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2.5 Heat transfer in cylindrical coordinates |
25 |
2.5.1 Critical radius of insulation for cylinder
Consider a cylindrical pipe of radius r and length L in the direction perpendicular to the plane of the paper. It is necessary to add insulation with thermal conductivity of k to this pipe to reduce heat transfer. In the face of it, the proposal looks like a perfect engineering solution for the problem at hand. However, as r2 increases conduction becomes “more difficult” but because the area for convection given by 2πr2L increases, the increase in conduction resistance will be offset by a decrease in convection resistance. Hence, there is an interplay of these two competing phenomena, which also suggests that there would be a particular r2 at which the total resistance is an extremum (Fig. 2.7).
The heat transfer through the cylinder is given by
Q = |
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we need to differentiate the denominator (Rtotal) in Eq. (2.57) with respect to r2 and set it to zero to determine the value of r2 at which Rtotal becomes stationary.
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FIGURE 2.7
Schematic representation of conduction in a cylinder with insulation, and convection on the outside.
26 CHAPTER 2 One-dimensional, steady state heat conduction
FIGURE 2.8
Variation of thermal resistance and heat transfer with thickness of insulation.
Alternatively we can plot Q and Rtotal against r2 and examine what happens. A qualitative variation of thermal resistance and heat transfer with the thickness of
insulation is shown in Fig. 2.8.
From r1 to rc, the total resistance keeps decreasing. This is due to the dominance of the decreasing convection resistance compared to conduction resistance in
Eq. (2.57). Beyond rc1, Rtotal increases due to the dominance of the increased conduction resistance over the decreasing convection resistance in Eq. (2.57). The result is
counterintuitive in the sense that the total resistance is a minimum at r2 = rc, and so to have an insulating effect, r2 must be much greater than rc.
2.6 Steady state conduction in a spherical shell
A spherical shell or simply a sphere is an essential geometry in heat transfer engineering that is used in a variety of applications, such as nuclear reactor waste disposal, ball bearings (solid sphere), and rocket nozzles (nose cone can have a hemispherical shape) to name a few.
Consider a spherical shell of which a cross-sectional view is shown in Fig. 2.9, along with the geometrical details and the two boundary conditions.
FIGURE 2.9
Schematic representation of a cross-sectional view of a sphere, for studying one dimensional steady conduction.
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2.6 Steady state conduction in a spherical shell |
27 |
We make the following assumptions:
1.Steady state prevails
2.T = f(r) alone
3.qv = 0 and thermo physical and transport properties (ρ, cp, k) are constant
The governing equation for this situation can be obtained by setting to zero, the terms in the general conduction equation that are not contributing to the heat transfer process in the geometry.
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(2.61)
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Boundary condition 2: At r = r2; T = T2
T1 = −rc1 + c2
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T2 = −rc1 + c2
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By solving Eq. (2.66) and (2.67), we obtain the expression for c1 and c2 as
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(2.66)
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28 CHAPTER 2 One-dimensional, steady state heat conduction
The heat transfer through the sphere can be calculated by using Fourier’s law as follows (Please recognize that A = f (r) and so we need to be cautious in evaluating Q)
dT |
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Invoking the electrical analogy, we can obtain an expression for the conduction resistance across the shell, Rcond,sphere
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It is instructive to mention that Q (At r = r1) = Q (At r = r2).
2.7 Steady state conduction in a composite wall, cylinder and sphere
2.7.1 Composite wall
A simple composite plane wall made of three materials with thermal conductivities ka, kb, with convection boundary conditions at the end wall kc and three thicknesses La, Lb, and Lc respectively is shown in Fig. 2.10, is undergoing one dimensional steady state conduction. A resistance circuit can be drawn, as shown in Fig. 2.11.
Under steady state, with no heat generation we have the following:
Q = Qconv,left = Qconduction,a = Qconduction,b = Qconduction,c = Qconv,right |
(2.75) |
This may be alternatively written as (Refer to Fig. 2.7)
Q = |
T∞1 − T1 |
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T4 − T∞2 |
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Using the Componendo-Divedendo rule, i.e., adding all the numerators and denominators respectively and equating the result to Q, we have
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2.7 Steady state conduction in a composite wall, cylinder and sphere |
29 |
FIGURE 2.10
Schematic representation of a composite wall undergoing steady state conduction.
FIGURE 2.11
Schematic representation of a resistance network for the composite wall under consideration, under heat conduction.
In Eq. (2.76b), Rtotal can be calculated as
Rtotal = Rconv1 + Ra + Rb + Rc + Rconv 2 |
(2.77) |
Eq. (2.77) is for a series connection and is much more powerful than what it appears to be. Without solving for conduction equation in three materials with two Robin conditions, we straight away solved the problem. Whenever two or more materials are kept side by side along the direction of heat transfer, their resistances are considered to be in series as shown in Fig. 2.11. The individual resistances in the composite wall are given by
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30 CHAPTER 2 One-dimensional, steady state heat conduction
Rconv2 = h1A
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An overall heat transfer coefficient, U, may now be defined as follows:
Q =UA(T −T |
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UA1 = Rtotal
In Eq. (2.84), 1/UA in general is given by,
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1 = 1 + La + Lb + Lc + 1
U h1 ka kb kc h2
(2.82)
(2.83)
(2.84)
(2.85)
(2.86)
In a practical problem, all the terms on the right hand side of Eq. (2.86) are known. Using these, the overall heat transfer coefficient, U can be determined which inturn can be used to calculate Q, which is of primary interest. Now we can get back to Eq. (2.76) and pull out all the intermediate temperatures. This approach may be termed as “Divide and Conquer” and is clean, neat and smart.
2.7.1.1 Parallel connection
A typical case of heat transfer through a parallel connection is shown in Fig. 2.12. Along the normal to the direction of heat transfer, if the materials are kept one over
FIGURE 2.12
Schematic representation of a plane wall with parallel resistances.
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2.7 Steady state conduction in a composite wall, cylinder and sphere |
31 |
FIGURE 2.13
Schematic representation of an electrical resistances network for solving a heat conduction problem with resistances in parallel.
the other, their thermal resistances are considered to be in parallel and are shown in Fig. 2.13. Let the boundary temperatures be T1 and T2 with T1 > T2, as before.
The total heat transfer through the slab can be calculated as
Q = T1 − T2 |
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2.7.1.2 Series-parallel connection
A series-parallel connection is shown in Fig. 2.14, and the corresponding resistance network is shown in Fig. 2.15. Let the temperatures at x = 0 and x = (L1 + L2 + L3) be T1 and T4 respectively with T1 > T4.
FIGURE 2.14
Schematic representation of a series parallel combination of thermal resistances.
32 CHAPTER 2 One-dimensional, steady state heat conduction
FIGURE 2.15
Schematic representation of a composite resistance network involving series and parallel resistances.
The heat transfer through the slab is given by
Q = T1 − T4
Rtotal
Rtotal = R1 + Rab + R3
In Eq. (2.90), Rab can be calculated as follows
1 = 1 + 1
Rab Ra Rb
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R1 (i.e., between T1 and T2) and R3 (i.e., between T3 and T4) can be calculated, as explained before.
Example 2.1: Consider a heat-generating chip that is 12 × 12 mm2 in cross-section. The chip is very thin and can be considered to be spatially isothermal. It is mounted on a substrate made of aluminum (k = 205 W/mK) that is 10 mm thick. The dimensions of the substrate are the same as the chip. A joint made of resin with a thickness of 0.04 mm holds the chip and the substrate together. The joint has a thermal conductivity of 2 W/mK on both ends there is a convective heat transfer for coefficient of 100 W/m2K with an ambient at 30 °C.
1.If the heat flux from the chip is 10,000 W/m2, what is the maximum temperature in the assembly, and where does it occur?
2.If the joint offers an additional resistance (known as thermal contact resistance) of 0.8 × 10−4 m2K /W, what is the maximum temperature in the assembly?
3.If a designer says that one can power the chip all the way up to a maximum of 85 °C, what is the maximum possible heat flux or power?
Solution:
Schematic representation, as given in the problem is shown in Fig. 2.16
1.When there is no thermal contact resistance, the heat flux q1 shown in the figure is given by
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2.7 Steady state conduction in a composite wall, cylinder and sphere |
33 |
FIGURE 2.16
Schematic representation of heat conduction in a chip that is under consideration in
Example 2.1. Please note that this figure is not to scale.
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2. When considering a finite thermal contact resistance
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34 CHAPTER 2 One-dimensional, steady state heat conduction
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10000 = 10Tchip − 3000 + 99Tchip − 2970.3
Tchip = 80.25 °C
As expected, the addition of contact resistance increases the temperature, but its effect in this case is negligibly small.
3. Maximum allowable heat flux
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Example 2.2: Consider a material with constant properties and no heat generation. Temperatures have been measured at a certain instant of time and have been regressed to a quadratic form as T (x, y, z) = 2x2 + 3y2 − 5z2 + 2xy − 3yz + 6xz. Using the general heat conduction equation, determine if there is any region in the body where T = f (t).
Solution:
The governing equation is
∂2 T + ∂2 T + ∂2 T = 1 ∂T ∂x2 ∂y2 ∂z2 α ∂t
4 + 6 −10 = 1 dT
α dt
∂∂Tt = 0
Since ∂T / ∂t = 0 everywhere, it is seen that transients exist nowhere. Hence, steady state prevails in the material.
