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ATtiny261/461/861

23.5System and Reset Characteristics

Table 23-3.

Reset, Brown-out and Internal Voltage Characteristics(1)

 

 

Symbol

 

Parameter

Condition

Min

Typ

Max

Units

 

 

 

 

 

 

 

 

 

 

Power-on Reset Threshold

TA = -40 - 85°C

0.7

1.0

1.4

V

 

 

Voltage (rising)

VPOT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Power-on Reset Threshold

TA = -40 - 85°C

0.6

0.9

1.3

V

 

 

 

 

Voltage (falling)(2)

 

 

 

 

Pin Threshold

 

 

 

 

 

VRST

 

RESET

VCC = 3V

0.2 VCC

 

0.9 VCC

V

 

Voltage

 

tRST

 

Minimum pulse width on

VCC = 3V

 

 

2.5

µs

 

RESET

Pin

 

 

VHYST

 

Brown-out Detector

 

 

50

 

mV

 

Hysteresis

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tBOD

 

Min Pulse Width on Brown-

 

 

2

 

µs

 

out Reset

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VBG

 

Bandgap reference voltage

VCC = 2.7V,

1.0

1.1

1.2

V

 

TA = 25°C

 

 

 

 

 

 

 

 

 

tBG

 

Bandgap reference start-up

VCC = 2.7V,

 

40

70

µs

 

time

TA = 25°C

 

 

 

 

 

 

 

IBG

 

Bandgap reference current

VCC = 2.7V,

 

15

 

µA

 

consumption

TA = 25°C

 

 

 

 

 

 

 

 

Notes: 1. Values are guidelines only. Actual values are TBD.

2. The Power-on Reset will not work unless the supply voltage has been below VPOT (falling)

Table 23-4. BODLEVEL Fuse Coding(1)

BODLEVEL [2..0] Fuses

Min VBOT

Typ VBOT

 

Max VBOT

Units

111

 

BOD Disabled

 

 

 

 

 

 

 

110

1.7

1.8

 

2.0

 

 

 

 

 

 

 

101

2.5

2.7

 

2.9

V

 

 

 

 

 

 

100

4.1

4.3

 

4.5

 

 

 

 

 

 

 

011

 

 

 

 

 

 

 

 

 

 

 

010

 

Reserved

 

 

 

 

 

 

001

 

 

 

 

 

 

 

 

 

 

 

 

 

 

000

 

 

 

 

 

 

 

 

 

 

 

Note: 1. VBOT may be below nominal minimum operating voltage for some devices. For devices where this is the case, the device is tested down to VCC = VBOT during the production test. This guarantees that a Brown-out Reset will occur before VCC drops to a voltage where correct operation of the microcontroller is no longer guaranteed.

189

2588B–AVR–11/06

23.6ADC Characteristics – Preliminary Data

Table 23-5. ADC Characteristics, Single Ended Channels. -40°C - 85°C

Symbol

Parameter

Condition

Min(1)

Typ(1)

Max(1)

Units

 

Resolution

Single Ended Conversion

 

 

10

Bits

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

 

VREF = 4V, VCC = 4V,

 

2

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

 

VREF = 4V, VCC = 4V,

 

3

 

LSB

 

Absolute accuracy (Including

ADC clock = 1 MHz

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

INL, DNL, quantization error,

 

 

 

 

 

VREF = 4V, VCC = 4V,

 

 

 

 

 

gain and offset error)

 

1.5

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

Noise Reduction Mode

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

 

VREF = 4V, VCC = 4V,

 

2.5

 

LSB

 

 

ADC clock = 1 MHz

 

 

 

 

 

 

 

 

 

 

Noise Reduction Mode

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

Integral Non-linearity (INL)

VREF = 4V, VCC = 4V,

 

1

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

Differential Non-linearity (DNL)

VREF = 4V, VCC = 4V,

 

0.5

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

Gain Error

VREF = 4V, VCC = 4V,

 

2.5

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

 

 

 

Single Ended Conversion

 

 

 

 

 

Offset Error

VREF = 4V, VCC = 4V,

 

1.5

 

LSB

 

 

ADC clock = 200 kHz

 

 

 

 

 

 

 

 

 

 

 

 

Conversion Time

Free Running Conversion

13

 

260

µs

 

 

 

 

 

 

 

 

Clock Frequency

 

50

 

1000

kHz

 

 

 

 

 

 

 

VIN

Input Voltage

 

GND

 

VREF

V

 

Input Bandwidth

 

 

38.5

 

kHz

 

 

 

 

 

 

 

VINT

Internal Voltage Reference

 

1.0

1.1

1.2

V

RAIN

Analog Input Resistance

 

 

100

 

Note: 1.

Values are preliminary.

 

 

 

 

 

190 ATtiny261/461/861

2588B–AVR–11/06

ATtiny261/461/861

23.7Parallel Programming Characteristics

Figure 23-4. Parallel Programming Timing, Including some General Timing Requirements

 

 

 

 

 

 

 

 

 

 

 

tXLWL

 

 

 

 

 

 

 

 

 

 

 

 

XTAL1

 

tXHXL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Data & Contol

 

tDVXH

 

 

 

 

tXLDX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(DATA, XA0, XA1/BS2, PAGEL/BS1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tBVPH

 

 

 

 

tPLBX

 

tBVWL

 

 

 

 

 

 

 

 

tWLBX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tWLWH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WR

 

 

 

 

tPLWL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

WLRL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

RDY/BSY

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tWLRH

Figure 23-5. Parallel Programming Timing, Loading Sequence with Timing Requirements(1)

LOAD ADDRESS

LOAD DATA

LOAD DATA

LOAD ADDRESS

(LOW BYTE)

(LOW BYTE)

(HIGH BYTE)

(LOW BYTE)

 

 

t XLXH

 

XTAL1

 

 

 

PAGEL/BS1

DATA

ADDR0 (Low Byte)

DATA (Low Byte)

DATA (High Byte)

ADDR1 (Low Byte)

XA0

XA1/BS2

Note: 1. The timing requirements shown in Figure 23-4 (i.e., tDVXH, tXHXL, and tXLDX) also apply to loading operation.

191

2588B–AVR–11/06

Figure 23-6. Parallel Programming Timing, Reading Sequence (within the Same Page) with

Timing Requirements(1)

 

 

 

 

LOAD ADDRESS

READ DATA

READ DATA

LOAD ADDRESS

 

 

 

 

(LOW BYTE)

(LOW BYTE)

(HIGH BYTE)

(LOW BYTE)

 

 

 

 

 

tXLOL

 

 

 

 

 

 

 

XTAL1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tBVDV

 

 

PAGEL/BS1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tOLDV

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OE

 

 

 

 

 

 

 

 

 

 

tOHDZ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ADDR1 (Low Byte)

 

 

 

 

 

 

 

 

 

 

DATA

ADDR0 (Low Byte)

DATA (Low Byte)

DATA (High Byte)

 

XA0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

XA1/BS2

 

 

 

 

 

 

 

 

 

 

 

 

 

Note:

1. The timing requirements shown in Figure 23-4 (i.e., tDVXH, tXHXL, and tXLDX) also apply to read-

 

 

ing operation.

 

 

 

 

 

 

192 ATtiny261/461/861

2588B–AVR–11/06

ATtiny261/461/861

Table 23-6. Parallel Programming Characteristics, VCC = 5V ± 10%

Symbol

 

 

Parameter

Min

Typ

Max

Units

 

 

 

 

 

 

 

 

 

VPP

 

 

 

Programming Enable Voltage

11.5

 

12.5

V

IPP

 

 

 

Programming Enable Current

 

 

250

μA

tDVXH

 

 

 

Data and Control Valid before XTAL1 High

67

 

 

ns

tXLXH

 

 

 

XTAL1 Low to XTAL1 High

200

 

 

ns

tXHXL

 

 

 

XTAL1 Pulse Width High

150

 

 

ns

tXLDX

 

 

 

Data and Control Hold after XTAL1 Low

67

 

 

ns

tXLWL

 

 

 

XTAL1 Low to

 

 

 

 

 

 

 

Low

0

 

 

ns

 

WR

 

 

tBVPH

 

 

 

BS1 Valid before PAGEL High

67

 

 

ns

tPHPL

 

 

 

PAGEL Pulse Width High

150

 

 

ns

tPLBX

 

 

 

BS1 Hold after PAGEL Low

67

 

 

ns

tWLBX

 

 

 

BS2/1 Hold after

 

 

 

 

 

Low

67

 

 

ns

 

WR

 

 

tPLWL

 

 

 

PAGEL Low to

 

 

 

 

 

 

Low

67

 

 

ns

 

WR

 

 

tBVWL

 

 

 

BS1 Valid to

 

 

 

 

 

Low

67

 

 

ns

 

WR

 

 

tWLWH

 

 

 

 

 

 

Pulse Width Low

150

 

 

ns

 

 

 

WR

 

 

tWLRL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Low

0

 

1

μs

 

 

 

WR

Low to RDY/BSY

 

tWLRH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

High(1)

3.7

 

4.5

ms

 

 

 

WR

Low to RDY/BSY

 

tWLRH_CE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

High for Chip Erase(1)

7.5

 

9

ms

 

 

WR

Low to RDY/BSY

 

tXLOL

 

 

 

XTAL1 Low to

 

 

 

 

 

 

Low

0

 

 

ns

 

 

 

OE

 

 

tBVDV

 

 

 

BS1 Valid to DATA valid

0

 

250

ns

tOLDV

 

 

 

 

Low to DATA Valid

 

 

250

ns

 

 

 

OE

 

 

tOHDZ

 

 

 

 

High to DATA Tri-stated

 

 

250

ns

 

 

 

OE

 

 

Note:

1.

 

tWLRH is valid for the Write Flash, Write EEPROM, Write Fuse bits and Write Lock bits

 

 

commands.

 

 

 

 

Note:

1.

 

tWLRH_CE is valid for the Chip Erase command.

 

 

 

 

193

2588B–AVR–11/06

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