- •Task №1
- •3. Evaluation of the tangential sensitivity of the detector diode
- •4. The main similarities and differences in the functional role, structure, and parameters of microwave devices numbered 1 (detector diode) and 2 (pin diode)
- •4.1 Detector diode
- •4.1.1 The functional role of the detector diode
- •4.1.2 Structure of the detector diode
- •4.1.3 Parameters of the detector diode
- •1. Volt-ampere characteristic:
- •2. Total resistance:
- •3. Cutoff frequency:
- •4. Current sensitivity:
- •5. Tangential sensitivity:
- •6. Noise ratio:
- •4.2 Pin diode
- •4.2.1 The functional role of the pin diode
- •4.2.2 Pin diode structure
- •4.2.3 Pin diode parameters
- •1. Volt-ampere characteristic:
- •2. Transmission and locking losses:
- •3. Quality coefficient:
- •4. Turn-on time of the pin diode:
- •5. Cutoff frequency:
- •4.3 Similarities and differences of the detector diode and pin diode
- •4.3.1 Differences between the detector diode and pin diode
- •4.3.2 Similarities of the detector diode and pin diode
- •5. Description of circuit models of microwave diodes with positive dynamic resistance
- •5.1 Description of the pin diode circuit model
- •5.2 Description of the mixer diode circuit model
- •Task №2 Diodes with negative dynamic resistance.
- •1.2 Gunn diode graphs (GaAs)
- •2. Representation of the device in the form of a layered structure with different differential mobility
- •2.1 Representation of the impatt diode in the form of a layered structure with different differential mobility
- •2.2 Representation of the Gunn diode in the form of a layered structure with different differential mobility
- •Task №3 Transistors.
- •1.2 Calculation of the gate length of a field-effect transistor
- •1.3 Analysis of the obtained results of calculating the thickness of the bipolar transistor base and the gate length of the field effect transistor
- •1.4 Calculation of the angle of flight of a bipolar transistor
- •1.5 Calculation of the angle of flight of a field-effect transistor
- •2.1 Advantages and disadvantages of hemt (High Electron Mobility Transistor)
- •2.2 Advantages and disadvantages of transistors with ballistic transport
- •2.3 Calculation of the thickness of the high-alloyed hemt region
- •3.1 GaN usage trend
- •3.2 InP usage trend
- •3.3 SiC usage trend
- •3.4 Diamond (c) usage trend
- •4.1 Input and output volt-ampere characteristics of three sbgfet with the same size, doping level, but made of Si, GaN, GaAs
- •4.2 How will the characteristics change if the gate width is increased
- •6. Connection of low-frequency noise with transistor manufacturing technology
- •7. Image of a low-signal equivalent Schottky-barrier transistor circuit. Explanation of how such a scheme is better or worse than s-parameters
4.2 How will the characteristics change if the gate width is increased
In short-gate transistors, the dependence of current on the drain voltage is more pronounced, that is, with a decrease in the gate width, the steepness increases, and with an increase in the gate width, respectively, the steepness decreases. Let 's write this formally in terms of the cutoff frequency [38]:
fc
=
=
(35)
Thus, an increase in the width of the gate entails a decrease in steepness. At the same time, an increase in the gate width leads to a decrease in the cutoff frequency.
5. Substantiation of the family of input and output volt-ampere characteristics and noise coefficient on the same graph. Let's explain why a SBGFET, despite the high electronic temperature of the media at the output, is referred to as low-noise devices
Picture 34 – A graph of the input and output volt-ampere characteristics of SBGFET, as well as a graph of the noise coefficient [39]
To describe these families of characteristics, we use the Van der Zyl formula [40]:
(36)
So, in expression (33), the parameters depending on the mode are, first of all, the drain current Id and the ratio of the diffusion coefficient to the carrier velocity D(Te)/v. It is necessary to evaluate, first of all, the change in the indicated values in the input part of the transistor, which is key for determining the noise in general.
For operating modes, when the drain current reaches saturation, the speed in the gate part of the transistor weakly depends on the gate voltage and the drain voltage. It will tend to the saturation rate. The diffusion coefficient does not change much depending on the electron temperature. Under such conditions, it follows from (33) that the lower the current, the less noise.
However, a
characteristic feature of the experimental dependence NF
f(Id)
is the presence of low noise figure at a current
(0,150,2)
.
This fact contradicts the stated position on noise reduction when the
current is reduced. The contradiction can be eliminated by taking
into account the influence of the buffer layer. When the transistor
is closed, the electrons heat up already in the initial part of the
transistor and acquire the ability to drift in the buffer layer. This
leads to a decrease in the transient conductivity (steepness), and,
accordingly, to an increase in the noise coefficient. From this point
of view, a symmetrical transistor should have the least noise, in
which there is no current leaving the substrate [40].
It is worth noting that due to the simpler and more advanced manufacturing technology, SBGFET has a smaller spread of electrical parameters. The current in them does not flow through the p-n-junctions, but between the ohmic contacts of the homogeneous medium of the channel. Due to this, SBGFET have a higher linearity of the transfer characteristic, they do not have current distribution noise, and the current density can be large, therefore, their noise level is less, the power output is greater. The electron mobility in the weak field of gallium arsenide (GaAs), from which SBGFET is made, is about 2 times higher than in silicon (Si), and instead of the capacitances of the emitter and collector junctions, the SBGFET has a relatively small capacity of the inversely displaced gate at the Schottky barrier, so they can operate at higher frequencies up to 90 - 120 GHz. Internal feedback through parasitic capacitances in the SBGFET is insignificant, amplifiers work on them more steadily in a wide frequency range. Despite the fact that the thermal conductivity of GaAs is 3 times less than that of Si, bipolar transistors are inferior to SBGFET in terms of noise coefficient already at frequencies above 1 – 1,5 GHz [40].
