
- •1 Introduction
- •2 Description
- •2.1 Device overview
- •2.2 Full compatibility throughout the family
- •2.3 Overview
- •2.3.2 Embedded Flash memory
- •2.3.3 CRC (cyclic redundancy check) calculation unit
- •2.3.4 Embedded SRAM
- •2.3.5 Nested vectored interrupt controller (NVIC)
- •2.3.6 External interrupt/event controller (EXTI)
- •2.3.7 Clocks and startup
- •2.3.8 Boot modes
- •2.3.9 Power supply schemes
- •2.3.10 Power supply supervisor
- •2.3.11 Voltage regulator
- •2.3.14 RTC (real-time clock) and backup registers
- •2.3.15 Timers and watchdogs
- •2.3.17 Universal synchronous/asynchronous receiver transmitters (USARTs)
- •2.3.18 Serial peripheral interface (SPI)
- •2.3.20 Ethernet MAC interface with dedicated DMA and IEEE 1588 support
- •2.3.21 Controller area network (CAN)
- •2.3.24 Remap capability
- •2.3.27 Temperature sensor
- •2.3.29 Embedded Trace Macrocell™
- •3 Pinouts and pin description
- •4 Memory mapping
- •5 Electrical characteristics
- •5.1 Parameter conditions
- •5.1.1 Minimum and maximum values
- •5.1.2 Typical values
- •5.1.3 Typical curves
- •5.1.4 Loading capacitor
- •5.1.5 Pin input voltage
- •5.1.6 Power supply scheme
- •5.1.7 Current consumption measurement
- •5.2 Absolute maximum ratings
- •5.3 Operating conditions
- •5.3.1 General operating conditions
- •5.3.3 Embedded reset and power control block characteristics
- •5.3.4 Embedded reference voltage
- •5.3.5 Supply current characteristics
- •5.3.6 External clock source characteristics
- •5.3.7 Internal clock source characteristics
- •5.3.8 PLL, PLL2 and PLL3 characteristics
- •5.3.9 Memory characteristics
- •5.3.10 EMC characteristics
- •5.3.11 Absolute maximum ratings (electrical sensitivity)
- •5.3.12 I/O current injection characteristics
- •5.3.13 I/O port characteristics
- •5.3.14 NRST pin characteristics
- •5.3.15 TIM timer characteristics
- •5.3.16 Communications interfaces
- •5.3.18 DAC electrical specifications
- •5.3.19 Temperature sensor characteristics
- •6 Package characteristics
- •6.1 Package mechanical data
- •6.2 Thermal characteristics
- •6.2.1 Reference document
- •6.2.2 Selecting the product temperature range
- •7 Part numbering
- •Appendix A Application block diagrams
- •A.1 USB OTG FS interface solutions
- •A.2 Ethernet interface solutions
- •A.3 Complete audio player solutions
- •A.4 USB OTG FS interface + Ethernet/I2S interface solutions
- •Revision history

STM32F105xx, STM32F107xx |
Electrical characteristics |
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5.3.18DAC electrical specifications
Table 56. DAC characteristics
Symbol |
Parameter |
Min |
Typ |
Max |
Unit |
Comments |
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VDDA |
Analog supply voltage |
2.4 |
- |
3.6 |
V |
- |
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VREF+ |
Reference supply voltage |
2.4 |
- |
3.6 |
V |
VREF+ must always be below VDDA |
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VSSA |
Ground |
0 |
- |
0 |
V |
- |
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R |
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(1) |
Resistive load with buffer ON |
5 |
- |
- |
kΩ |
- |
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LOAD |
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Impedance output with buffer |
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When the buffer is OFF, the |
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R |
O |
(1) |
- |
- |
15 |
kΩ |
Minimum resistive load between |
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OFF |
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DAC_OUT and VSS to have a 1% |
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accuracy is 1.5 MΩ |
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C |
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(1) |
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Maximum capacitive load at |
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Capacitive load |
- |
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50 |
pF |
DAC_OUT pin (when the buffer is |
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LOAD |
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ON). |
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DAC_OUT |
Lower DAC_OUT voltage |
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It gives the maximum output |
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0.2 |
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- |
V |
excursion of the DAC. |
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min(1) |
with buffer ON |
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It corresponds to 12-bit input code |
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(0x0E0) to (0xF1C) at VREF+ = |
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DAC_OUT |
Higher DAC_OUT voltage |
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VDDA – 0.2 |
V |
3.6 V and (0x155) to (0xEAB) at |
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(1) |
with buffer ON |
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max |
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VREF+ = 2.4 V |
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DAC_OUT |
Lower DAC_OUT voltage |
- |
0.5 |
- |
mV |
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min(1) |
with buffer OFF |
It gives the maximum output |
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DAC_OUT |
Higher DAC_OUT voltage |
- |
- |
VREF+ – 1LSB |
V |
excursion of the DAC. |
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(1) |
with buffer OFF |
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max |
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DAC DC current |
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With no load, worst code (0xF1C) |
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IDDVREF+ |
consumption in quiescent |
- |
- |
220 |
µA |
at VREF+ = 3.6 V in terms of DC |
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mode (Standby mode) |
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consumption on the inputs |
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- |
- |
380 |
µA |
With no load, middle code (0x800) |
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DAC DC current |
on the inputs |
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IDDA |
consumption in quiescent |
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With no load, worst code (0xF1C) |
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mode (Standby mode) |
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480 |
µA |
at VREF+ = 3.6 V in terms of DC |
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consumption on the inputs |
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Differential non linearity |
- |
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±0.5 |
LSB |
Given for the DAC in 10-bit |
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DNL(2) |
configuration. |
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Difference between two |
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consecutive code-1LSB) |
- |
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±2 |
LSB |
Given for the DAC in 12-bit |
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configuration. |
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Integral non linearity |
- |
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±1 |
LSB |
Given for the DAC in 10-bit |
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(difference between |
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configuration. |
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INL(2) |
measured value at Code i |
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and the value at Code i on a |
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Given for the DAC in 12-bit |
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±4 |
LSB |
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line drawn between Code 0 |
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and last Code 1023) |
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configuration. |
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DocID15274 Rev 7 |
79/104 |

Electrical characteristics |
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STM32F105xx, STM32F107xx |
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Table 56. DAC characteristics (continued) |
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Symbol |
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Parameter |
Min |
Typ |
Max |
Unit |
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Comments |
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Offset error |
- |
- |
±10 |
mV |
Given for the DAC in 12-bit |
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configuration |
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(difference between |
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Offset(2) |
- |
- |
±3 |
LSB |
Given for the DAC in 10-bit at |
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measured value at Code |
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VREF+ = 3.6 V |
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(0x800) and the ideal value = |
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Given for the DAC in 12-bit at |
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VREF+/2) |
- |
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±12 |
LSB |
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VREF+ = 3.6 V |
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Gain |
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Gain error |
- |
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±0.5 |
% |
Given for the DAC in 12bit |
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error(2) |
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configuration |
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Settling time (full scale: for a |
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10-bit input code transition |
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CLOAD ≤ 50 pF, |
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tSETTLING |
(2) |
between the lowest and the |
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3 |
4 |
µs |
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highest input codes when |
RLOAD ≥ 5 kΩ |
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DAC_OUT reaches final |
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value ±1LSB |
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Update |
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Max frequency for a correct |
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≤ 50 pF, |
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DAC_OUT change when |
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C |
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rate(2) |
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small variation in the input |
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1 |
MS/s |
RLOADLOAD |
≥ 5 kΩ |
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code (from code i to i+1LSB) |
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(2) |
Wakeup time from off state |
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CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ |
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t |
WAKEUP |
(Setting the ENx bit in the |
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6.5 |
10 |
µs |
input code between lowest and |
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DAC Control register) |
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highest possible ones. |
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PSRR+ (1) |
Power supply rejection ratio |
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(to V |
DDA |
) (static DC |
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–67 |
–40 |
dB |
No R |
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LOAD |
= 50 pF |
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LOAD |
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measurement |
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1.Guaranteed by design, not tested in production.
2.Guaranteed by characterization, not tested in production.
Figure 38. 12-bit buffered /non-buffered DAC
Buffered/Non-buffered DAC
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Buffer(1) |
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R LOAD |
12-bit |
DACx_OUT |
digital to |
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analog |
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converter |
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C LOAD |
ai17157
1.The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the DAC_CR register.
80/104 |
DocID15274 Rev 7 |

STM32F105xx, STM32F107xx |
Electrical characteristics |
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5.3.19Temperature sensor characteristics
Table 57. TS characteristics
Symbol |
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Parameter |
Min |
Typ |
Max |
Unit |
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(1) |
V |
SENSE |
linearity with temperature |
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± |
± |
°C |
TL |
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1 |
2 |
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Avg_Slope(1) |
Average slope |
4.0 |
4.3 |
4.6 |
mV/°C |
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V (1) |
Voltage at 25 °C |
1.34 |
1.43 |
1.52 |
V |
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25 |
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tSTART(2) |
Startup time |
4 |
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10 |
µs |
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TS_temp(3)(2) |
ADC sampling time when reading the |
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17.1 |
µs |
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temperature |
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1.Based on characterization, not tested in production.
2.Guaranteed by design, not tested in production.
3.Shortest sampling time can be determined in the application by multiple iterations.
DocID15274 Rev 7 |
81/104 |