- •Task №1
- •3. Evaluation of the tangential sensitivity of the detector diode
- •4. The main similarities and differences in the functional role, structure, and parameters of microwave devices numbered 1 (detector diode) and 2 (pin diode)
- •4.1 Detector diode
- •4.1.1 The functional role of the detector diode
- •4.1.2 Structure of the detector diode
- •4.1.3 Parameters of the detector diode
- •1. Volt-ampere characteristic:
- •2. Total resistance:
- •3. Cutoff frequency:
- •4. Current sensitivity:
- •5. Tangential sensitivity:
- •6. Noise ratio:
- •4.2 Pin diode
- •4.2.1 The functional role of the pin diode
- •4.2.2 Pin diode structure
- •4.2.3 Pin diode parameters
- •1. Volt-ampere characteristic:
- •2. Transmission and locking losses:
- •3. Quality coefficient:
- •4. Turn-on time of the pin diode:
- •5. Cutoff frequency:
- •4.3 Similarities and differences of the detector diode and pin diode
- •4.3.1 Differences between the detector diode and pin diode
- •4.3.2 Similarities of the detector diode and pin diode
- •5. Description of circuit models of microwave diodes with positive dynamic resistance
- •5.1 Description of the pin diode circuit model
- •5.2 Description of the mixer diode circuit model
- •Task №2 Diodes with negative dynamic resistance.
- •1.2 Gunn diode graphs (GaAs)
- •2. Representation of the device in the form of a layered structure with different differential mobility
- •2.1 Representation of the impatt diode in the form of a layered structure with different differential mobility
- •2.2 Representation of the Gunn diode in the form of a layered structure with different differential mobility
- •Task №3 Transistors.
- •1.2 Calculation of the gate length of a field-effect transistor
- •1.3 Analysis of the obtained results of calculating the thickness of the bipolar transistor base and the gate length of the field effect transistor
- •1.4 Calculation of the angle of flight of a bipolar transistor
- •1.5 Calculation of the angle of flight of a field-effect transistor
- •2.1 Advantages and disadvantages of hemt (High Electron Mobility Transistor)
- •2.2 Advantages and disadvantages of transistors with ballistic transport
- •2.3 Calculation of the thickness of the high-alloyed hemt region
- •3.1 GaN usage trend
- •3.2 InP usage trend
- •3.3 SiC usage trend
- •3.4 Diamond (c) usage trend
- •4.1 Input and output volt-ampere characteristics of three sbgfet with the same size, doping level, but made of Si, GaN, GaAs
- •4.2 How will the characteristics change if the gate width is increased
- •6. Connection of low-frequency noise with transistor manufacturing technology
- •7. Image of a low-signal equivalent Schottky-barrier transistor circuit. Explanation of how such a scheme is better or worse than s-parameters
2.2 Advantages and disadvantages of transistors with ballistic transport
If l
,
hat
is, the length of the active region is less than or equal to the
relaxation length of the pulse, then the movement of charge carriers
in the active region of semiconductor elements can occur collisibly
or with a small number of scattering acts. In the first situation, we
call the movement of charge carriers ballistic. In the second
situation, we will talk about a quasi-ballistic movement.
A ballistic transistor, as well as a bipolar transistor, has an emitter - an electron injector, a base and a collector - collector of injected electrons. However, a ballistic transistor differs in principle from a conventional bipolar transistor by the high energy level of the electrons injected into the base, as well as by the fact that it is usually unipolar (although bipolar ballistic transistors are also found). All elements of a unipolar transistor (emitter, base, collector) have the same type of conductivity, and nonequilibrium main carriers are injected into the base. This circumstance contributes to an increase in the speed of the transistor, since it allows you to choose the fastest charge carriers as working carriers and, in addition, reduces the capacitances of the emitter and collector junctions due to the absence of diffusion components associated with non-primary carriers. The speed of the transistor is determined in the same way as in BT (bipolar transistor), by the time of passage of the base electron and the product of the greatest resistance in the transistor circuit (the longitudinal resistance of the base) by the collector and emitter capacitance. The time of flight of the base is determined by the value of the initial velocity of the electrons, and in the case of a ballistic collisionless flight, it is equal to. Due to the high speed of the injected electrons, the flight time of the base in ballistic transistors on hot electrons is fractions of a picosecond. It is precisely in achieving a short time of flight of the base due to the high initial velocity of electron injection that the main idea of increasing the speed of the transistor consists [26].
Thus, diode, transistor and other semiconductor structures in the conditions of ballistic and quasi-ballistic transport can exhibit very non-trivial static and especially dynamic properties. An important feature of the ballistic and quasi-ballistic modes of operation of various semiconductor devices is that the flight time of charge carriers through the active region is small even at low voltages. With characteristic sizes of active regions slightly smaller than 1 µm, semiconductor ultrahigh-frequency devices in ballistic and quasi-ballistic transport conditions can operate at frequencies corresponding to the submillimeter wavelength range, and elements of digital circuits can have high performance. That is, the advantages are smaller dimensions, no shot noise at low temperature, lower power consumption and a higher (THz) switching frequency [26].
At the same time, one of the big disadvantages of these devices is the low operating temperature range necessary for the absence of scattering on phonons, that is, for the correct operation of the transistor.
