Микроэлектроника / Тексты

74 Микроэлектроника: настоящее и будущее

Раздел 1. Второе занятие

75

ВТОРОЕ ЗАНЯТИЕ

Работа в аудитории

1. Проверьте домашнее задание.

1. Проверьте письменный перевод второй части основного текста.

2. Проверьте (выборочно) упражнения 1.11; 1.12; 1.13; 1.15; 1.16.

2. Проверьте, как вы запомнили слова второй части основ­ ного текста.

1.18. Переведите устно следующие речевые отрезки из второй части основного текста:

(41—45): circuit technique, the advent of microelectronic circuits, for the benefit of similarity, the invention of new techniques, cir­cuit patterns involved perform best, the transistor is a two-junction device, the term refers to the device, employed in the construction

(46—52): to provide a new manufacturing technique, to involve chang­es, the transistor is a two-junction device, the term refers to the material, base regions on each chip, array chip, fast chip, speech chip, to place on a single chip, a chip can be fitted with a number of transistors, the state of art of assembling, the upper boundary of circuit technology is marked by chips, cell array, matrix arrangement to define a shift

(53—67): the third electrode called the gate, in the common mode of operations, failure mode, in-line production mode, a new mode of integrated circuits, sensor, to sense heating, to change in a sense, dielectric waveguide, integrated circuits emerge, the limit of optical resolution, to extend power, to change in a certain extent

3. Учитесь переводить.

Текст 1.1 В

Переведите текст письменно без словаря. Время перевода — 15 минут. Значение выделенных слов вы сможете понять из контекста.

Вариант 1

Electronic Devices

The invention of the transistor triggered the rapid growth of the electronics industry. Before transistors, electronic circuits were large, bulky and unreliable, they consumed considerable power (en­ergy) and therefore generated too much heat, which contributed to the deterioration of other circuit parts and materials, such as resis­tors, capacitors and insulation. With transistors, circuits became much smaller, more efficient in the use of energy, and far more re­liable. The higher reliability of the transistor circuits compared to vacuum tube equivalents is an extremely important advantage.

The techniques used to manufacture transistors led to the de­velopment that made it possible to mass-produce very small and highly reliable electronics circuits commonly known as integrated circuits (ICs). ICs have diodes, transistors, resistors and all inter-connecting leads formed on a single piece of semiconductor material.

Вариант 2

Microelectronics

It should first be made clear what the term "microelectronics" implies. Microelectronics embraces the entire body of the electronic art which is connected with, or applied to, the realization of elec­tronic circuits, subsystems, or the entire systems from extremely small electronic devices. The terms "microelectronics" and "integrated cir­cuits" are sometimes used interchangeably, but this is not correct.

Microelectronics is a name for extremely small electronic com­ponents and circuit assemblies, made by thin-film, thick-film or semi­conductor techniques.

Микроэлектроника: настоящее и будущее

Раздел 1. Второе занятие

77

Ли integrated circuit (IС) is a special kind of microelectronics. It is a circuit that has beenfabricated as an inseparable assembly of elec­tronic elements in a single structure. It cannot be divided without de­stroying its intended electronic function. Thus, ICs come under the general category of microelectronics, but all microelectronic units are not necessarily ICs.

Текст 1.2 В

Переведите текст устно (с листа). Работа выполняется под руководством препода­вателя.

The Future of ICs

When assessing the future course of ICs, it is customary to project another order of magnitude in circuit performance through a continu­ing reduction in the feature size of the devices on chip.

However, at our current level of IС development we must face several pragmatic barriers that will require some degree of research cre­ativity to overcome. For example, the chip complexity is extrapolated to 100,000,000 transistors per chip and beyond.

However, the latest models indicate that the power level of next-generation devices will be on the order of l0mW. Thus, a chip of this extrapolated complexity with these devices would require 1000 watts of input power and a packaging system capable of dissipating such pow­er. Since these small devices would operate at reduced supply voltages, the 1000 watts of input power would require currents on the order of 200 amperes and perhaps greater on a chip that should be less than one square inch in area. This set of conditions would apply only to a high-duty cycle and high-performance design and points out that important complexity/performance trade-offs must occur.

4. Учитесь аннотировать и реферировать.

Текст 1.3 В

а) Прочитайте текст. Выявите основную информацию каждого абзаца. Запи­шите информацию на русском языке (5—6 предложений). Проверьте в ауди­тории правильность понимания.

б) Прочитайте текст еще раз и составьте краткий реферат на английском язы­ке. (Глаголы-сказуемые — основное средство выражения информации.) Ис­пользуйте следующие речевые отрезки:

...briefly surveys...

... is wide ...

... are monolithic IС and film circuits ...

... is an extension of...

... are made by forming ...

... are mounted side by side ...

... are combinations of...

Integrated Circuits

The potential of integrated circuits is so wide that in addition to replacing similar discrete component circuits they are responsible for creating a completely new technology of circuit design.

There are two basic approaches to modern microelectronics — monolithic integrated circuits and film circuits.

In monolithic ICs all circuit elements, active and passive, are simultaneously formed in a single small wafer of silicon. The ele­ments are interconnected by metallic stripes deposited onto the oxi­dized surface of the silicon wafer.

Monolithic IС technology is an extension of the diffused planar process. Active elements (transistors and diodes) and passive elements (resistors and capacitors) are formed in the silicon slice by diffusing impurities into selected regions to modify electrical characteristics, and where necessary to form p-n junctions. The various elements are designed so that all can be formed simultaneously by the same se­quence of diffusions.

Film circuits are made by forming the passive electronic com­ponent and metallic interconnections on the surface of an insulation substrate. Then the active semiconductor devices are added, usually in discrete wafer form. There are two types of film circuits, thin film and thick film.

In thin film circuits the passive components and interconnec­tion wiring are formed on glass or ceramic substrates, using evapora­tion techniques. The active components (transistors and diodes) are fabricated as separate semiconductor wafers and assembled into the circuit.

78 Микроэлектроника: настоящее и будущее

Thick film circuits are prepared in a similar manner except that the passive components and wiring are formed by silk-screen tech­niques on ceramic substrates.

There can be many instances where the microelectronic circuit may combine more than one of these approaches in a single structure, using a combination of techniques.

In multichip circuits the electronic components for a circuit are formed in two or more silicon wafers (chips). The chips are mounted side by side on a common header. Some interconnections are includ­ed on each chip, and the circuit is completed by wiring the chips to­gether with small diameter gold wire.

Hybrid ICs are combinations of monolithic and film techniques.

Active components are formed in a wafer of silicon using the pla­nar process, and the passive components and interconnection wiring pattern formed on the surface of silicon oxide which covers the wafer, using evaporation techniques.

5. Учитесь говорить.

1.19. Изложите (устно) краткое содержание одной подтемы основного текста. Подготовка — 10 минут. Каждый студент излагает содержание в течение 1 ми­нуты (5—6 предложений). Тема сообщения: "Electronics Began with the Development of the Transistor". Используйте следующие клише:

1. The evolution of electronic technology began with ...

2. The advantage of the transistor was ...

3. Early transistors were ...

4. The microelectronic technology has shrunk transistors ...

5. The performance benefit stems from ...

6. The chip density increase ...

Внеаудиторная работа

1. Подготовьтесь к контрольному переводу основного текста.

Прочитайте повторно основной текст. Подготовьтесь к выборочному опросу перевода.

2. Проверьте, знаете ли вы новые слова основного текста. Рекомендуется использовать упражнения 1.6; 1.7; 1.8; 1.16; 1.17; 1.18.