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Национальный исследовательский университет «МИЭТ»

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Интерфейсы вычислительных систем

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Интерфейсы вычислительных систем / ИДЗ / Готовое / 4 этап / Datasheets / EEPROM.pdf

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AT24C01C/AT24C02C

Packaging Information

10.Packaging Information

10.1Package Marking Information

AT24C01C and AT24C02C: Package Marking Information

8-lead SOIC

ATMLHYWW

###% CO YYWWNNN

8-lead PDIP

ATMLUYWW

###% CO YYWWNNN

8-lead TSSOP	8-pad UDFN
	2.0 x 3.0 mm Body

ATHYWW

###

###%CO

YYWWNNN

NNN

5-lead SOT23

8-ball VFBGA

1.5 x 2.0 mm Body

###U

##%UYY

WWNNN

WNNN

Note 1:	designates pin 1
Note 2: Package drawings are not to scale
Note 3: For SOT23 package with date codes before 7B, the bottom line (YMXX) is marked on the bottom side and there ryis noofAssemblyCount (		@) mark on the top line.

Catalog Number Truncation

AT24C01C					Truncation Code ###: 01C / ##: 1C
AT24C02C					Truncation Code ###: 02C / ##: 2C

Date Codes						Voltages
YY = Year		Y = Year			WW = Work Week of Assembly	% = Minimum Voltage
16: 2016	20: 2020	6: 2016	0: 2020		02: Week 2	M:	1.7V min
17: 2017	21: 2021	7: 2017	1: 2021		04: Week 4
18: 2018	22: 2022	8: 2018	2: 2022		...
19: 2019	23: 2023	9: 2019	3: 2023		52: Week 52

Country of Origin				Device Grade		Atmel Truncation
CO = Country of Origin				H or U:	Industrial Grade	AT:	Atmel
						ATM:	Atmel
						ATML:	Atmel

Trace Code

NNN = Alphanumeric Trace Code (2 Characters for Small Packages)

Datasheet

DS20006111A-page 24

AT24C01C/AT24C02C

Packaging Information

8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

D A

NOTE 1

1 2

TOP VIEW

	E
C A	A2
PLANE
L	c
A1
e	eB

8X b1

8X b

.010 C

SIDE VIEW

END VIEW

Microchip Technology Drawing No. C04-018D Sheet 1 of 2

Datasheet

DS20006111A-page 25

AT24C01C/AT24C02C

Packaging Information

8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

ALTERNATE LEAD DESIGN (VENDOR DEPENDENT)

DATUM A

		Units		INCHES
Dimension Limits			MIN	NOM	MAX
Number of Pins		N		8
Pitch		e		.100 BSC
Top to Seating Plane		A	-	-	.210
Molded Package Thickness		A2	.115	.130	.195
Base to Seating Plane		A1	.015	-	-
Shoulder to Shoulder Width		E	.290	.310	.325
Molded Package Width		E1	.240	.250	.280
Overall Length		D	.348	.365	.400
Tip to Seating Plane		L	.115	.130	.150
Lead Thickness		c	.008	.010	.015
Upper Lead Width		b1	.040	.060	.070
Lower Lead Width		b	.014	.018	.022
Overall Row Spacing	§	eB	-	-	.430

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.§ Significant Characteristic

3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4.Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing No. C04-018D Sheet 2 of 2

Datasheet

DS20006111A-page 26

AT24C01C/AT24C02C

Packaging Information

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

			2X
		D	0.10 C	A–B
		D
	A	NOTE 5	D
			D
	N
	N
			E
	E1		2
	2
E1			E

NOTE 1	1	2
	e	NX b
	B	0.25 C A–B D
		NOTE 5
	TOP VIEW
		0.10	C
C A A2
SEATING
PLANE		8X
		0.10	C
A1	SIDE VIEW

	R0.13
	h
H	R0.13	0.23
H		0.23
	L
	SEE VIEW C
	(L1)
	VIEW A–A
	VIEW C
	Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2

Datasheet

DS20006111A-page 27

AT24C01C/AT24C02C

Packaging Information

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

		Units		MILLIMETERS
	Dimension Limits		MIN		NOM	MAX
Number of Pins		N		8
Pitch		e			1.27 BSC
Overall Height		A	-		-	1.75
Molded Package Thickness		A2	1.25		-	-
Standoff	§	A1	0.10		-	0.25
Overall Width		E			6.00 BSC
Molded Package Width		E1			3.90 BSC
Overall Length		D			4.90 BSC
Chamfer (Optional)		h	0.25		-	0.50
Foot Length		L	0.40		-	1.27
Footprint		L1			1.04 REF
Foot Angle			0°		-	8°
Lead Thickness		c	0.17		-	0.25
Lead Width		b	0.31		-	0.51
Mold Draft Angle Top			5°		-	15°
Mold Draft Angle Bottom			5°		-	15°

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.§ Significant Characteristic

3.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side.

4.Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H.

Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2

Datasheet

DS20006111A-page 28

AT24C01C/AT24C02C

Packaging Information

8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

SILK SCREEN

RECOMMENDED LAND PATTERN

		Units		MILLIMETERS
	Dimension Limits		MIN		NOM	MAX
Contact Pitch		E			1.27 BSC
Contact Pad Spacing		C			5.40
Contact Pad Width (X8)		X1				0.60
Contact Pad Length (X8)		Y1				1.55

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Microchip Technology Drawing C04-2057-SN Rev B

Datasheet

DS20006111A-page 29

AT24C01C/AT24C02C

Packaging Information

" # 1 % & % ! % 2 " ) ' % 2$% % " %

%% 033))) & &3 2

	D
N
	E
	E1
NOTE 1
1	2
b
	e

4 %

55 * *

& 5 & %

6!&($

:+ . /

7 ; %

" " 2 2

% "$$

7 = "%

: . /

" " 2 = "%

" " 2 5 %

1 % 5 %

1 % %

1 %

5 " 2

5 " = "%

(

" #

! " #$%! & ' (!% &! % ( % " ) % % % "

& " * " % !" & "$ % ! "$ % ! % # " + && " , & " % *-+

. /0 . & % # % ! ) ) % !% %

*10 $& ' ! ! ) % !% % '$ $& % !

) / 9:.

Datasheet

DS20006111A-page 30

AT24C01C/AT24C02C

Packaging Information

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

Datasheet

DS20006111A-page 31

AT24C01C/AT24C02C

Packaging Information

5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]

Atmel Legacy Global Package Code TSZ

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

D	0.20	C	2X
D
e1
A			D
			D
N
		E/2
E1/2
E1			E
	(DATUM D)
	(DATUM A-B)

0.15 C D
2X
NOTE 1	1	2
		0.20 C
	e
	B	NX b
		0.20 C A-B D

TOP VIEW

SEE SHEET 2

A	A2	0.20	C
		0.20	C
		SEATING PLANE
	A1	C

SIDE VIEW

Microchip Technology Drawing C04-21344 Rev B Sheet 1 of 2

Datasheet

DS20006111A-page 32

AT24C01C/AT24C02C

Packaging Information

5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]

Atmel Legacy Global Package Code TSZ

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

(c)

VIEW A-A

SHEET 1

	Units		MILLIMETERS
Dimension Limits		MIN		NOM	MAX
Number of Leads	N		5
Pitch	e			0.95 BSC
Outside lead pitch	e1			1.90 BSC
Overall Height	A	-		-	1.10
Molded Package Thickness	A2	0.70		0.90	1.00
Standoff	A1	-		-	0.10
Overall Width	E			2.80 BSC
Molded Package Width	E1			1.60 BSC
Overall Length	D			2.90 BSC
Foot Length	L	0.30		-	0.60
Footprint	L1			0.60 REF
Foot Angle	θ	0°	-		8°
Lead Thickness	c	0.08	-		0.20
Lead Width	b	0.30	-		0.50

Notes:

1.Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side.

2.Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-21344 Rev B Sheet 2 of 2

Datasheet

DS20006111A-page 33

AT24C01C/AT24C02C

Packaging Information

5-Lead Plastic Thin Small Outline Transistor (NMB) [TSOT]

Atmel Legacy Global Package Code TSZ

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

SILK SCREEN

1	E	2	G
1		2

RECOMMENDED LAND PATTERN

	Units		MILLIMETERS
Dimension Limits		MIN		NOM	MAX
Contact Pitch	E			0.95 BSC
Contact Pad Spacing	C			2.60
Contact Pad Width (X5)	X1				0.60
Contact Pad Length (X5)	Y1				1.05
Contact Pad to Center Pad (X2)	G	0.20

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2.For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process

Microchip Technology Drawing C04-23344 Rev B

Datasheet

DS20006111A-page 34

AT24C01C/AT24C02C

Packaging Information

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

(DATUM A)

(DATUM B)

NOTE 1

0.10

TOP VIEW

0.10

SEATING

PLANE

(A3)

0.08

SIDE VIEW

0.10

8X b

0.10

BOTTOM VIEW

0.05

Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 1 of 2

Datasheet

DS20006111A-page 35

AT24C01C/AT24C02C

Packaging Information

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

	Units		MILLIMETERS
Dimension Limits		MIN		NOM	MAX
Number of Terminals	N		8
Pitch	e			0.50 BSC
Overall Height	A	0.50		0.55	0.60
Standoff	A1	0.00		0.02	0.05
Terminal Thickness	A3			0.152 REF
Overall Length	D			2.00 BSC
Exposed Pad Length	D2	1.40		1.50	1.60
Overall Width	E			3.00 BSC
Exposed Pad Width	E2	1.20	1.30		1.40
Terminal Width	b	0.18	0.25		0.30
Terminal Length	L	0.35	0.40		0.45
Terminal-to-Exposed-Pad	K	0.20	-		-

Notes:

1.Pin 1 visual index feature may vary, but must be located within the hatched area.

2.Package is saw singulated

3.Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-21355-Q4B Rev A Sheet 2 of 2

Datasheet

DS20006111A-page 36

AT24C01C/AT24C02C

Packaging Information

8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN] Atmel Legacy YNZ Package

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging

	X2
	EV
	G2
	8
	ØV
C	Y2
	G1

1	2
1	2
SILK SCREEN		X1
		X1

RECOMMENDED LAND PATTERN

	Units		MILLIMETERS
Dimension Limits		MIN		NOM	MAX
Contact Pitch	E			0.50 BSC
Optional Center Pad Width	X2				1.60
Optional Center Pad Length	Y2				1.40
Contact Pad Spacing	C			2.90
Contact Pad Width (X8)	X1				0.30
Contact Pad Length (X8)	Y1				0.85
Contact Pad to Center Pad (X8)	G1	0.20
Contact Pad to Contact Pad (X6)	G2	0.33
Thermal Via Diameter	V			0.30
Thermal Via Pitch	EV			1.00

Notes:

1. Dimensioning and tolerancing per ASME Y14.5M

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

2.For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process

Microchip Technology Drawing C04-21355-Q4B Rev A

Datasheet

DS20006111A-page 37

AT24C01C/AT24C02C

Packaging Information

0.10

(4X)

0.08

0.10

n 0.15 m

n 0.08m

PIN 1 BALL PAD CORNER

TOP VIEW

PIN 1 BALL PAD CORNER

SIDE VIEW

(d1)

COMMON DIMENSIONS

(e1)

(Unit of Measure - mm)

BOTTOM VIEW

SYMBOL

MIN

NOM

MAX

NOTE

0.73

0.79

0.85

8 SOLDER BALLS

0.09

0.14

0.19

Notes:

0.40

0.45

0.50

0.20

0.25

0.30

1. This drawing is for general information only.

1.50 BSC

2. Dimension ‘b’ is measured at maximum solder ball diameter.

2.0 BSC

0.50 BSC

3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu.

0.25 REF

1.00 BSC

0.25 REF

			7/1/14

TITLE	GPC	DRAWING NO .	REV.
8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch,	GXU	8U3-1	G
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)	GXU	8U3-1	G
Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA)

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

Datasheet

DS20006111A-page 38

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