- •Task №1
- •3. Evaluation of the tangential sensitivity of the detector diode
- •4. The main similarities and differences in the functional role, structure, and parameters of microwave devices numbered 1 (detector diode) and 2 (pin diode)
- •4.1 Detector diode
- •4.1.1 The functional role of the detector diode
- •4.1.2 Structure of the detector diode
- •4.1.3 Parameters of the detector diode
- •1. Volt-ampere characteristic:
- •2. Total resistance:
- •3. Cutoff frequency:
- •4. Current sensitivity:
- •5. Tangential sensitivity:
- •6. Noise ratio:
- •4.2 Pin diode
- •4.2.1 The functional role of the pin diode
- •4.2.2 Pin diode structure
- •4.2.3 Pin diode parameters
- •1. Volt-ampere characteristic:
- •2. Transmission and locking losses:
- •3. Quality coefficient:
- •4. Turn-on time of the pin diode:
- •5. Cutoff frequency:
- •4.3 Similarities and differences of the detector diode and pin diode
- •4.3.1 Differences between the detector diode and pin diode
- •4.3.2 Similarities of the detector diode and pin diode
- •5. Description of circuit models of microwave diodes with positive dynamic resistance
- •5.1 Description of the pin diode circuit model
- •5.2 Description of the mixer diode circuit model
- •Task №2 Diodes with negative dynamic resistance.
- •1.2 Gunn diode graphs (GaAs)
- •2. Representation of the device in the form of a layered structure with different differential mobility
- •2.1 Representation of the impatt diode in the form of a layered structure with different differential mobility
- •2.2 Representation of the Gunn diode in the form of a layered structure with different differential mobility
- •Task №3 Transistors.
- •1.2 Calculation of the gate length of a field-effect transistor
- •1.3 Analysis of the obtained results of calculating the thickness of the bipolar transistor base and the gate length of the field effect transistor
- •1.4 Calculation of the angle of flight of a bipolar transistor
- •1.5 Calculation of the angle of flight of a field-effect transistor
- •2.1 Advantages and disadvantages of hemt (High Electron Mobility Transistor)
- •2.2 Advantages and disadvantages of transistors with ballistic transport
- •2.3 Calculation of the thickness of the high-alloyed hemt region
- •3.1 GaN usage trend
- •3.2 InP usage trend
- •3.3 SiC usage trend
- •3.4 Diamond (c) usage trend
- •4.1 Input and output volt-ampere characteristics of three sbgfet with the same size, doping level, but made of Si, GaN, GaAs
- •4.2 How will the characteristics change if the gate width is increased
- •6. Connection of low-frequency noise with transistor manufacturing technology
- •7. Image of a low-signal equivalent Schottky-barrier transistor circuit. Explanation of how such a scheme is better or worse than s-parameters
6. Noise ratio:
The
presence of a built-in and applied external electric field causes its
noise characteristics to differ from the noise of the equivalent
(differential) resistance of the diode at the operating point.
Usually such an excess is characterized by a parameter – the noise
ratio. It determines how many times the average square of the noise
voltage from the diode <
>
is
greater than the average square of the noise voltage <
>
from
the resistance Rd
1/(Id
Ud)
[9]:
nnoise
=
(11)
4.2 Pin diode
4.2.1 The functional role of the pin diode
PIN diodes are used for rectification, conversion and switching of high-frequency and pulse signals. The control action of such diodes is based on a change in their resistance with changes in the applied bias voltage or the level of microwave power in the path. Microwave PIN diodes are widely used to control the level and phase of microwave signals, to switch and stabilize microwave power in transmission lines, to protect radio equipment from accidental microwave pulses. Diodes designed for the centimeter, decimeter and meter ranges are divided into switching and limiting. The former is used in switching devices, modulators, phase shifters, attenuators, the latter – in power limiting and control devices and to protect input receivers. Diodes can be used for the same purpose in sealed hybrid modules [10].
4.2.2 Pin diode structure
Picture 8 – PIN diode structure
The
main feature of the PIN diode structure is the presence of a
high-resistance region of pure silicon (or germanium) between the p-
and n-regions
of the semiconductor 1 and 3 with 4 contacts of the high resistance
region of pure silicon (or germanium) 2 with extremely low
concentration of impurities (semiconductor with intrinsic
conductivity of i-type).
However, a semiconductor is really i-type,
no matter how thoroughly it is cleaned, it is almost impossible to
obtain. Therefore, really PIN structures are structures in which the
i–region
has weak hole conductivity in the case of Si
(denoted
by the p+
–
–
n+)
and
weak electronic conductivity in the case of Ge
(denoted
by1 the p+–
–
n+).
For
the manufacture of PIN diodes, p-type
silicon is more often used. The concentration of acceptors in it is
very small and amounts to 1012
- 1013
cm-3,
while
the concentration of donors in the n-region
and acceptors in the p-region
may exceed 1018
cm-3.
The
area of the i-region
ranges from fractions to units of a square millimeter with a
thickness of 60
- 400 µm.
Diodes
can be placed in a housing that is most suitable for including a
diode in a particular microwave path, but they can also be case-free
[11].
4.2.3 Pin diode parameters
1. Volt-ampere characteristic:
In the first approximation, when theoretically considered, for the volt-ampere characteristic of PIN diodes, the relations used for detector diodes are valid, namely [12]:
Picture 9 – Comparative volt-ampere characteristic of the detector diode and PIN diode
That is, for a PIN diode, the ratio is also equivalent (6):
However, there are a number of characteristic features for switching diodes. As can be seen from the volt-ampere characteristic (picture 9), the main difference between the volt-ampere characteristic of the PIN diode is the more resistive nature of the direct branch, which is quite logical due to the presence of a low-alloy i-region. For the same reason, the increase in forward current begins at high voltages, and the breakdown occurs later.
