
- •1 Introduction
- •2 Description
- •2.1 Device overview
- •2.2 Full compatibility throughout the family
- •2.3 Overview
- •2.3.2 Embedded Flash memory
- •2.3.3 CRC (cyclic redundancy check) calculation unit
- •2.3.4 Embedded SRAM
- •2.3.5 Nested vectored interrupt controller (NVIC)
- •2.3.6 External interrupt/event controller (EXTI)
- •2.3.7 Clocks and startup
- •2.3.8 Boot modes
- •2.3.9 Power supply schemes
- •2.3.10 Power supply supervisor
- •2.3.11 Voltage regulator
- •2.3.14 RTC (real-time clock) and backup registers
- •2.3.15 Timers and watchdogs
- •2.3.17 Universal synchronous/asynchronous receiver transmitters (USARTs)
- •2.3.18 Serial peripheral interface (SPI)
- •2.3.20 Ethernet MAC interface with dedicated DMA and IEEE 1588 support
- •2.3.21 Controller area network (CAN)
- •2.3.24 Remap capability
- •2.3.27 Temperature sensor
- •2.3.29 Embedded Trace Macrocell™
- •3 Pinouts and pin description
- •4 Memory mapping
- •5 Electrical characteristics
- •5.1 Parameter conditions
- •5.1.1 Minimum and maximum values
- •5.1.2 Typical values
- •5.1.3 Typical curves
- •5.1.4 Loading capacitor
- •5.1.5 Pin input voltage
- •5.1.6 Power supply scheme
- •5.1.7 Current consumption measurement
- •5.2 Absolute maximum ratings
- •5.3 Operating conditions
- •5.3.1 General operating conditions
- •5.3.3 Embedded reset and power control block characteristics
- •5.3.4 Embedded reference voltage
- •5.3.5 Supply current characteristics
- •5.3.6 External clock source characteristics
- •5.3.7 Internal clock source characteristics
- •5.3.8 PLL, PLL2 and PLL3 characteristics
- •5.3.9 Memory characteristics
- •5.3.10 EMC characteristics
- •5.3.11 Absolute maximum ratings (electrical sensitivity)
- •5.3.12 I/O current injection characteristics
- •5.3.13 I/O port characteristics
- •5.3.14 NRST pin characteristics
- •5.3.15 TIM timer characteristics
- •5.3.16 Communications interfaces
- •5.3.18 DAC electrical specifications
- •5.3.19 Temperature sensor characteristics
- •6 Package characteristics
- •6.1 Package mechanical data
- •6.2 Thermal characteristics
- •6.2.1 Reference document
- •6.2.2 Selecting the product temperature range
- •7 Part numbering
- •Appendix A Application block diagrams
- •A.1 USB OTG FS interface solutions
- •A.2 Ethernet interface solutions
- •A.3 Complete audio player solutions
- •A.4 USB OTG FS interface + Ethernet/I2S interface solutions
- •Revision history

STM32F105xx, STM32F107xx |
Electrical characteristics |
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5 Electrical characteristics
5.1Parameter conditions
Unless otherwise specified, all voltages are referenced to VSS.
5.1.1Minimum and maximum values
Unless otherwise specified the minimum and maximum values are guaranteed in the worst conditions of ambient temperature, supply voltage and frequencies by tests in production on 100% of the devices with an ambient temperature at TA = 25 °C and TA = TAmax (given by the selected temperature range).
Data based on characterization results, design simulation and/or technology characteristics are indicated in the table footnotes and are not tested in production. Based on characterization, the minimum and maximum values refer to sample tests and represent the mean value plus or minus three times the standard deviation (mean±3Σ).
5.1.2Typical values
Unless otherwise specified, typical data are based on TA = 25 °C, VDD = 3.3 V (for the 2 V ≤VDD ≤3.6 V voltage range). They are given only as design guidelines and are not tested.
Typical ADC accuracy values are determined by characterization of a batch of samples from a standard diffusion lot over the full temperature range, where 95% of the devices have an error less than or equal to the value indicated (mean±2Σ).
5.1.3Typical curves
Unless otherwise specified, all typical curves are given only as design guidelines and are not tested.
5.1.4Loading capacitor
The loading conditions used for pin parameter measurement are shown in Figure 6.
5.1.5Pin input voltage
The input voltage measurement on a pin of the device is described in Figure 7.
Figure 6. Pin loading conditions |
Figure 7. Pin input voltage |
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C = 50 pF |
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STM32F10xxx pin |
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STM32F10xxx pin |
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Electrical characteristics |
STM32F105xx, STM32F107xx |
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5.1.6Power supply scheme
Figure 8. Power supply scheme
VBAT
1.8-3.6V
Power switch |
Backup circuitry (OSC32K,RTC, Wake-up logic Backup registers)
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OUT |
hifter |
IO |
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GP I/Os |
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Logic |
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IN |
Level |
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VDD |
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VDD |
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1/2/3/4/5 |
Regulator |
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5 × 100 nF |
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VSS |
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+ 1 × 4.7 µF |
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VDD |
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VDDA |
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VREF |
VREF+ |
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10 nF |
10 nF |
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VREF- |
ADC/ |
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RCs, PLL, |
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+ 1 µF |
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DAC |
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VSSA |
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Kernel logic (CPU, Digital
& Memories)
ai14125d
Caution: In Figure 8, the 4.7 µF capacitor must be connected to VDD3.
5.1.7Current consumption measurement
Figure 9. Current consumption measurement scheme
IDD_VBAT
VBAT |
IDD
VDD |
VDDA
ai14126
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DocID15274 Rev 7 |