
- •1 Features
- •2 Applications
- •3 Description
- •Table of Contents
- •4 Revision History
- •5 Pin Configuration and Functions
- •6 Specifications
- •6.1 Absolute Maximum Ratings
- •6.2 ESD Ratings: LM27313
- •6.3 ESD Ratings: LM27313-Q1
- •6.4 Recommended Operating Conditions
- •6.5 Thermal Information
- •6.6 Electrical Characteristics
- •6.7 Typical Characteristics
- •7 Detailed Description
- •7.1 Overview
- •7.2 Functional Block Diagram
- •7.3 Feature Description
- •7.4 Device Functional Modes
- •8 Application and Implementation
- •8.1 Application Information
- •8.2 Typical Applications
- •8.2.1 Application Circuit VIN=5.0 V, VOUT=12.0 V, Iload=250 mA
- •8.2.1.1 Design Requirements
- •8.2.1.2 Detailed Design Procedure
- •8.2.1.3 Application Curves
- •8.2.2 Application Circuit VIN=5.0V, VOUT=20.0V, Iload=150mA
- •8.2.2.1 Design Requirements
- •8.2.2.2 Detailed Design Procedure
- •8.2.2.3 Application Curves
- •9 Power Supply Recommendations
- •10 Layout
- •10.1 Layout Guidelines
- •10.2 Layout Example
- •10.3 Thermal Considerations
- •11 Device and Documentation Support
- •11.1 Device Support
- •11.1.1 Third-Party Products Disclaimer
- •11.2 Related Links
- •11.3 Trademarks
- •11.4 Electrostatic Discharge Caution
- •11.5 Glossary
- •12 Mechanical, Packaging, and Orderable Information

LM27313, LM27313-Q1
www.ti.com |
SNVS487E –DECEMBER 2006 –REVISED JANUARY 2015 |
9 Power Supply Recommendations
The LM27313 is designed to operate from an input voltage supply range from 2.7 V to 14 V. This input supply should be able to withstand the maximum input current and maintain a voltage above 2.7 V. In cases where input supply is located farther away (more than a few inches) from LM27313, additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
10 Layout
10.1 Layout Guidelines
High-frequency switching regulators require very careful layout of components in order to get stable operation and low noise. All components must be as close as possible to the LM27313 device. It is recommended that a 4- layer PCB be used so that internal ground planes are available.
Some additional guidelines to be observed:
1.Keep the path between L1, D1, and C2 extremely short. Parasitic trace inductance in series with D1 and C2 will increase noise and ringing.
2.The feedback components R1, R2 and CF must be kept close to the FB pin of the LM27313 to prevent noise injection on the high impedance FB pin.
3.If internal ground planes are available (recommended) use vias to connect directly to the LM27313 ground at device pin 2, as well as the negative sides of capacitors C1 and C2.
10.2 Layout Example
Figure 22. Recommended PCB Component Layout
10.3 Thermal Considerations
At higher duty cycles, the increased ON time of the FET means the maximum output current will be determined by power dissipation within the LM27313 FET switch. The switch power dissipation from ON-state conduction is calculated by:
PSW = DC x IIND(AVG)2 x RDS(ON) |
(18) |
There will be some switching losses as well, so some derating needs to be applied when calculating IC power dissipation.
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Product Folder Links: LM27313 LM27313-Q1