure ultra-fast oscilloscope waveform data import and global marker correlation with your logic analyser. You can also access 64 signals through a single FPGA debug pin thanks to the Agilent FPGA Dynamic Probe.
To see how our logic analysers, probing and application solutions save you time debugging your digital system, view product demos at www.agilent.com/find/logicdemos or call UK 07004-666 666 for more information
© Agilent Technologies, Inc. 2006
Need World Class Support?
Come to ACAL for the best Microchip Support possible!
Tel: 0118 902 9702
Email: sales@acalsemis.co.uk
www.acalsemis.co.uk
<News - Boards>
ESE Magazine May/June 06
12
Boards
System integration service
SCHROFF has expanded its system integration facilities for companies outsourcing some or all of their design and manufacturing activities.
The service is available in various levels to suit differing customer requirements. Level 0 integration covers the supply of enclosure piece parts for assembly by the customer, whereas Level 5 would be a fully integrated enclosure system including backplanes, power supplies, thermalmanagement equipment, active boards and software – all assembled, wired, tested and shipped.
www.schroff.co.uk
Pentium M COM
THE EMBEDDED ETX-PM CPU module from Diamond Point hosts a 1.8 GHz Pentium M processor. It consumes just 18W of power at 1.1 GHz for high-end embedded applications with passive cooling and conforms to the COM standard.
ETX-PM integrates cooling via a heat spreader, which provides identical thermal coupling not only for the processor variant used, but also for the entire system.
www.dpie.com
Core Duo board
THE EMB-945T embedded motherboard from Aaeon is designed for multi-media applications in PoS, medical, gaming and digital signage applications. It uses Intel processors up to the latest 2.16 GHz Core Duo.
Integrated graphics use up to 224 MB DVMT shared memory to provide a 30% improvement on previous embedded motherboards. The board supports the latest video standards, including DX9L and has an LVD/iDCT MPEG2 hardware decoder. The output options include TV-out, 18/24/36/48-bit LVDS, LCD inverter and DVI support. It includes PCI, PCI-Express and Mini PCI slots.
www.displaysolutions.ltd.uk
For a more detailed look at these stories please visit
www.esemagazine.com
Rugged boards
Fastwel has introduced the EPIC CPC800 SBC and the CPC1700 PC/104-Express CPU board. Both are designed for harsh environments with components soldered on board for shock and vibration resistance.
on the Intel Pentium M processor with
1GB of DDR SDRAM and a 32MB Solid State drive, which means that when running and OS with a compact kernel, there is no need for additional storage. There are also connectors for up to four PC/104 and PC/104+ modules.
The CPC1700 PC/104-Express is single board computer for mission critical applications. It combines the features of standard PC/104+ and also carries an Express connector onboard. It also has a Pentium M and up to 1GB of on-board memory. It will be available in two versions – for industrial (-40°C to +85°C) and for commercial (0°C to +70°C) temperature ranges.
www.fastwel.com
mode. In the P e l i C A N mode the CAN104 han dles all frame according to specification and provides
analysis functions to support diag-
nosis, system maintenance and performance optimisation.
Applications include automotive instrumentation, industrial process and machine monitorand control, test and measurement, data acquisition, vending machines, POS and ATM
systems, building and lift management. www.ampltd.com
High density single slot 3U PXI modules
Pickering Interfaces, has introduced what it claims is the world's highest density matrix in a single slot PXI module.
The 40-540 family can be used in any PXI chassis and is supported by Pickering Interfaces 60-100 LXI Modular Switching Chassis. Each switching module supports a matrix with up to 528 crosspoint switches organized as 132x4
Virtex-5 cards from Alpha Data and VMETRO
ALPHA DATA is extending the ADM-XRC series of PCI Mezzanine Cards to include platforms based on the Virtex-5 family. The first product will be released in fall 2006 and use the LX110. Supported form factors include PCI Express, PCI/PCI-X, CompactPCI, PMC and XMC and applications are thought to be radar and sonar processing, software defined radio, reconfigurable computing, telecommunication encryption/compression, image processing and electronic intelligence.
VMETRO has two board level products based on open standard form-factors includ-
ing PMC and PCI. For PCI based development platforms, VMETRO’s DEV-FPGA05, based on the Xilinx LX50 Virtex-5 FPGA, will be bundled with a software support package to allow Virtex-5 applications to be evaluated and developed at low cost. For deeply embedded applications typically found in medical imaging or aerospace and defence systems, the PMC-FPGA05D PMC module with a Virtex-5 LX110 will be available.
www.alpha-data.com
www.vmetro.com
Dual-channel radar
Curtiss-Wright Controls Embedded Computing has announced Osiris, a new high-performance, dual channel radar interface board.
It is available in PMC mezzanine card or halflength PCI card formats and is a standard-based radar signal processing solution for use in COTS VME and CompactPCI embedded systems (PMC version) or in PC-based workstations (PCI version).
Osiris supports two independent radar channels inputs at rates up to 16k samples per return from its front panel connector. Inputs supported include radar video, triggers and azimuth turning data for RADDS, ACP/ARP and other specialised formats. Additional features include dual trigger input, gain control as a function of range, range and azimuth correlation, digital filtering, a builtin test generator, dual azimuth input and interference suppression. Synchro input is supported on the PCI variant of card with the addition of an optional synchro-adaption module.
www.cwcembedded.com
Expandable AdvancedTCA blade
Artesyn’s KAT4000, is a configurable ATCA blade for telecom infrastructures. It has four AdvancedMC expansion sites, support for Gigabit Ethernet and PCI Express, and a modular Fat Pipe design that can be upgraded to support Serial RapidIO and 10Gigabit Ethernet.
A broad range of telecom infrastructure applications, including SS7/SIGTRAN signalling, media gateways, traffic processing, wireless base stations and softswitches can be served by the KAT4000.
Software support for the KAT4000 includes Carrier Grade Linux.
www.artesyn.com
Gigabit ethernet for existing backplanes
Elma is offering a route for existing CompactPCI and VME64x backplanes to use Gigabit Ethernet.
The EXPAND Overlay Kit is a simple mechanical upgrade to meet PICMG 2.16 and VITA 31.1 specifications respectively. The upgrade is performed by simply connecting the existing backplane to an expand Ethernet switch backplane via
the expand Ethernet overlay module. The module is plugged into the rear side of both backplanes, like a “bridge”, which creates the necessary point-to- point connections in a Dual-Star topology (P3 on CPCI, P0 with VME64x). Two redundant fabric slots and six node slots can be used. This new module secures investments that have been made in CPCI and VME64x technology.
www.ELMA-electronic.co.uk
</News - Boards>
</Feature>
ESE Magazine May/June 06
14
Developing embedded applications using multi-core
<Written by> Aengus Gorey, Intel Corporation </W>
Intel’s Core Duo processor is not just a new technology, but drives a platform based approach to development.
ELECTRONICS HAS often been described as part science, part art. A defining trait of an embedded design engineer is creativity, an ability to apply the
art of electronics in solving technical problems. As electronic systems increase in complexity, the embedded designer often encounters the problem of having to devote much of their design time to specifying elements of the system that
provide no unique features to the project. Providing the embedded designer with a
suite of tools that can be used to build the backbone of a system quickly and reliably allows the focus of the designers to shift towards providing innovative solutions for their application, with features that set it apart from competitors.
For the embedded designer adopting a plat- form-based design strategy requires a radical shift in thinking. Where previously, designs had been built up of a series of interrelated components assembled to meet a products specification, the platform strategy offers the designer the opportunity to apply a common nucleus across a product family. Using ‘standard’ building blocks as the foundation for a product family pose some important engineering questions.
●Does the platform scale in performance?
●What is the lifetime of a platform?
●How flexible are the platform interfaces?
●Does the platform architecture have a clear roadmap for future generations?
Intel is working on providing the designer with building blocks that are scalable and flexible, with a defined life-cycle and clear roadmaps for the future of each of a platform’s components.
The platform, as the backbone of an embedded system, must deliver more than simple convenience. A platform vendor must provide enabling technologies that with the components deliver system performance better than the individual collection of components. The Intel Core Duo processor/Mobile Intel 945GM Express chipset-based platform shows how this can be done.Enabling technologies cover two major areas, compute performance and acceleration modules.
Compute performance
In the embedded space, compute performance
targets both performance/watt and real-time response. The Intel Core microarchitecture couples the low-power features of the P6 microarchitecture, such as the shorter pipeline with some of the performance features of the Intel Netburst microarchitecture, such as advanced dynamic execution, a very deep, out-of-order speculative execution engine.
Core Multi Processing (CMP) puts multiple independent processing cores on a single die, each with their own L1 code and data caches, local APICs and thermal controls, while having a shared L2 cache, power management and bus interface.
Intel’s first multi-core processor, the Intel Core Duo is in the Mobile Intel 945GM Express chipset-based platform for the embedded market.
Acceleration modules
Simply improving processor architecture does not necessarily improve the performance of an embedded system. Intel’s Advanced Platform Technologies uses six technologies distributed across the system components on the platform. Those that have immediate benefits for the embedded designed include Core Multi Processing (CMP), Virtualization Technology and Extended Memory 64 Technology (Intel EM64T)
Core Multi Processing
CMP builds on the multiple thread support, Hyper-Threading Technology (HT Technology), in the Netburst architecture. This allowed a single processor to execute up to 2 threads at a time by using a combination of shared and duplicated resources to maximize the usage of a single execution pipeline. CMP implements multiple execution cores on the same die.
Designer can partition their application to improve performance, for example by separating out scheduled and real time tasks, or allowing the co-existence of Control and Data plane applications in a single CMP system.
Virtualization
Virtualisation has previously been implemented using a software abstraction between OS and hardware to manage multiple virtual machines. Adding virtualization technology to the proces-
sor provides hardware acceleration through virtual machine context switching in HW.
EM64T
Extended Memory 64 Technology (Intel EM64T) allows a 32 bit CPU to operate in 64 bit register mode. The 64 bit environment has been expanded to increase the available processor registers available to the processor execution engine. This will be useful where applications need to access database type structures. Having outlined some of the hardware features that an embedded designer can rely on to build a system, the final section will focus on the support, tools and software that are available to the designer.
Development tools
Intel can provide many resources, from reference hardware designs, schematics, reference platforms and development kits through schematic and layout reviews to initial hardware bring-up and OS loading. Intel’s own software development tools and compilers plug directly into many of the standard development IDEs and the Intel Integrated Performance Primitives is a suite of libraries to provide optimized access to features of the Intel architecture.
A strong third party developer network provides Intel architecture-based software solutions, be they development tools, libraries or turn-key applications.
For the debug and tweaking phase, where a designer will push to get as much performance from the system as possible, Intel has developed a number of code profiling and optimization tools such as Intel VTune Performance Analyzer, Intel Thread Checker and Intel Thread Profiler.
Conclusion
The platform approach allows embedded system designers to focus their efforts on developing innovative and novel solutions for their application space. <End/>
This is an edited version of a longer article. The longer article and other links can be found on www.esemagazine.com.
www.intel.co.uk
</Feature>
ESE Magazine May/June 06
16
Reconfigurable
microcontrollers
<Written by> John Anderson, Cyan Technology </W>
Configuring your microcontroller to match your application can cut development time and costs.
T |
removed, or even allow for the migration of an |
HE SOPHISTICATED, feature rich |
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products demanded by today’s markets |
existing design to a completely different device, |
placed a high level of pressure on the |
then a high level of cost and frustration as well |
designer of embedded applications. At the |
as risk would have been removed with subse- |
communication port settings such as baud rate, parity etc. but also more complex operating parameters such as timing details and clocking schemes for external memory devices. Normally a time consuming process, requiring high degrees of knowledge of the microcontroller register design, these parameters could be entered easily for each peripheral using a simple mouse click and selection of the appropriate settings, either from a drop down menu, or through a dialogue box. The development tool could also generate the boot code and assembler file locking the configuration into the microcontroller, as well as include associated software drivers in compilation of the application software. Furthermore the ideal tool would enable a designer to review and modify that file, and would include operational parameters like stack and heap sizes, available in fully editable and commented code. Changes to the design would then need a simple adjustment of the configuration files and recompilation of code, removing some of the risks associated with changes to external peripherals.
As the complexity of embedded designs has increased so too has the number of microcontrollers on offer
Integrated tools
The reconfigurable microcontroller offers the designer the ability to meet the challenges posed by complex, multiple, product designs which include high levels of peripheral configuration, with the lowest number of devices. Additionally, a fully integrated set of tools enables the rapid set up and integration of these devices into the product design, allowing the designer to spend more time on developing the application, and less on defining the chip.
With more peripherals and functions included in the silicon than pins available to use them
Figure 1: User friendly chip configuration. |
determined, the designer needs to set up the |
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www.cyan.com |
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<Buyer's Guide>
ESE Magazine May/June 06
Buyer's guide: High performance embedded processors
Distributors
Company name |
Web address |
Principal(s) |
2001 Electronic Components Ltd |
www.2k1.co.uk/cyan |
Cyan |
Abacus Polar |
www.abacus.co.uk |
Analog Devices. National Semiconductor, Texas Instruments |
Acal Semiconductors |
www.acalsemis.co.uk |
Microchip |
Alpha Micro Components Ltd |
www.alphamicro.net |
Luminary Micro. |
Anglia |
|
Microchip |
Arrow Electronics |
www.arrow.com |
Analog Devices, Atmel, Freescale, Microchip, National Semiconductor, Sharp, Texas Instruments |
Avnet-Memec UK |
www.avnet-memec.com |
Silicon Laboratories |
Azzurri Technology UK |
www.avnet-memec.com |
Silicon Laboratories |
Clere Electronic Components Ltd |
www.clere.com |
Ramtron International |
DT Electronics UK |
www.dtelectronics.com |
Atmel |
EBV Elektronik |
www.ebv.com/en |
Atmel, Freescale, Fujitsu, National Semiconductor, Texas Instruments |
Future Electronics |
www.futureelectronics.com |
Freescale, Microchip, National Semiconductor |
GD Technik |
www.gd-technik.com |
Atmel |
Impulse Corporation |
www.impulse-corp.co.uk |
Rabbit Semiconductor |
RS Components |
www.rswww.com |
Microchip, Texas Instruments |
Rutronik UK Ltd. |
www.rutronik.com |
Microchip, Sharp |
Silica |
www.silica.com/en |
Analog Devices, Freescale, Microchip, Sharp, Analog Devices |
Suppliers
Company name |
Sales contact name |
Sales contact e-mail |
Web site address |
Atmel Corporation |
|
european_marketing@atmel.com |
www.atmel.com |
Analog Devices |
Andrew Lanfear |
andrew.lanfear@analog.com |
www.analog.com |
ARC International |
Andy Jaros |
Andy.Jaros@arc.com |
www.arc.com |
Cyan Technology Ltd |
Paul Barwick |
sales@cyantechnology.com |
www.cyantechnology.com |
Digi International |
Tony Milne |
tony.milne@digi.com |
www.digi.com |
Freescale Semiconductor Inc. |
|
|
www.freescale.com |
Fujitsu Microelectronics Europe |
Mark Ellins |
mark.ellins@fme.fujitsu.com |
www.fme.fujitsu.com |
Luminary Micro, Inc. |
|
sales@alphamicro.net |
www.alphamicro.net |
Microchip Technology |
|
euro.enquiry@microchip.com |
www.microchip.com |
National Semiconductor |
0870 240 2171 |
europe.support@nsc.com |
www.national.com |
Rabbit Semiconductor |
Derek Dippert |
derek_dippert@digi.com |
www.rabbitsemiconductor.com |
Ramtron International Corporation |
Terry Andrews |
terry.andrews@ramtron.com |
www.ramtron.com |
Sharp Microelectronics Europe |
Gunter Wagschal |
infosme@seeg.sharp-eu.com |
www.sharp-sme.com |
Silicon Laboratories |
Phillip Miller |
phillip.miller@silabs.com |
www.silabs.com |
Tensilica, Inc. |
Tim Penhale-Jones |
tim@tensilica.com |
www.tensilica.com |
Texas Instruments |
Andy Richardson |
a-richardson@ti.com |
www.ti.com |
Cores
Company name
ARC
Tensilica
Controller family designation |
|
Bit width |
Clock speed: Max |
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|
ARC 600 |
32 |
|
400MHz |
ARC 700 |
32 |
|
533 MHz |
Xtensa 6 |
32 |
|
500 |
Xtensa LX |
32 |
|
500 |
Diamond |
32 |
|
250 |
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Power used: Standby (Min) |
Power used: Operating (Max) |
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– |
– |
– |
– |
0.11 mW per MHz (typical) |
0.3 mW per MHz (typical) |
0.11 mW per MHz (typical) |
0.3 mW per MHz ((typical) |
mW per MHz ((typical) |
0.3 mW per MHz (typical) |
Application area
Consumer |
Portable/ hand held |
Industrial |
Automotove |
Aerospace/ defence |
Telecomms |
Computing |
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λ |
λ |
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BG01
16-bit Microcontrollers
16-bit PIC24 MCUs and dsPIC® Digital Signal Controllers
Unified 16-bit Architecture
• PIC24F, low-cost entry level
• PIC24H, 40 MIPS high performance
• dsPIC30F/33F for seamless DSP integration
Low-Risk Design
• Easy migration from 8-bit MCUs
• Common core instruction set and architecture
• Peripheral and Pin compatible families
• One development tool platform for all products
• Free MPLAB® IDE Integrated Development Environment
• Other tools include C-compiler, programmer and In-Circuit Emulator
Visualise...16-bit Microcontrollers with 32-bit Performance and 8-bit Simplicity
Today’s embedded systems demand more. The 16-bit PIC® microcontroller families from Microchip give you the performance and flexibility you need with 8-bit simplicity. Pin and code compatibility lowers risk, and allows re-use of development tools, software and
hardware designs. For the most demanding applications the dsPIC digital signal controller families seamlessly integrate high-performance DSP capabilities with the PIC microcontroller core.
Over 50 PIC24 Microcontrollers and dsPIC Digital Signal Controllers sampling today. For data sheets, samples and pricing go to www.microchip.com/16bit
www.microchip.com/16bit
The Microchip name and logo, PIC, and dsPIC are registered trademarks of Microchip Technology Incorporated in the USA and other countries. All other trademarks and registered trademarks are the property of their respective owners. ©2006 Microchip Technology Inc. All rights reserved. ME154Eng/02.06
<Buyer's Guide>
ESE Magazine May/June 06
Buyer's guide – High performance embedded pr
Specification |
On-chip memory |
Company name
Atmel
Analog Devices
Cyan
Digi International
Freescale
Fujitu
Luminary Micro.
Microchip
Nat. Semi.
Rabbit
Ramtron
Sharp
Silicon
Laboratories
Texas Instruments
Name |
Bits |
speedClock |
Voltage |
Power(Min)Standby |
Operatingpower: |
|
|
|
|
|
|
||
|
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|
|
|
|
|
AT91SAM9 |
32 |
200 MHz |
1.8/3.3 |
|
|
|
SAM7S |
|
55 MHz |
|
34 uA |
32 mA |
|
32 |
3.3 |
|||||
SAM7X |
|
55 MHz |
|
38 uA |
50 mA |
|
32 |
3.3 |
|||||
SAM7XC |
|
55 MHz |
|
38 uA |
50 mA |
|
32 |
3.3 |
|||||
SAM7A3 |
|
60 MHz |
|
8.2 uA |
70 mA |
|
32 |
3.3 |
|||||
AVR |
|
20 MHz |
|
0.1 uA |
|
|
8 |
1.8-5.5 |
|
||||
AVR 32 |
|
133 MHz |
|
|
|
|
32 |
3.0-3.6 |
|
|
|||
TigerSHARC |
32 or 64 |
600 MHz |
1.2 |
|
3 W |
|
SHARC |
|
400 MHz |
|
|
|
|
32/40 |
1.2 |
|
|
|||
Blackfin ADSP-BF561 |
|
600 MHz |
|
<50 uA |
650 mW |
|
16, 32, 64 |
0.8-1.35 |
|||||
Blackfin ADSP-BF531/2 |
|
400 MHz |
|
<50 uA |
221 mW |
|
16, 32, 64 |
0.8-1.35 |
|||||
eCOG1K |
16 |
25 MHz |
3.3 |
|
|
|
eCOG1X |
|
75 MHz |
|
|
|
|
16 |
1.8/ 3.3 |
|
|
|||
eCOG1M |
|
25 MHz |
|
|
|
|
16 |
3.3 |
|
|
|||
NS7520 |
32 |
55 MHz |
3.3 |
|
500 mW |
|
NS9360 |
|
177 MHz |
|
|
639 mW |
|
32 |
3.3 |
|
||||
NS9750 |
|
200 MHz |
|
|
952 mW |
|
32 |
3,3 |
|
||||
NS9775 |
32 |
200 MHz |
3.3 |
180 mW |
2.176 W |
|
PowerQUICC III |
32 |
1.5 GHz |
1.1 |
TBD |
TBD |
|
PowerQUICC II Pro |
|
667 MHz |
|
TBD |
TBD |
|
32 |
1.2 |
|||||
PowerPC 7448 |
|
1.7GHz |
|
TBD |
TBD |
|
32 |
1.3 |
|||||
PowerPC 8641D |
|
1.5 GHz |
|
TBD |
TBD |
|
32 |
1.1 |
|||||
StarCore: MSC8144 DSP |
|
1GHz |
|
TBD |
TBD |
|
32 |
1.0 |
|||||
F2MC-8FX |
8 |
10 MHz |
3/5 |
N/A |
N/A |
|
F2MC-8L |
|
12.5 MHz |
2.7min |
N/A |
N/A |
|
8 |
||||||
F2MC-16LX |
|
25 MHz |
|
N/A |
N/A |
|
16 |
3/5 |
|||||
FR |
32 |
96 MHz |
3/5 |
N/A |
N/A |
|
Stellaris |
32 |
25 |
3.3 |
|
|
|
PIC18F |
8 |
48 MHz |
2.0-5.5 |
100 nA |
40 mA |
|
PIC24F |
|
32 MHz |
|
TBD |
TBD |
|
16 |
2.0-3.6 |
|||||
PIC24H |
|
64 MHz |
|
80 uA |
TBD |
|
16 |
3.0-3.6 |
|||||
dsPIC30F |
|
120 MHz |
|
1 uA |
146 mA |
|
16 |
2.5-5.5 |
|||||
dsPIC33F |
16 |
64 MHz |
3.0-3.6 |
80 uA |
TBD |
|
CP3000 |
16 |
24 MHz |
2.5 |
150 uA |
20 mA |
|
R2000 |
8 |
30 MHz |
5.0 |
100 uA |
4 mA |
|
R3000 |
|
54 MHz |
|
100 uA |
2 mA |
|
8 |
3.3 |
|||||
R4000 |
8 |
60 MHz |
1.8 |
N/A |
N/A |
|
VMX51C1020/1016, C900 |
8 |
25 MHz |
4.5-5.5 |
5 mA |
45 mA |
|
VRS51L2xxx,/L3xxx |
|
40 MHz |
|
1.1 mA |
27 mA |
|
8 |
3.0-3.6 |
|||||
VRS51x1xxx/5xx |
|
40 MHz |
|
6.5 mA |
20 mA |
|
8 |
3.0-5.5 |
|||||
LH7A400 / 404 |
32 |
266 MHz |
3.3 |
2 |
3 |
|
LH79524 / 525 |
|
77.4 MHz |
|
|
|
|
16-32 |
3.3 |
2 |
3 |
|||
LH79520 |
|
77.4 MHz |
|
|
|
|
32 |
3.3 |
2 |
3 |
|||
LH75401 / 411 |
16-32 |
90 MHz |
3.3 |
2 |
3 |
|
Precision Mixed-Signal |
8 |
100 MHz |
3-3.6 |
0.4 uA |
50 mA |
|
Small Form Factor |
|
25 MHz |
|
<0.1 uA |
6.6 mA |
|
8 |
2.7-3.6 |
|||||
Ethernet |
|
20 MHz |
|
|
75 mA |
|
8 |
3.1-3.6 |
|
||||
USB |
|
48 MHz |
|
<0.1 uA |
15 mA |
|
8 |
2.7-5.25 |
|||||
TMS320C54x |
16 |
160 MHz |
1.5-2.5 |
0.12 mW |
72 mW |
|
TMS320C55x |
|
300 MHz |
|
N/A |
180 mW |
|
16 |
1.8-3.3 |
|||||
TMS320C62x |
|
300 MHz |
|
N/A |
280 mW |
|
32 |
1.5-1.8 |
|||||
TMS320C64x |
|
1000 MHz |
|
0.4 uA |
1.7W |
|
16-32 |
1.1-1.4 |
Type (1) |
Min |
Max |
|
Type (2) |
|
Min |
Flash |
|
512 KB |
|
SRAM |
|
24 KB |
0 |
|
|
||||
Flash |
32 KB |
512 KB |
|
SRAM |
|
8 KB |
|
|
|||||
Flash |
128 KB |
512 KB |
|
SRAM |
|
32 KB |
|
|
|||||
Flash |
128 KB |
512 KB |
|
SRAM |
|
32 KB |
Flash |
256 KB |
256 KB |
|
SRAM |
|
16 KB |
Flash |
1 KB |
256 KB |
|
SRAM |
|
32 B |
|
|
|||||
SRAM |
32K |
32K |
|
|
|
|
|
|
|
|
|||
DRAM |
4 Mbit |
24 MBt |
|
|
|
|
SRAM |
|
3 MB |
|
ROM |
|
|
|
|
|
|
|||
Instruction SRAM |
32 KB |
32 KB |
|
L1 Data SRAM |
|
64 KB |
|
|
|||||
Instruction SRAM |
16 KB |
48 KB |
|
L1 Data SRAM |
|
32 KB |
|
|
|||||
Flash |
64 KB |
64 KB |
|
SRAM |
|
4 KB |
Flash |
128 KB |
512 KB |
|
SRAM |
|
16 KB |
Flash |
64 KB |
64 KB |
|
SRAM |
|
4 KB |
|
|
|||||
I-cache |
|
32 KB |
|
D-cache |
|
|
|
|
|
|
|||
|
|
|
|
|||
|
|
|
|
|||
|
|
|
|
|||
|
|
|
|
|||
I-cache |
|
32 KB |
|
D-cache |
|
|
I-cache |
|
32 KB |
|
D-cache |
|
|
I-cache |
|
32 KB |
|
D-cache |
|
|
|
|
|
|
|||
I-cache |
|
4x16 KB |
|
D-cache |
|
|
|
|
|
|
|||
ROM |
16 KB |
60 KB |
|
RAM |
|
512 Byte |
ROM |
4 KB |
48 KB |
|
RAM |
|
128 Byte |
|
|
|||||
ROM |
64 KB |
512 KB |
|
RAM |
|
2 KB |
|
|
|||||
ROM |
4 KB |
1088 KB |
|
RAM |
|
2 KB |
|
|
|||||
Flash |
8 KB |
16 KB |
|
SRAM |
|
2 KB |
Flash |
|
128 KB |
|
RAM |
|
256 Bytes |
Flash |
32 KB |
128 KB |
|
RAM |
|
8 KB |
|
|
|||||
Flash |
64 KB |
256 KB |
|
RAM |
|
8 KB |
|
|
|||||
Flash |
8 KB |
144 KB |
|
RAM |
|
384Bytes |
|
|
|||||
Flash |
64 KB |
256 KB |
|
RAM |
|
8 KB |
|
|
|||||
Flash |
256 KB |
256 KB |
|
SRAM |
|
32 KB |
N/A |
N/A |
N/A |
|
N/A |
|
N/A |
N/A |
N/A |
N/A |
|
N/A |
|
N/A |
N/A |
N/A |
N/A |
|
N/A |
|
N/A |
Flash |
8 KB |
56 KB |
|
|
|
|
Flash |
64 KB |
|
|
FRAM |
|
|
|
|
|
|
|||
Flash |
4 KB |
128 KB |
|
|
|
|
|
|
|
|
|||
Internal SRAM |
80 KB |
80 KB |
|
Instruction Cache |
|
8 KB |
Internal SRAM |
16 KB |
16 KB |
|
Cache |
|
8 KB |
|
|
|||||
Internal SRAM |
32 KB |
32 KB |
|
Cache |
|
8 KB |
|
|
|||||
Internal SRAM |
32 KB |
32 KB |
|
|
|
|
Flash |
64 KB |
128 KB |
|
RAM |
|
8448 Byte |
Flash |
2 KB |
8 KB |
|
RAM |
|
256 Byte |
|
|
|||||
Flash |
8 KB |
8 KB |
|
|
|
|
|
|
|
|
|||
Flash |
16 KB |
64 KB |
|
RAM |
|
1536 Byte |
|
|
|||||
ROM |
8 KB |
256 KB |
|
RAM |
|
16 KB |
L1/SRAM |
16 KB |
24 KB |
|
ROM |
|
34 KB |
|
|
|||||
L1/SRAM |
8 KB |
8 KB |
|
L2/SRAM |
|
64 KB |
L1/SRAM |
32 KB |
32 KB |
|
L2/SRAM |
|
128 KB |
BG03
