Ground

Table 1-3 Grounds

Ground Name

Description

GNDP

PLL Ground —GNDP is ground dedicated for PLL use. The connection should

be provided with an extremely low-impedance path to ground. VCCP should be

bypassed to GNDP by a 0.1 F capacitor located as close as possible to the chip

package.

GNDQ

Internal Logic Ground —GNDQ is an isolated ground for the internal processing

logic. This connection must be tied externally to all other chip ground

connections. The user must provide adequate external decoupling capacitors.

GNDA

A Ground —GNDA is an isolated ground for sections of the internal logic. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors.

GNDD

D Ground —GNDD is an isolated ground for sections of the internal logic. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors.

GNDH

Host Ground —GNDH is an isolated ground for the HI I/O drivers. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors.

GNDS

Serial Host Ground —GNDS is an isolated ground for the SHI I/O drivers. This

connection must be tied externally to all other chip ground connections. The user

must provide adequate external decoupling capacitors.

1-4

DSP56011/D

MOTOROLA