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Timing Diagrams

Figure 89. General Timings

MCLK

ECLK

Tcdel

A[31:0]

nRW

MAS[1:0],

LOCK

nM[4:0], nTRANS TBIT

nOPC

nMREQ, SEQ

Tmsh

Tmsd

nEXEC

Texh

Texd

Tcdel

Tah

Taddr

Trwh

Trwd

Tblh

Tbld

Tmdh

Tmdd

Topch

Topcd

Note: nWAIT, APE, ALE and ABE are all HIGH during the cycle shown. Tcdel is the delay (on either edge) from MCLK changing to ECLK changing.

190 Timing Diagrams

Timing Diagrams

Figure 90. ALE Address Control

MCLK

ALE

Tale

Tald

 

A[31:0], nRW, LOCK, nOPC, nTRANS, MAS[1:0]

Note: Tald is the time by which ALE must be driven LOW in order to latch the current address in phase 2. If ALE is driven low after Tald, then a new address will be latched.

Figure 91. APE Address Control

MCLK

APE

 

Taph

Taps

A[31:0],

 

nRW,

 

LOCK,

 

nOPC,

 

nTRANS,

Tald

MAS[1:0]

Figure 92. ABE Address Control

MCLK

ABE

 

 

Tabz

Tabe

Taddr

A[31:0],

 

 

nRW,

 

 

LOCK,

 

 

nOPC,

 

 

nTRANS,

 

 

MAS[1:0]

 

 

191

Figure 93. Bidirectional Data Write Cycle

MCLK

Tnen

nENOUT

Tnenh

D[31:0]

Tdout

Tdoh

Note: DBE is HIGH and nENIN is LOW during the cycle shown.

Figure 94. Bidirectional Data Read Cycle

MCLK

 

Tnen

 

nENOUT

 

D[31:0]

 

Tdis

Tdih

BL[3:0]

Tbylh

Tbyls

Note: DBE is HIGH and nENIN is LOW during the cycle shown.

192 Timing Diagrams

Timing Diagrams

Figure 95. Data Bus Control

MCLK

nENOUT

 

 

Tdbnen

Tdbnen

 

DBE

 

 

Tdbz

Tdbe

 

D[31:0]

 

 

Tdout

Tdbz

Tdoh

nENIN

 

 

 

 

Tdbe

Note: The cycle shown is a data write cycle since nENOUT was driven LOW during phase 1. Here, DBE has first been used to modify the behaviour of the data bus, and then nENIN.

Figure 96. Output 3-State Time

MCLK

 

 

TBE

 

 

A[31:0],

Ttbz

Ttbe

D[31:0],

 

 

nRW, LOCK,

 

 

nOPC,

 

 

nTRANS

 

 

MAS[1:0]

 

 

193

Figure 97. Unidirectional Data Write Cycle

MCLK

Tnen

nENOUT

Tdohu

DOUT[31:]

Tdoutu

Figure 98. Unidirectional Data Read Cycle

MCLK

Tnen

nENOUT

DIN[31:0]

Tdisu Tdihu

BL[3:0]

Tbylh

Tbyls

Figure 99. Configuration Pin Timing

MCLK

Tcth

Tcts

 

BIGEND

ISYNC

 

Tcts

Tcth

194 Timing Diagrams

Timing Diagrams

Figure 100.

Coprocessor Timing

 

 

MCLK

 

 

Tcpi

 

 

nCPI

 

 

 

Tcps

CPA, CPB

 

 

Tcpms

Tcph

nMREQ,

 

 

SEQ

 

Tcpih

Note: Normally, nMREQ and SEQ become valid Tmsd after the falling edge of MCLK. In this cycle the ARM has been busy-waiting, waiting for a coprocessor to complete the instruction. If CPA and CPB change during phase 1, the timing of nMREQ and SEQ will depend on Tcpms. Most systems should be able to generate CPA and CPB during the previous phase 2, and so the timing of nMREQ and SEQ will always be Tmsd.

Figure 101. Exception Timing

MCLK

Tabts Tabth

ABORT

Tis Tim

nFIQ, IRQ

Trs Trm

nMREQ, SEQ

Note:

Tis/Trs guarantee recognition of the interrupt (or reset) source by the corresponding clock edge. Tim/Trm guarantee non-recog-

 

nition by that clock edge. These inputs may be applied fully asynchronously where the exact cycle of recognition is unimportant.

195

Figure 102. Debug Timing

 

 

MCLK

 

 

 

Tdbgh

 

DBGACK

 

 

 

 

Tdbgd

BREAKPT

 

 

 

Tbrks

Tbrkh

DBGRQ

 

 

 

Trqs

Trqh

TERN[1:0]

 

 

Texts

Texth

 

Figure 103. Breakpoint Timing

MCLK

BREAKPT

Tbcems

nCPI, nEXEC, nMREQ, SEQ

Note: BREAKPT changing in the LOW phase of MCLK to signal a watchpointed store can affect nCPI, nEXEC, nMREQ, and SEQ in the LOW phase of MCLK.

Figure 104. TCK-ECLK Relationship

MCLK

ECLK

Tctdel

Tctdel

196 Timing Diagrams

Timing Diagrams

Figure 105. MCLK Timing

MCLK

 

Tmckl

Tmckh

nWAIT

 

Tws

 

ECLK

 

nMREQ/

 

SEQ

 

Tmsd

 

A[31:0]

 

Twh

Taddr

Note: The ARM core is not clocked by the HIGH phase of MCLK enveloped by nWAIT. Thus, during the cycles shown, nMREQ and SEQ change once, during the first LOW phase of MCLK, and A[31:0] change once, during the second HIGH phase of MCLK. For reference, ph2 is shown. This is the internal clock from which the core times all its activity. This signal is included to show how the high phase of the external MCLK has been removed from the internal core clock.

197

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© Atmel Corporation 1999.

Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s website. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life support devices or systems.

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Printed on recycled paper.

Rev. 0673B–01/99

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