Добавил:

lightcharm github.com Опубликованный материал нарушает ваши авторские права? Сообщите нам.

Вуз:

Национальный исследовательский университет «МИЭТ»

Предмет:

Интерфейсы вычислительных систем

Файл:

Интерфейсы вычислительных систем / ИДЗ / Datasheets / STM32F107xx.pdf

Скачиваний:

Добавлен:

30.09.2023

Размер:

2.15 Mб

Скачать

☆

<<< < Предыдущая 1 2 3 4 5 6 7 89 / 209 10 11 12 13 14 15 16 17 18 19 20 > Следующая >>>

Electrical characteristics			STM32F105xx, STM32F107xx

		Table 8. Thermal characteristics
	Symbol	Ratings		Value	Unit

	TSTG	Storage temperature range		–65 to +150	°C
	TJ	Maximum junction temperature		150	°C

5.3Operating conditions

5.3.1General operating conditions

Table 9. General operating conditions

Symbol		Parameter		Conditions	Min	Max	Unit

fHCLK		Internal AHB clock frequency		-	0	72
fPCLK1		Internal APB1 clock frequency		-	0	36	MHz
fPCLK2		Internal APB2 clock frequency		-	0	72
VDD		Standard operating voltage		-	2	3.6	V
		Analog operating voltage			2	3.6
		(ADC not used)	Must be the same potential		2	3.6
VDDA(1)		(ADC not used)	Must be the same potential				V
			as VDD	(2)
		Analog operating voltage		(2)	2.4	3.6
		Analog operating voltage
		(ADC used)
		(ADC used)

VBAT		Backup operating voltage		-	1.8	3.6	V
		Power dissipation at TA =	LFBGA100		-	500
P
			LQFP100		-	434	mW
	D	85 °C for suffix 6 or T =	LQFP100		-	434	mW
	D	105 °C for suffix 7(3) A
		105 °C for suffix 7(3) A	LQFP64		-	444
			LQFP64		-	444

		Power dissipation at TA =	LQFP100		-	434
P		85 °C for suffix 6 or T =					mW
P		85 °C for suffix 6 or T =					mW
	D	105 °C for suffix 7(4) A	LQFP64		-	444
		Ambient temperature for 6	Maximum power dissipation		–40	85	°C
		Ambient temperature for 6
		suffix version		(5)	–40	105
		suffix version		(5)
TA			Low power dissipation
TA		Ambient temperature for 7	Maximum power dissipation		–40	105	°C
			Maximum power dissipation		–40	105

		suffix version		(5)	–40	125
		suffix version		(5)
			Low power dissipation
TJ		Junction temperature range	6 suffix version		–40	105	°C

			7 suffix version		–40	125
			7 suffix version		–40	125

1.When the ADC is used, refer to Table 52: ADC characteristics.

2.It is recommended to power VDD and VDDA from the same source. A maximum difference of 300 mV between VDD and VDDA can be tolerated during power-up and operation.

3.If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.

4.If TA is lower, higher PD values are allowed as long as TJ does not exceed TJmax.

5.In low power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax.

36/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx	Electrical characteristics

5.3.2Operating conditions at power-up / power-down

Subject to general operating conditions for TA.

Table 10. Operating conditions at power-up / power-down

Symbol	Parameter	Conditions	Min	Max	Unit

tVDD	VDD rise time rate	-	0	∞	µs/V
tVDD	VDD fall time rate	-	20	∞	µs/V
	VDD fall time rate		20	∞

5.3.3Embedded reset and power control block characteristics

The parameters given in Table 11 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 9.

Table 11. Embedded reset and power control block characteristics

	Symbol		Parameter	Conditions	Min	Typ	Max	Unit

				PLS[2:0]=000 (rising edge)	2.1	2.18	2.26	V

				PLS[2:0]=000 (falling edge)	2	2.08	2.16	V

				PLS[2:0]=001 (rising edge)	2.19	2.28	2.37	V

				PLS[2:0]=001 (falling edge)	2.09	2.18	2.27	V

				PLS[2:0]=010 (rising edge)	2.28	2.38	2.48	V

				PLS[2:0]=010 (falling edge)	2.18	2.28	2.38	V

				PLS[2:0]=011 (rising edge)	2.38	2.48	2.58	V

	VPVD		Programmable voltage	PLS[2:0]=011 (falling edge)	2.28	2.38	2.48	V
			Programmable voltage
			detector level selection	PLS[2:0]=100 (rising edge)	2.47	2.58	2.69	V
			detector level selection	PLS[2:0]=100 (rising edge)	2.47	2.58	2.69	V

				PLS[2:0]=100 (falling edge)	2.37	2.48	2.59	V

				PLS[2:0]=101 (rising edge)	2.57	2.68	2.79	V

				PLS[2:0]=101 (falling edge)	2.47	2.58	2.69	V

				PLS[2:0]=110 (rising edge)	2.66	2.78	2.9	V

				PLS[2:0]=110 (falling edge)	2.56	2.68	2.8	V

				PLS[2:0]=111 (rising edge)	2.76	2.88	3	V

				PLS[2:0]=111 (falling edge)	2.66	2.78	2.9	V

	VPVDhyst(2)		PVD hysteresis	-	-	100	-	mV
	VPOR/PDR		Power on/power down	Falling edge	1.8(1)	1.88	1.96	V
			reset threshold
			reset threshold	Rising edge	1.84	1.92	2.0	V
				Rising edge	1.84	1.92	2.0	V

	VPDRhyst(2)		PDR hysteresis	-	-	40	-	mV
T	RSTTEMPO	(2)	Reset temporization	-	1	2.5	4.5	ms
	RSTTEMPO

1.The product behavior is guaranteed by design down to the minimum VPOR/PDR value.

2.Guaranteed by design, not tested in production.

DocID15274 Rev 7

37/104

Electrical characteristics	STM32F105xx, STM32F107xx

5.3.4Embedded reference voltage

The parameters given in Table 12 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 9.

Table 12. Embedded internal reference voltage

Symbol			Parameter	Conditions	Min	Typ	Max	Unit

VREFINT			Internal reference voltage	–40 °C < TA < +105 °C	1.16	1.20	1.26	V
VREFINT			Internal reference voltage	–40 °C < TA < +85 °C	1.16	1.20	1.24	V
				–40 °C < TA < +85 °C	1.16	1.20	1.24	V
TS_vrefint(1)			ADC sampling time when				17.1(2)
TS_vrefint(1)			reading the internal reference	-	-	5.1	17.1(2)	µs
			voltage

V		(2)	Internal reference voltage
V	RERINT	(2)	spread over the temperature	V = 3 V ±10 mV	-	-	10	mV
	RERINT		range	DD
			range

TCoeff(2)			Temperature coefficient	-	-	-	100	ppm/°C

1.Shortest sampling time can be determined in the application by multiple iterations.

2.Guaranteed by design, not tested in production.

5.3.5Supply current characteristics

The current consumption is a function of several parameters and factors such as the operating voltage, ambient temperature, I/O pin loading, device software configuration, operating frequencies, I/O pin switching rate, program location in memory and executed binary code.

The current consumption is measured as described in Figure 9: Current consumption measurement scheme.

All Run-mode current consumption measurements given in this section are performed with a reduced code that gives a consumption equivalent to Dhrystone 2.1 code.

Maximum current consumption

The MCU is placed under the following conditions:

•All I/O pins are in input mode with a static value at VDD or VSS (no load)

•All peripherals are disabled except when explicitly mentioned

•The Flash memory access time is adjusted to the fHCLK frequency (0 wait state from 0 to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above)

•Prefetch in ON (reminder: this bit must be set before clock setting and bus prescaling)

•When the peripherals are enabled fPCLK1 = fHCLK/2, fPCLK2 = fHCLK

The parameters given in Table 13, Table 14 and Table 15 are derived from tests performed under ambient temperature and VDD supply voltage conditions summarized in Table 9.

38/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx					Electrical characteristics

	Table 13. Maximum current consumption in Run mode, code with data processing
			running from Flash
	Symbol	Parameter	Conditions	fHCLK	Max(1)		Unit
	Symbol	Parameter	Conditions	fHCLK	TA = 85 °C	TA = 105 °C	Unit
					TA = 85 °C	TA = 105 °C
				72 MHz	68	68.4

				48 MHz	49	49.2

			External clock(2), all	36 MHz	38.7	38.9
			peripherals enabled	24 MHz	27.3	27.9

				16 MHz	20.2	20.5

	IDD	Supply current in		8 MHz	10.2	10.8	mA
		Supply current in
		Run mode		72 MHz	32.7	32.9
				72 MHz	32.7	32.9

				48 MHz	25	25.2

			External clock(2), all	36 MHz	20.3	20.6
			peripherals disabled	24 MHz	14.8	15.1

				16 MHz	11.2	11.7

				8 MHz	6.6	7.2

1.Based on characterization, not tested in production.

2.External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

Table 14. Maximum current consumption in Run mode, code with data processing running from RAM

Symbol	Parameter	Conditions	fHCLK	Max(1)		Unit
Symbol	Parameter	Conditions	fHCLK	TA = 85 °C	TA = 105 °C	Unit
				TA = 85 °C	TA = 105 °C
			72 MHz	65.5	66

			48 MHz	45.4	46

		External clock(2), all	36 MHz	35.5	36.1
		peripherals enabled	24 MHz	25.2	25.6

			16 MHz	18	18.5
	Supply
IDD	Supply		8 MHz	10.5	11
	current in					mA
	current in		72 MHz	31.4	31.9	mA
	Run mode		72 MHz	31.4	31.9
			48 MHz	27.8	28.2

		External clock(2), all	36 MHz	17.6	18.3
		peripherals disabled	24 MHz	13.1	13.8

			16 MHz	10.2	10.9

			8 MHz	6.1	7.8

1.Based on characterization, tested in production at VDD max, fHCLK max..

2.External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

DocID15274 Rev 7

39/104

Electrical characteristics				STM32F105xx, STM32F107xx

Table 15. Maximum current consumption in Sleep mode, code running from Flash or RAM
Symbol	Parameter	Conditions	fHCLK	Max(1)		Unit
Symbol	Parameter	Conditions	fHCLK	TA = 85 °C	TA = 105 °C	Unit
				TA = 85 °C	TA = 105 °C
			72 MHz	48.4	49

			48 MHz	33.9	34.4

		External clock(2), all	36 MHz	26.7	27.2
		peripherals enabled	24 MHz	19.3	19.8

			16 MHz	14.2	14.8

IDD	Supply current in		8 MHz	8.7	9.1	mA
IDD	Sleep mode		72 MHz	10.1	10.6	mA
	Sleep mode		72 MHz	10.1	10.6

			48 MHz	8.3	8.75

		External clock(2), all	36 MHz	7.5	8
		peripherals disabled	24 MHz	6.6	7.1

			16 MHz	6	6.5

			8 MHz	2.5	3

1.Based on characterization, tested in production at VDD max and fHCLK max with peripherals enabled.

2.External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

Table 16. Typical and maximum current consumptions in Stop and Standby modes

				Typ(1)		Max
Symbol	Parameter	Conditions							Unit
Symbol	Parameter	Conditions	VDD/VBAT	VDD/VBAT	VDD/VBAT	TA =	TA	=	Unit
			VDD/VBAT	VDD/VBAT	VDD/VBAT	TA =	TA	=
			= 2.0 V	= 2.4 V	= 3.3 V	85 °C	105 °C

		Regulator in Run mode, low-speed
		and high-speed internal RC	-	32	33	600	1300
		oscillators and high-speed oscillator	-	32	33	600	1300
		oscillators and high-speed oscillator
	Supply current	OFF (no independent watchdog)
	in Stop mode	Regulator in Low Power mode, low-
		speed and high-speed internal RC	-	25	26	590	1280
		oscillators and high-speed oscillator	-	25	26	590	1280
		oscillators and high-speed oscillator
IDD		OFF (no independent watchdog)

		Low-speed internal RC oscillator and	-	3	3.8	-	-		µA
		Low-speed internal RC oscillator and
		independent watchdog ON
		independent watchdog ON

	Supply current	Low-speed internal RC oscillator	-	2.8	3.6	-	-
	in Standby	ON, independent watchdog OFF	-	2.8	3.6	-	-
	in Standby	ON, independent watchdog OFF
	mode
	mode	Low-speed internal RC oscillator and				5(2)	6.5(2)
		Low-speed internal RC oscillator and
		independent watchdog OFF, low-	-	1.9	2.1
		speed oscillator and RTC OFF

IDD_VBAT	Backup					2.1(2)	2.3(2)
IDD_VBAT	domain supply	Low-speed oscillator and RTC ON	1.1	1.2	1.4	2.1(2)	2.3(2)
	current

1.Typical values are measured at TA = 25 °C.

2.Based on characterization, not tested in production.

40/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx	Electrical characteristics

Figure 10. Typical current consumption on VBAT with RTC on vs. temperature at different VBAT values

	2.5
µA)	2				1.8 V
	2				2 V

(	1.5
Consumption	1.5				2.4 V
					2.4 V
	1				3.3 V
	1				3.6 V
	0.5				3.6 V


	0
	–40 °C	25 °C	70 °C	85 °C	105 °C

Temperature (°C)

ai17329

Figure 11. Typical current consumption in Stop mode with regulator in Run mode versus temperature at different VDD values

	900.00
	800.00
(µA)	700.00
(µA)	600.00
Consumption	500.00			3.6 V
	400.00			3.6 V
	400.00			3.3 V
				3.3 V
	300.00			3 V
	300.00			3 V
	200.00			2.7 V
	200.00
	100.00			2.4 V
	100.00
	0.00
	–40 °C	25 °C	85 °C	105 °C

Temperature (°C)

ai17122

DocID15274 Rev 7

41/104

Electrical characteristics	STM32F105xx, STM32F107xx

Figure 12. Typical current consumption in Stop mode with regulator in Low-power mode versus temperature at different VDD values

	900.00
	800.00
(µA)	700.00
(µA)	600.00
Consumption	600.00
	500.00			3.6 V
	400.00			3.6 V
	400.00			3.3 V
				3.3 V
	300.00			3 V
	200.00			2.7 V
	200.00
	100.00			2.4 V
	100.00
	0.00
	–40 °C	25 °C	85 °C	105 °C

Temperature (°C)

ai17123

Figure 13. Typical current consumption in Standby mode versus temperature at different VDD values

	4.50
	4.00
(µA)	3.50
(µA)	3.00
Consumption	2.50
	2.00			3.6 V
	2.00
	1.50			3.3 V
				3 V


	1.00			2.7 V
	0.50			2.4 V
	0.50
	0.00
	–40 °C	25 °C	85 °C	105 °C

Temperature (°C)

ai17124

Typical current consumption

The MCU is placed under the following conditions:

•All I/O pins are in input mode with a static value at VDD or VSS (no load).

•All peripherals are disabled except if it is explicitly mentioned.

•The Flash access time is adjusted to fHCLK frequency (0 wait state from 0 to 24 MHz, 1 wait state from 24 to 48 MHz and 2 wait states above).

•Ambient temperature and VDD supply voltage conditions summarized in Table 9.

•Prefetch is ON (Reminder: this bit must be set before clock setting and bus prescaling)

When the peripherals are enabled fPCLK1 = fHCLK/4, fPCLK2 = fHCLK/2, fADCCLK = fPCLK2/4

42/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx						Electrical characteristics

	Table 17. Typical current consumption in Run mode, code with data processing
			running from Flash
						Typ(1)
	Symbol	Parameter	Conditions	fHCLK				Unit
	Symbol	Parameter	Conditions	fHCLK	All peripherals		All peripherals	Unit
					enabled(2)		disabled
				72 MHz	47.3		28.3

				48 MHz	32		19.6

				36 MHz	24.6		15.4

				24 MHz	16.8		10.6

				16 MHz	11.8		7.4
			External clock(3)
			External clock(3)	8 MHz	5.9		3.7	mA
				4 MHz	3.7		2.9

				2 MHz	2.5		2

				1 MHz	1.8		1.53
		Supply
		Supply		500 kHz	1.5		1.3
	IDD	current in		500 kHz	1.5		1.3

				125 kHz	1.3		1.2
		Run mode		125 kHz	1.3		1.2
		Run mode
				36 MHz	23.9		14.8

				24 MHz	16.1		9.7

			Running on high	16 MHz	11.1		6.7
			Running on high
			speed internal RC	8 MHz	5.6		3.8
			(HSI), AHB
			(HSI), AHB	4 MHz	3.1		2.1	mA
			prescaler used to	4 MHz	3.1		2.1	mA
			prescaler used to
			reduce the	2 MHz	1.8		1.3
			frequency
			frequency	1 MHz	1.16		0.9
				1 MHz	1.16		0.9

				500 kHz	0.8		0.67

				125 kHz	0.6		0.5

1.Typical values are measures at TA = 25 °C, VDD = 3.3 V.

2.Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).

3.External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

DocID15274 Rev 7

43/104

Electrical characteristics					STM32F105xx, STM32F107xx

	Table 18. Typical current consumption in Sleep mode, code running from Flash or
				RAM
					Typ(1)
	Symbol	Parameter	Conditions	fHCLK			Unit
	Symbol	Parameter	Conditions	fHCLK	All peripherals	All peripherals	Unit
					enabled(2)	disabled
				72 MHz	28.2	6

				48 MHz	19	4.2

				36 MHz	14.7	3.4

				24 MHz	10.1	2.5

				16 MHz	6.7	2
			External clock(3)
			External clock(3)	8 MHz	3.2	1.3
				4 MHz	2.3	1.2

				2 MHz	1.7	1.16

				1 MHz	1.5	1.1
		Supply
		Supply		500 kHz	1.3	1.05
	IDD	current in					mA
	IDD	current in		125 kHz	1.2	1.05	mA
		Sleep mode		125 kHz	1.2	1.05
				36 MHz	13.7	2.6

				24 MHz	9.3	1.8

				16 MHz	6.3	1.3
			Running on high
			Running on high	8 MHz	2.7	0.6
			speed internal RC	8 MHz	2.7	0.6
			speed internal RC
			(HSI), AHB prescaler	4 MHz	1.6	0.5
			used to reduce the
			used to reduce the	2 MHz	1	0.46
			frequency	2 MHz	1	0.46
			frequency
				1 MHz	0.8	0.44

				500 kHz	0.6	0.43

				125 kHz	0.5	0.42

1.Typical values are measures at TA = 25 °C, VDD = 3.3 V.

2.Add an additional power consumption of 0.8 mA per ADC for the analog part. In applications, this consumption occurs only while the ADC is on (ADON bit is set in the ADC_CR2 register).

3.External clock is 8 MHz and PLL is on when fHCLK > 8 MHz.

On-chip peripheral current consumption

The current consumption of the on-chip peripherals is given in Table 19. The MCU is placed under the following conditions:

•all I/O pins are in input mode with a static value at VDD or VSS (no load)

•all peripherals are disabled unless otherwise mentioned

•the given value is calculated by measuring the current consumption

–with all peripherals clocked off

–with one peripheral clocked on (with only the clock applied)

•ambient operating temperature and VDD supply voltage conditions summarized in

Table 6

44/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx			Electrical characteristics

		Table 19. Peripheral current consumption(1)
	Peripheral		Typical consumption at 25 °C	Unit

	AHB	ETH_MAC	5.2

		OTG_FS	7.7
		OTG_FS	7.7

		TIM2	1.5

		TIM3	1.5

		TIM4	1.5

		TIM5	1.5

		TIM6	0.6

		TIM7	0.3

		SPI2	0.2	mA

	APB1	USART2	0.5
		USART2	0.5

		USART3	0.5
		USART3	0.5

		UART4	0.5

		UART5	0.5

		I2C1	0.5

		I2C2	0.5

		CAN1	0.8

		CAN2	0.8

		DAC	0.4

		GPIO A	0.5

		GPIO B	0.5

		GPIO C	0.5

		GPIO D	0.5

	APB2	GPIO E	0.5	mA

		ADC1(2)	2.1
		ADC1(2)	2.1
		ADC2(2)	2.0
		TIM1	1.7

		SPI1	0.4

		USART1	0.9

1.fHCLK = 72 MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, default prescaler value for each peripheral.

2.Specific conditions for ADC: fHCLK = 56 MHz, fAPB1 = fHCLK/2, fAPB2 = fHCLK, fADCCLK = fAPB2/4, ADON bit in the ADC_CR2 register is set to 1.

DocID15274 Rev 7

45/104

<<< < Предыдущая 1 2 3 4 5 6 7 89 / 209 10 11 12 13 14 15 16 17 18 19 20 > Следующая >>>

Соседние файлы в папке Datasheets

#
30.09.20231.32 Mб13EEPROM.pdf
#
30.09.2023270.76 Кб13LM386_for_speaker.pdf
#
30.09.202391.01 Кб11Matrix_keyboard.pdf
#
30.09.2023477.74 Кб16Micro_I2C_INMP441.pdf
#
30.09.202311.9 Кб12Speaker.pdf
#
30.09.20232.15 Mб17STM32F107xx.pdf
#
30.09.20231.31 Mб16stm32_discovery-stm32-value-line-discovery.pdf
#
30.09.20231.09 Mб11Switch.pdf
#
30.09.20231.21 Mб14VIP_12.pdf
#
30.09.2023163.84 Кб15VIP_33_sch.pdf
#
30.09.20232.31 Mб13VIP_5.pdf