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SN74AHCT1G08 |
www.ti.com |
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SCLS315Q –MARCH 1996–REVISED APRIL 2016 |
5 Pin Configuration and Functions |
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DBV, DCK, and DRL Packages |
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5-Pin SOT-23, SC70, and SOT |
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Top View |
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A |
1 |
5 |
VCC |
B |
2 |
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GND |
3 |
4 |
Y |
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Pin Functions |
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PIN |
I/O |
DESCRIPTION |
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NAME |
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NO. |
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A |
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1 |
I |
Input A |
B |
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2 |
I |
Input B |
GND |
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3 |
— |
Ground Pin |
VCC |
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5 |
— |
Supply Pin |
Y |
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4 |
O |
Output |
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).(1)
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MIN |
MAX |
UNIT |
Supply voltage |
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–0.5 |
7 |
V |
Input voltage(2) |
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–0.5 |
7 |
V |
Output voltage(2) |
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–0.5 |
VCC + 0.5 |
V |
Input clamp current |
VI < 0 |
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–20 |
mA |
Output clamp current |
VO < 0 or VO > VCC |
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±20 |
mA |
Continuous output current |
VO = 0 to VCC |
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±25 |
mA |
Continuous current through VCC or GND |
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±50 |
mA |
Maximum junction temperature, TJ |
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150 |
°C |
Storage temperature, Tstg |
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–65 |
150 |
°C |
(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 |
ESD Ratings |
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VALUE |
UNIT |
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V(ESD) |
Electrostatic discharge |
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) |
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±2500 |
V |
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Charged-device model (CDM), per JEDEC specification JESD22-C101 |
(2) |
±1000 |
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(1)JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 1996–2016, Texas Instruments Incorporated |
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SCLS315Q –MARCH 1996 –REVISED APRIL 2016 |
www.ti.com |
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
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MIN |
MAX |
UNIT |
VCC |
Supply voltage |
4.5 |
5.5 |
V |
VIH |
High-level input voltage |
2 |
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V |
VIL |
Low-level input voltage |
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0.8 |
V |
VI |
Input voltage |
0 |
5.5 |
V |
VO |
Output voltage |
0 |
VCC |
V |
IOH |
High-level output current |
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–8 |
mA |
IOL |
Low-level output current |
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8 |
mA |
t/ v |
Input transition rise and fall rate |
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20 |
ns/V |
TA |
Operating free-air temperature |
–40 |
125 |
°C |
(1)All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004).
6.4 Thermal Information
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SN74AHCT1G08 |
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THERMAL METRIC(1) |
DBV (SOT-23) |
DCK (SC70) |
DRL (SOT) |
UNIT |
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5 PINS |
5 PINS |
5 PINS |
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RθJA |
Junction-to-ambient thermal resistance |
226 |
277.5 |
242.9 |
°C/W |
RθJC(top) |
Junction-to-case (top) thermal resistance |
165 |
92.9 |
77.5 |
°C/W |
RθJB |
Junction-to-board thermal resistance |
59.1 |
64.2 |
77.5 |
°C/W |
ψJT |
Junction-to-top characterization parameter |
45.5 |
1.9 |
9.6 |
°C/W |
ψJB |
Junction-to-board characterization parameter |
58.3 |
63.5 |
77.3 |
°C/W |
(1)For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
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PARAMETER |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
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IOH = –50 µA, VCC = 4.5 V |
TA = 25°C |
4.4 |
4.5 |
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VOH |
High-level output |
TA = –40°C to 125°C |
4.4 |
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V |
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voltage |
IOH = –8 mA, VCC = 4.5 V |
TA = 25°C |
3.94 |
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TA = –40°C to 125°C |
3.8 |
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Low-level output |
IOL = 50 µA, VCC = 4.5 V |
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0.1 |
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VOL |
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TA = 25°C |
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0.36 |
V |
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voltage |
IOL = 8 mA, VCC = 4.5 V |
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TA = –40°C to 125°C |
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0.44 |
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II |
Input current |
VI = 5.5 V or GND, |
TA = 25°C |
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±0.1 |
µA |
VCC = 0 V to 5.5 V |
TA = –40°C to 125°C |
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±1 |
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ICC |
Supply current |
VI = VCC or GND, IO = 0, |
TA = 25°C |
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1 |
µA |
VCC = 5.5 V |
TA = –40°C to 125°C |
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10 |
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(1) |
Change in supply |
One input at 3.4 V, Other Inputs |
TA = 25°C |
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1.35 |
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ICC |
current |
at VCC or GND, VCC = 5.5 V |
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mA |
TA = –40°C to 125°C |
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1.5 |
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CI |
Input capacitance |
VI = VCC or GND, VCC = 5 V |
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4 |
10 |
pF |
(1)This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC.
4 |
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Copyright © 1996–2016, Texas Instruments Incorporated |
Product Folder Links: SN74AHCT1G08
SN74AHCT1G08
www.ti.com |
SCLS315Q –MARCH 1996–REVISED APRIL 2016 |
6.6 Switching Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 2)
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PARAMETER |
FROM |
TO |
OUTPUT |
TEST CONDITIONS |
MIN |
TYP |
MAX |
UNIT |
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(INPUT) |
(OUTPUT) |
CAPACITANCE |
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Propagation delay, |
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TA = 25°C |
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5 |
6.2 |
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tPLH |
A or B |
Y |
CL = 15 pF |
TA = –40°C to 85°C |
1 |
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7.1 |
ns |
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low to high transition |
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TA = –40°C to 125°C |
1 |
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7.5 |
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Propagation delay, |
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TA = 25°C |
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5 |
6.2 |
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tPHL |
A or B |
Y |
CL = 15 pF |
TA = –40°C to 85°C |
1 |
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7.1 |
ns |
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high to low transition |
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TA = –40°C to 125°C |
1 |
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7.5 |
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TA = 25°C |
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5.5 |
7.9 |
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tPLH |
Propagation delay, |
A or B |
Y |
CL = 50 pF |
Propagation delay, |
1 |
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9 |
ns |
low to high transition |
high to low transition |
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TA = –40°C to 125°C |
1 |
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10 |
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Propagation delay, |
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TA = 25°C |
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5.5 |
7.9 |
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tPHL |
A or B |
Y |
CL = 50 pF |
TA = –40°C to 85°C |
1 |
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9 |
ns |
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high to low transition |
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TA = –40°C to 125°C |
1 |
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10 |
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6.7 |
Operating Characteristics |
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VCC = 5 V, TA = 25°C |
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PARAMETER |
TEST CONDITIONS |
TYP |
UNIT |
Cpd |
Power dissipation capacitance |
No load, f = 1 MHz |
18 |
pF |
6.8 |
Typical Characteristics |
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Tpd (ns)
8
7.5
7
6.5
6
5.5
5
4.5
Tpd vs.
Temp
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-25 |
-5 |
15 |
35 |
55 |
75 |
95 |
115 |
135 |
Temperature (ƒC)
C001
CL = 15 pF
Figure 1. Tpd vs Temperature
Copyright © 1996–2016, Texas Instruments Incorporated |
Submit Documentation Feedback |
5 |
Product Folder Links: SN74AHCT1G08