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STM32F105xx, STM32F107xx

Electrical characteristics

 

 

5.3.18DAC electrical specifications

Table 56. DAC characteristics

Symbol

Parameter

Min

Typ

Max

Unit

Comments

 

 

 

 

 

 

 

VDDA

Analog supply voltage

2.4

-

3.6

V

-

VREF+

Reference supply voltage

2.4

-

3.6

V

VREF+ must always be below VDDA

VSSA

Ground

0

-

0

V

-

R

 

 

(1)

Resistive load with buffer ON

5

-

-

-

LOAD

 

 

 

 

 

 

 

 

 

 

 

Impedance output with buffer

 

 

 

 

When the buffer is OFF, the

R

O

(1)

-

-

15

Minimum resistive load between

 

 

 

OFF

 

 

 

 

DAC_OUT and VSS to have a 1%

 

 

 

 

 

 

 

 

 

accuracy is 1.5 MΩ

 

 

 

 

 

 

 

 

 

 

C

 

 

(1)

 

 

 

 

 

Maximum capacitive load at

 

 

Capacitive load

-

-

50

pF

DAC_OUT pin (when the buffer is

LOAD

 

 

 

 

 

 

ON).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DAC_OUT

Lower DAC_OUT voltage

 

 

 

 

It gives the maximum output

0.2

-

-

V

excursion of the DAC.

min(1)

with buffer ON

 

 

 

 

It corresponds to 12-bit input code

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(0x0E0) to (0xF1C) at VREF+ =

DAC_OUT

Higher DAC_OUT voltage

 

 

 

 

-

-

VDDA – 0.2

V

3.6 V and (0x155) to (0xEAB) at

 

 

(1)

with buffer ON

max

 

 

 

 

 

VREF+ = 2.4 V

DAC_OUT

Lower DAC_OUT voltage

-

0.5

-

mV

 

min(1)

with buffer OFF

It gives the maximum output

DAC_OUT

Higher DAC_OUT voltage

-

-

VREF+ – 1LSB

V

excursion of the DAC.

 

 

(1)

with buffer OFF

 

max

 

 

 

 

 

 

 

 

 

 

DAC DC current

 

 

 

 

With no load, worst code (0xF1C)

IDDVREF+

consumption in quiescent

-

-

220

µA

at VREF+ = 3.6 V in terms of DC

 

 

 

 

mode (Standby mode)

 

 

 

 

consumption on the inputs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-

-

380

µA

With no load, middle code (0x800)

 

 

 

 

DAC DC current

on the inputs

IDDA

consumption in quiescent

 

 

 

 

With no load, worst code (0xF1C)

 

 

 

 

mode (Standby mode)

-

-

480

µA

at VREF+ = 3.6 V in terms of DC

 

 

 

 

 

 

 

 

 

consumption on the inputs

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Differential non linearity

-

-

±0.5

LSB

Given for the DAC in 10-bit

DNL(2)

configuration.

Difference between two

 

 

 

 

 

 

 

 

 

consecutive code-1LSB)

-

-

±2

LSB

Given for the DAC in 12-bit

 

 

 

 

 

configuration.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Integral non linearity

-

-

±1

LSB

Given for the DAC in 10-bit

 

 

 

 

(difference between

 

 

 

 

configuration.

INL(2)

measured value at Code i

 

 

 

 

 

 

 

 

 

 

and the value at Code i on a

 

 

 

 

Given for the DAC in 12-bit

 

 

 

 

-

-

±4

LSB

 

 

 

 

line drawn between Code 0

 

 

 

 

and last Code 1023)

 

 

 

 

configuration.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DocID15274 Rev 7

79/104

Electrical characteristics

 

 

 

 

STM32F105xx, STM32F107xx

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Table 56. DAC characteristics (continued)

 

 

 

 

 

Symbol

 

 

Parameter

Min

Typ

Max

Unit

 

 

Comments

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Offset error

-

-

±10

mV

Given for the DAC in 12-bit

 

 

 

 

configuration

 

 

 

 

 

 

(difference between

 

 

 

 

 

 

 

 

 

 

Offset(2)

-

-

±3

LSB

Given for the DAC in 10-bit at

 

measured value at Code

 

VREF+ = 3.6 V

 

 

 

 

 

(0x800) and the ideal value =

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Given for the DAC in 12-bit at

 

 

 

 

VREF+/2)

-

-

±12

LSB

 

 

 

 

 

 

 

VREF+ = 3.6 V

 

 

Gain

 

 

Gain error

-

-

±0.5

%

Given for the DAC in 12bit

 

error(2)

 

configuration

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Settling time (full scale: for a

 

 

 

 

 

 

 

 

 

 

 

 

 

10-bit input code transition

 

 

 

 

CLOAD ≤ 50 pF,

 

tSETTLING

(2)

between the lowest and the

-

3

4

µs

 

 

highest input codes when

RLOAD ≥ 5 kΩ

 

 

 

 

 

DAC_OUT reaches final

 

 

 

 

 

 

 

 

 

 

 

 

 

value ±1LSB

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Update

 

Max frequency for a correct

 

 

 

 

 

 

≤ 50 pF,

 

 

 

DAC_OUT change when

 

 

 

 

C

 

 

 

rate(2)

 

 

small variation in the input

-

-

1

MS/s

RLOADLOAD

≥ 5 kΩ

 

 

 

 

 

code (from code i to i+1LSB)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(2)

Wakeup time from off state

 

 

 

 

CLOAD ≤ 50 pF, RLOAD ≥ 5 kΩ

t

WAKEUP

(Setting the ENx bit in the

-

6.5

10

µs

input code between lowest and

 

 

 

 

DAC Control register)

 

 

 

 

highest possible ones.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PSRR+ (1)

Power supply rejection ratio

 

 

 

 

 

 

 

 

 

(to V

DDA

) (static DC

-

–67

–40

dB

No R

 

, C

LOAD

= 50 pF

 

 

 

 

 

 

 

 

 

 

 

LOAD

 

 

 

 

 

measurement

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.Guaranteed by design, not tested in production.

2.Guaranteed by characterization, not tested in production.

Figure 38. 12-bit buffered /non-buffered DAC

Buffered/Non-buffered DAC

 

Buffer(1)

 

R LOAD

12-bit

DACx_OUT

digital to

 

analog

 

converter

 

 

C LOAD

ai17157

1.The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the DAC_CR register.

80/104

DocID15274 Rev 7

STM32F105xx, STM32F107xx

Electrical characteristics

 

 

5.3.19Temperature sensor characteristics

Table 57. TS characteristics

Symbol

 

 

Parameter

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

(1)

V

SENSE

linearity with temperature

-

±

±

°C

TL

 

 

1

2

Avg_Slope(1)

Average slope

4.0

4.3

4.6

mV/°C

V (1)

Voltage at 25 °C

1.34

1.43

1.52

V

25

 

 

 

 

 

 

 

tSTART(2)

Startup time

4

-

10

µs

TS_temp(3)(2)

ADC sampling time when reading the

-

-

17.1

µs

temperature

 

 

 

 

 

 

 

 

1.Based on characterization, not tested in production.

2.Guaranteed by design, not tested in production.

3.Shortest sampling time can be determined in the application by multiple iterations.

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