- •1 Introduction
- •2 Description
- •3 Functional overview
- •3.2 Memory protection unit (MPU)
- •3.3 Memories
- •3.3.1 Embedded Flash memory
- •3.3.2 Embedded SRAM
- •3.4 Boot modes
- •3.5 Power supply management
- •3.5.1 Power supply scheme
- •3.5.2 Power supply supervisor
- •3.7 Reset and clock controller (RCC)
- •3.7.1 Clock management
- •3.7.2 System reset sources
- •3.10 DMA controllers
- •3.12 Nested vectored interrupt controller (NVIC)
- •3.13 Extended interrupt and event controller (EXTI)
- •3.14 Cyclic redundancy check calculation unit (CRC)
- •3.15 Flexible memory controller (FMC)
- •3.18 Temperature sensor
- •3.22 Operational amplifiers (OPAMP)
- •3.24 Digital camera interface (DCMI)
- •3.26 JPEG Codec (JPEG)
- •3.27 Random number generator (RNG)
- •3.28 Timers and watchdogs
- •3.28.4 Basic timers TIM6 and TIM7
- •3.28.6 Independent watchdogs
- •3.28.7 Window watchdogs
- •3.28.8 SysTick timer
- •3.31 Universal synchronous/asynchronous receiver transmitter (USART)
- •3.34 Serial audio interfaces (SAI)
- •3.35 SPDIFRX Receiver Interface (SPDIFRX)
- •3.36 Single wire protocol master interface (SWPMI)
- •3.37 Management Data Input/Output (MDIO) slaves
- •3.38 SD/SDIO/MMC card host interfaces (SDMMC)
- •3.39 Controller area network (FDCAN1, FDCAN2)
- •3.41 Ethernet MAC interface with dedicated DMA controller (ETH)
- •3.43 Debug infrastructure
- •4 Memory mapping
- •5 Pin descriptions
- •6 Electrical characteristics
- •6.1 Parameter conditions
- •6.1.1 Minimum and maximum values
- •6.1.2 Typical values
- •6.1.3 Typical curves
- •6.1.4 Loading capacitor
- •6.1.5 Pin input voltage
- •6.1.6 Power supply scheme
- •6.1.7 Current consumption measurement
- •6.2 Absolute maximum ratings
- •6.3 Operating conditions
- •6.3.1 General operating conditions
- •6.3.2 VCAP external capacitor
- •6.3.5 Embedded reset and power control block characteristics
- •6.3.6 Embedded reference voltage
- •6.3.7 Supply current characteristics
- •6.3.9 External clock source characteristics
- •6.3.10 Internal clock source characteristics
- •6.3.11 PLL characteristics
- •6.3.12 Memory characteristics
- •6.3.13 EMC characteristics
- •6.3.14 Absolute maximum ratings (electrical sensitivity)
- •6.3.15 I/O current injection characteristics
- •6.3.16 I/O port characteristics
- •6.3.17 NRST pin characteristics
- •6.3.18 FMC characteristics
- •6.3.20 Delay block (DLYB) characteristics
- •6.3.22 DAC characteristics
- •6.3.23 Voltage reference buffer characteristics
- •6.3.24 Temperature sensor characteristics
- •6.3.26 Voltage booster for analog switch
- •6.3.27 Comparator characteristics
- •6.3.28 Operational amplifier characteristics
- •6.3.30 Camera interface (DCMI) timing specifications
- •6.3.32 Timer characteristics
- •6.3.33 Communication interfaces
- •7 Package information
- •7.1 LQFP144 package information
- •7.2 LQFP176 package information
- •7.3 LQFP208 package information
- •7.4 UFBGA176+25 package information
- •7.5 TFBGA240+25 package information
- •7.6 Thermal characteristics
- •7.6.1 Reference document
- •8 Ordering information
- •9 Revision history
STM32H745xI/G |
Electrical characteristics |
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3. Guaranteed by characterization results.
6.3.28Operational amplifier characteristics
Table 109. Operational amplifier characteristics
Symbol |
Parameter |
Conditions |
Min |
Typ |
Max |
Unit |
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VDDA |
Analog supply voltage |
- |
2 |
3.3 |
3.6 |
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Range |
V |
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CMIR |
Common Mode Input |
- |
0 |
- |
VDDA |
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Range |
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25°C, no load on output |
- |
- |
±1.5 |
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VIOFFSET |
Input offset voltage |
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mV |
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All voltages and |
- |
- |
±2.5 |
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temperature, no load |
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VIOFFSET |
Input offset voltage drift |
- |
- |
±3.0 |
- |
μV/°C |
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TRIMOFFSETP |
Offset trim step at low |
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common input voltage |
- |
- |
1.1 |
1.5 |
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TRIMLPOFFSETP |
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(0.1*VDDA) |
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mV |
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TRIMOFFSETN |
Offset trim step at high |
- |
- |
1.1 |
1.5 |
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common input voltage |
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TRIMLPOFFSETN |
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(0.9*VDDA) |
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ILOAD |
Drive current |
- |
- |
- |
500 |
μA |
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ILOAD_PGA |
Drive current in PGA mode |
- |
- |
- |
270 |
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CLOAD |
Capacitive load |
- |
- |
- |
50 |
pF |
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CMRR |
Common mode rejection |
- |
- |
80 |
- |
dB |
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ratio |
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Power supply rejection |
CLOAD ≤ 50pf / |
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PSRR |
ratio |
RLOAD ≥ 4 kΩ(1) at 1 kHz, |
50 |
66 |
- |
dB |
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Vcom=VDDA/2 |
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GBW |
Gain bandwidth for high |
200 mV ≤ Output dynamic |
4 |
7.3 |
12.3 |
MHz |
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supply range |
range ≤ VDDA - 200 mV |
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SR |
Slew rate (from 10% and |
Normal mode |
- |
3 |
- |
V/µs |
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90% of output voltage) |
High-speed mode |
- |
30 |
- |
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AO |
Open loop gain |
200 mV ≤ Output dynamic |
59 |
90 |
129 |
dB |
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range ≤ VDDA - 200 mV |
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φm |
Phase margin |
- |
- |
55 |
- |
° |
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GM |
Gain margin |
- |
- |
12 |
- |
dB |
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VOHSAT |
High saturation voltage |
Iload=max or RLOAD=min, |
VDDA |
- |
- |
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Input at VDDA |
−100 mV |
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mV |
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VOLSAT |
Low saturation voltage |
Iload=max or RLOAD=min, |
- |
- |
100 |
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Input at 0 V |
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DS12923 Rev 1 |
201/252 |
Electrical characteristics |
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STM32H745xI/G |
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Table 109. Operational amplifier characteristics (continued) |
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Symbol |
Parameter |
Conditions |
Min |
Typ |
Max |
Unit |
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CLOAD ≤ 50pf, |
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Normal |
RLOAD ≥ 4 kΩ, |
- |
0.8 |
3.2 |
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mode |
follower |
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tWAKEUP |
Wake up time from OFF |
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configuration |
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µs |
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state |
High |
CLOAD ≤ 50pf, |
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speed |
RLOAD ≥ 4 kΩ, |
- |
0.9 |
2.8 |
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mode |
follower |
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configuration |
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PGA gain = 2 |
−1 |
- |
1 |
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Non inverting gain error |
PGA gain = 4 |
−2 |
- |
2 |
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value |
PGA gain = 8 |
−2.5 |
- |
2.5 |
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PGA gain = 16 |
−3 |
- |
3 |
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PGA gain = 2 |
−1 |
- |
1 |
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PGA gain |
Inverting gain error value |
PGA gain = 4 |
−1 |
- |
1 |
% |
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PGA gain = 8 |
−2 |
- |
2 |
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PGA gain = 16 |
−3 |
- |
3 |
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PGA gain = 2 |
−1 |
- |
1 |
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External non-inverting gain |
PGA gain = 4 |
−3 |
- |
3 |
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error value |
PGA gain = 8 |
−3.5 |
- |
3.5 |
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PGA gain = 16 |
−4 |
- |
4 |
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PGA Gain=2 |
- |
10/10 |
- |
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R2/R1 internal resistance |
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PGA Gain=4 |
- |
30/10 |
- |
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values in non-inverting |
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PGA Gain=8 |
- |
70/10 |
- |
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PGA mode(2) |
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Rnetwork |
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PGA Gain=16 |
- |
150/10 |
- |
kΩ/ |
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PGA Gain = -1 |
- |
10/10 |
- |
kΩ |
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R2/R1 internal resistance |
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PGA Gain = -3 |
- |
30/10 |
- |
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values in inverting PGA |
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PGA Gain = -7 |
- |
70/10 |
- |
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mode(2) |
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PGA Gain = -15 |
- |
150/10 |
- |
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Delta R |
Resistance variation (R1 |
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- |
−15 |
- |
15 |
% |
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or R2) |
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202/252 |
DS12923 Rev 1 |
STM32H745xI/G |
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Electrical characteristics |
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Table 109. Operational amplifier characteristics (continued) |
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Symbol |
Parameter |
Conditions |
Min |
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Typ |
Max |
Unit |
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Gain=2 |
- |
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GBW/2 |
- |
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PGA bandwidth for |
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Gain=4 |
- |
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GBW/4 |
- |
MHz |
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different non inverting gain |
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Gain=8 |
- |
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GBW/8 |
- |
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PGA BW |
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Gain=16 |
- |
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GBW/16 |
- |
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Gain = -1 |
- |
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5.00 |
- |
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PGA bandwidth for |
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Gain = -3 |
- |
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3.00 |
- |
MHz |
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different inverting gain |
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Gain = -7 |
- |
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1.50 |
- |
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Gain = -15 |
- |
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0.80 |
- |
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at |
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- |
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140 |
- |
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1 KHz |
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output loaded |
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nV/√ |
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en |
Voltage noise density |
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at |
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with 4 kΩ |
- |
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55 |
- |
Hz |
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10 KHz |
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Normal |
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- |
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570 |
1000 |
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mode |
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no Load, |
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OPAMP consumption from |
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IDDA(OPAMP) |
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High- |
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quiescent mode, |
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µA |
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VDDA |
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follower |
- |
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610 |
1200 |
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speed |
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mode |
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1.RLOAD is the resistive load connected to VSSA or to VDDA.
2.R2 is the internal resistance between the OPAMP output and th OPAMP inverting input. R1 is the internal resistance between the OPAMP inverting input and ground. PGA gain = 1 + R2/R1.
6.3.29Digital filter for Sigma-Delta Modulators (DFSDM) characteristics
Unless otherwise specified, the parameters given in Table 110 for DFSDM are derived from tests performed under the ambient temperature, fPCLKx frequency and supply voltage conditions summarized in Table 23: General operating conditions.
•Output speed is set to OSPEEDRy[1:0] = 10
•Capacitive load CL = 30 pF
•Measurement points are done at CMOS levels: 0.5VDD
•VOS level set to VOS1
Refer to Section 6.3.16: I/O port characteristics for more details on the input/output alternate function characteristics (DìFSDM_CKINx, DFSDM_DATINx, DFSDM_CKOUT for DFSDM).
DS12923 Rev 1 |
203/252 |
Electrical characteristics |
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STM32H745xI/G |
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Table 110. DFSDM measured timing 1.62-3.6 V |
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Symbol |
Parameter |
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Conditions |
Min |
Typ |
Max |
Unit |
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fDFSDMCLK |
DFSDM |
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1.62 < VDD < 3.6 V |
- |
- |
133 |
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clock |
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SPI mode (SITP[1:0]=0,1), |
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External clock mode |
- |
- |
20 |
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(SPICKSEL[1:0]=0), |
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1.62 < VDD < 3.6 V |
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SPI mode (SITP[1:0]=0,1), |
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External clock mode |
- |
- |
20 |
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(SPICKSEL[1:0]=0), |
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fCKIN |
Input clock |
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2.7 < VDD < 3.6 V |
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MH |
(1/TCKIN) |
frequency |
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SPI mode (SITP[1:0]=0,1), |
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z |
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Internal clock mode |
- |
- |
20 |
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(SPICKSEL[1:0]¹0), |
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1.62 < VDD < 3.6 V |
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SPI mode (SITP[1:0]=0,1), |
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Internal clock mode |
- |
- |
20 |
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(SPICKSEL[1:0]¹0), |
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2.7 < VDD < 3.6 V |
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fCKOUT |
Output clock |
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1.62 < VDD < 3.6 V |
- |
- |
20 |
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frequency |
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DuCyCKOU |
Output clock |
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frequency |
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1.62 < VDD < 3.6 V |
45 |
50 |
55 |
% |
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T |
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duty cycle |
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twh(CKIN) |
Input clock |
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SPI mode (SITP[1:0]=0,1), |
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External clock mode |
TCKIN/2-0.5 |
TCKIN/2 |
- |
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high and low |
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twl(CKIN) |
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(SPICKSEL[1:0]=0), |
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time |
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1.62 < VDD < 3.6 V |
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SPI mode (SITP[1:0]=0,1), |
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tsu |
Data input |
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External clock mode |
1.5 |
- |
- |
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setup time |
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(SPICKSEL[1:0]=0), |
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1.62 < VDD < 3.6 V |
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ns |
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SPI mode (SITP[1:0]=0,1), |
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th |
Data input |
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External clock mode |
0.5 |
- |
- |
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hold time |
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(SPICKSEL[1:0]=0), |
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1.62 < VDD < 3.6 V |
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Manchester |
Manchester mode (SITP[1:0]=2,3), |
(CKOUTDIV+1) |
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TManchester |
data period |
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Internal clock mode |
- |
(2*CKOUTDIV) |
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(recovered |
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(SPICKSEL[1:0]¹0), |
* TDFSDMCLK |
* TDFSDMCLK |
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clock period) |
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1.62 < VDD < 3.6 V |
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204/252 |
DS12923 Rev 1 |
STM32H745xI/G |
Electrical characteristics |
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SPI timing : SPICKSEL = 0
Figure 47. Channel transceiver timing diagrams
CKINy |
(SPICKSEL=0) |
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DFSDM |
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twl |
twh |
tr |
tf |
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DATINy |
tsu th |
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SITP = 00 |
tsu |
th |
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DFSDM |
SITP = 01 |
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SPI timing : SPICKSEL = 1, 2, 3
CKOUT |
SPICKSEL=3 |
SPICKSEL=2 |
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DFSDM |
SPICKSEL=1 |
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twl |
twh |
tr |
tf |
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tsu th |
|
|
|
DATINy |
SITP = 0 |
|
|
|
|
tsu |
th |
|
|
_ |
|
|
||
|
|
|
|
|
DFSDM |
SITP = 1 |
|
|
|
|
|
|
|
Manchester timing
SITP = 2
_DATINy |
|
|
|
|
|
DFSDM |
SITP = 3 |
|
|
|
|
|
|
|
|
|
|
recovered clock |
|
|
|
|
|
recovered data 0 |
0 |
1 |
1 |
0 |
|
MS30766V2
DS12923 Rev 1 |
205/252 |
