
- •FEATURES
- •PRODUCT DESCRIPTION
- •FUNCTIONAL BLOCK DIAGRAM
- •PRODUCT HIGHLIGHTS
- •ABSOLUTE MAXIMUM RATINGS
- •THERMAL CHARACTERISTICS
- •ORDERING GUIDE
- •CHIP METALLIZATION AND PINOUT
- •CHIP AVAILABILITY
- •PIN CONFIGURATIONS
- •TWO WAYS TO LOOK AT THE AD630
- •HOW THE AD630 WORKS
- •CIRCUIT DESCRIPTION
- •OTHER GAIN CONFIGURATIONS
- •SWITCHED INPUT IMPEDANCE
- •FREQUENCY COMPENSATION
- •OFFSET VOLTAGE NULLING
- •CHANNEL STATUS OUTPUT
- •APPLICATIONS: BALANCED MODULATOR
- •BALANCED DEMODULATOR
- •PRECISION PHASE COMPARATOR
- •PRECISION RECTIFIER ABSOLUTE VALUE
- •LVDT SIGNAL CONDITIONER
- •AC BRIDGE
- •LOCK-IN AMPLIFIER APPLICATIONS
- •OUTLINE DIMENSIONS
- •Revision History

AD630
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T |
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500 s/DIV
B. 200mV/DIV
T
3
C. 200mV/DIV
A. 200mV/DIV
Figure 13. AC Bridge Waveforms (1 V Excitation)
LOCK-IN AMPLIFIER APPLICATIONS
Lock-in amplification is a technique used to separate a small, narrow-band signal from interfering noise. The lock-in amplifier acts as a detector and narrow-band filter combined. Very small signals can be detected in the presence of large amounts of uncorrelated noise when the frequency and phase of the desired signal are known.
The lock-in amplifier is basically a synchronous demodulator followed by a low-pass filter. An important measure of performance in a lock-in amplifier is the dynamic range of its demodulator.
The schematic diagram of a demonstration circuit which exhibits the dynamic range of an AD630 as it might be used in a lock-in amplifier is shown in Figure 14. Figure 15 is an oscilloscope photo demonstrating the large dynamic range of the AD630. The photo shows the recovery of a signal modulated at 400 Hz from a noise signal approximately 100,000 times larger.
CLIPPED |
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C |
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BAND-LIMITED |
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WHITE NOISE |
B 16 |
5k |
AD630 |
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100R |
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15 |
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AD542 |
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10k |
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2.5k |
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1 |
20 |
A |
13 |
AD542 |
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R |
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17 2.5k |
19 |
B |
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100R |
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100dB |
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ATTENUATION |
14 |
10k |
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A |
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C |
OUTPUT |
10 |
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0.1Hz |
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LOW-PASS |
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9 |
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FILTER |
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MODULATED |
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CARRIER |
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400Hz |
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CARRIER |
PHASE |
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REFERENCE |
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Figure 14. Lock-In Amplifier
5V |
5V |
5s |
100 |
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MODULATED SIGNAL (A) |
90 |
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(UNATTENUATED) |
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ATTENUATED SIGNAL |
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PLUS NOISE (B) |
10 |
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OUTPUT |
0% |
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5mV |
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Figure 15. Lock-In Amplifier Waveforms
The test signal is produced by modulating a 400 Hz carrier with a 0.1 Hz sine wave. The signals produced, for example, by chopped radiation (i.e., IR, optical) detectors may have similar low frequency components. A sinusoidal modulation is used for clarity of illustration. This signal is produced by a circuit similar to Figure 9b and is shown in the upper trace of Figure 15. It is attenuated 100,000 times normalized to the output, B, of the summing amplifier. A noise signal that might represent, for example, background and detector noise in the chopped radiation case, is added to the modulated signal by the summing amplifier. This signal is simply band limited clipped white noise. Figure 15 shows the sum of attenuated signal plus noise in the center trace. This combined signal is demodulated synchronously using phase information derived from the modulator, and the result is low-pass filtered using a 2-pole simple filter which also provides a gain of 100 to the output. This recovered signal is the lower trace of Figure 15.
The combined modulated signal and interfering noise used for this illustration is similar to the signals often requiring a lock-in amplifier for detection. The precision input performance of the AD630 provides more than 100 dB of signal range and its dynamic response permits it to be used with carrier frequencies more than two orders of magnitude higher than in this example. A more sophisticated low-pass output filter will aid in rejecting wider bandwidth interference.
–10– |
REV. E |

AD630
OUTLINE DIMENSIONS
20-Lead Side-Brazed Ceramic Dual In-Line Package [SBDIP]
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(D-20) |
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Dimensions shown in inches and (millimeters) |
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0.005 (0.13) MIN |
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0.080 (2.03) MAX |
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20 |
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11 |
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0.300 (7.62) |
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PIN 1 |
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0.280 (7.11) |
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1 |
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10 |
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1.060 (28.92) |
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0.320 (8.13) |
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0.060 (1.52) |
0.300 (7.62) |
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0.990 (25.15) |
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0.015 (0.38) |
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0.200 (5.08) |
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MAX |
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0.150 |
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0.200 (5.08) |
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(3.81) |
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0.125 (3.18) |
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MIN |
0.015 (0.38) |
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0.023 (0.58) |
0.100 |
0.070 (1.78) |
SEATING |
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0.008 (0.20) |
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0.014 (0.36) |
(2.54) |
0.030 (0.76) |
PLANE |
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BSC
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
20-Lead Plastic Dual In-Line Package [PDIP] (N-20)
Dimensions shown in inches and (millimeters)
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0.985 (25.02) |
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0.965 (24.51) |
0.295 (7.49) |
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0.945 (24.00) |
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0.285 (7.24) |
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20 |
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11 |
0.275 (6.99) |
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1 |
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10 |
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0.325 (8.26) |
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0.310 (7.87) |
0.150 (3.81) |
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0.180 (4.57) |
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0.015 (0.38) MIN |
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0.300 (7.62) |
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MAX |
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0.135 (3.43) |
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0.120 (3.05) |
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0.150 (3.81) |
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0.130 (3.30) |
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0.100 |
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SEATING |
0.015 (0.38) |
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0.110 (2.79) |
0.022 (0.56) |
0.060 (1.52) |
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0.010 (0.25) |
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(2.54) |
0.050 (1.27) |
PLANE |
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0.018 (0.46) |
BSC |
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0.008 (0.20) |
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0.014 (0.36) |
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0.045 (1.14) |
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COMPLIANT TO JEDEC STANDARDS MO-095-AE
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
20-Terminal Ceramic Leadless Chip Carrier [LCC]
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(E-20A) |
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Dimensions shown in inches and (millimeters) |
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0.075 (1.91) |
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0.200 (5.08) |
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REF |
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0.100 (2.54) |
REF |
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0.100 (2.54) REF |
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0.064 (1.63) |
0.095 (2.41) |
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0.015 (0.38) |
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0.075 (1.90) |
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MIN |
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19 |
20 |
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3 |
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18 |
4 |
0.028 (0.71) |
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0.358 (9.09) |
0.358 |
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1 |
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0.011 (0.28) |
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0.022 (0.56) |
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0.342 (8.69) |
(9.09) |
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BOTTOM |
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SQ |
MAX |
0.007 (0.18) |
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VIEW |
0.050 (1.27) |
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R TYP |
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0.075 (1.91) |
14 |
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8 |
BSC |
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13 |
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9 |
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REF |
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45 TYP |
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0.088 (2.24) |
0.055 (1.40) |
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0.150 (3.81) |
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0.054 (1.37) |
0.045 (1.14) |
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BSC |
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETERS DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
REV. E |
–11– |

AD630
20-Lead Standard Small Outline Package [SOIC]
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Wide Body |
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(R-20) |
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Dimensions shown in millimeters and (inches) |
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13.00 (0.5118) |
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12.60 (0.4961) |
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20 |
11 |
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7.60 (0.2992) |
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7.40 (0.2913) |
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1 |
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10.65 (0.4193) |
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10 |
10.00 (0.3937) |
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2.65 (0.1043) |
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0.75 (0.0295) 45 |
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2.35 (0.0925) |
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0.30 (0.0118) |
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0.25 (0.0098) |
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0.10 (0.0039) |
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1.27 |
0.51 (0.0201) |
SEATING 0.33 (0.0130) |
8 |
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COPLANARITY |
0 |
1.27 (0.0500) |
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0.10 |
(0.0500) |
0.31 (0.0122) |
PLANE |
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0.40 (0.0157) |
BSC |
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0.20 (0.0079) |
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COMPLIANT TO JEDEC STANDARDS MS-013AC
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
Revision History
Location |
Page |
6/04—Data Sheet changed from REV. D to REV. E.
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Replaced Figure 12 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Changes to AC BRIDGE section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Replaced Figure 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Changes to LOCK-IN AMPLIFIER APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Updated OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6/01—Data Sheet changed from REV. C to REV. D. |
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Changes to SPECIFICATION TABLE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
. 2 |
Changes to THERMAL CHARACTERISTICS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
3 |
Changes to ORDERING GUIDE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
3 |
Changes to PIN CONFIGURATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
3 |
Changes to OUTLINE DIMENSIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . |
11 |
C00784–0–6/04(E)
–12– |
REV. E |