MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
KTT0003B |
TS3B (Rev F) |
BOTTOM SIDE OF PACKAGE |
www.ti.com |
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4) |
PLASTIC SMALL-OUTLINE |
6,70 (0.264) |
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6,30 (0.248) |
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3,10 (0.122) |
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4 |
2,90 (0.114) |
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0,10 (0.004) M |
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7,30 (0.287) |
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3,70 (0.146) |
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6,70 (0.264) |
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3,30 (0.130) |
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Gauge Plane |
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1 |
2 |
3 |
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0,25 (0.010) |
2,30 (0.091) |
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0,84 (0.033) |
0° –10° |
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0,66 (0.026) |
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4,60 (0.181) |
0,10 (0.004) M |
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0,75 (0.030) MIN |
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1,70 (0.067) |
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1,80 (0.071) MAX |
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1,50 (0.059) |
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0,35 (0.014) |
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0,23 (0.009) |
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Seating Plane |
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0,10 (0.0040) |
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0,08 (0.003) |
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0,02 (0.0008) |
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4202506/B 06/2002 |
NOTES: A. All linear dimensions are in millimeters (inches).
B.This drawing is subject to change without notice.
C.Body dimensions do not include mold flash or protrusion.
D.Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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PACKAGE OUTLINE |
NGN0008A |
WSON - 0.8 mm max height |
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PLASTIC SMALL OUTLINE - NO LEAD |
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A |
4.1 |
B |
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3.9 |
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PIN 1 INDEX AREA |
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4.1 |
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3.9 |
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PIN 1 ID |
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DETAIL A |
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PIN 1 ID |
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C |
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0.8 MAX |
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SEATING PLANE |
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0.05 |
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0.08 C |
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0.00 |
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2.2 |
0.05 |
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EXPOSED |
SYMM |
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(0.2) TYP |
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THERMAL PAD |
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6X |
0.8 |
4 |
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5 |
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2X |
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9 |
SYMM |
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2.4 |
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3 |
0.05 |
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SEE |
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DETAIL A |
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1 |
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8 |
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(0.25) |
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8X |
0.35 |
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0.25 |
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(0.25) |
(0.2) |
8X |
0.6 |
0.1 |
C A B |
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PIN 1 ID |
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0.4 |
0.05 |
C |
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(0.15) |
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4214794/A |
11/2019 |
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
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EXAMPLE BOARD LAYOUT |
NGN0008A |
WSON - 0.8 mm max height |
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PLASTIC SMALL OUTLINE - NO LEAD |
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(2.2) |
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8X (0.5) |
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SYMM |
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1 |
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8X (0.3) |
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8 |
SYMM |
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9 |
(3) |
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6X (0.8) |
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(1.25) |
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4 |
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5 |
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(R0.05) TYP |
( 0.2) VIA |
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TYP |
(0.85) |
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(3.3) |
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LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
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0.07 MAX |
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0.07 MIN |
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ALL AROUND |
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ALL AROUND |
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EXPOSED |
EXPOSED |
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METAL |
METAL |
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SOLDER MASK |
METAL |
METAL UNDER |
SOLDER MASK |
OPENING |
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SOLDER MASK |
OPENING |
NON SOLDER MASK |
SOLDER MASK |
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DEFINED |
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DEFINED |
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(PREFERRED) |
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SOLDER MASK DETAILS
4214794/A 11/2019
NOTES: (continued)
4.This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
5.Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
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EXAMPLE STENCIL DESIGN |
NGN0008A |
WSON - 0.8 mm max height |
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PLASTIC SMALL OUTLINE - NO LEAD |
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0.59 |
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8X (0.5) |
SYMM |
METAL |
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TYP |
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1 |
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8X (0.3) |
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8 |
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4X (1.31) |
SYMM |
9 |
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(0.755) |
6X (0.8) |
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4 |
5 |
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(R0.05) TYP
4X (0.98) 
(3.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4214794/A 11/2019
NOTES: (continued)
6.Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
www.ti.com
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PACKAGE OUTLINE |
NDP0003B |
TO-252 - 2.55 mm max height |
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TRANSISTOR OUTLINE |
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10.42 |
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9.40 |
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B |
6.22 |
1.27 |
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5.97 |
0.88 |
A |
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(2.345) |
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1 |
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2.285 |
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(2.5) |
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4.57 |
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2 |
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5.46 |
6.73 |
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4.96 |
6.35 |
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0.88 |
3 |
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3X |
1.02 |
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PKG |
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0.64 |
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OPTIONAL |
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0.25 |
C A B |
0.64 |
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8 |
8 |
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TOP & BOTTOM |
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1.14 |
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C |
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0.89 |
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2.55 MAX |
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SEATING PLANE |
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0.17 |
0.60 |
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0.88 |
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0.46 |
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0.46 |
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0.51 MIN |
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4.32 MIN 
3
2 |
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4 |
1
4219870/A 03/2018
NOTES:
1.All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2.This drawing is subject to change without notice.
3.Reference JEDEC registration TO-252.
www.ti.com
|
EXAMPLE BOARD LAYOUT |
NDP0003B |
TO-252 - 2.55 mm max height |
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TRANSISTOR OUTLINE |
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SEE SOLDER MASK |
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2X (2.15) |
DETAIL |
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2X (1.3) |
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(5.7) |
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1 |
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(4.57) |
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4 |
SYMM |
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(5.5) |
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3 |
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(R0.05) TYP |
(4.38) |
(2.285) |
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PKG |
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LAND PATTERN EXAMPLE |
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EXPOSED METAL SHOWN |
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SCALE: 8X |
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0.07 MAX |
METAL EDGE |
0.07 MIN |
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ALL AROUND |
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ALL AROUND |
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METAL UNDER |
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EXPOSED |
SOLDER MASK |
EXPOSED |
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METAL |
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METAL |
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SOLDER MASK |
SOLDER MASK |
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OPENING |
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OPENING |
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NON SOLDER MASK |
SOLDER MASK DEFINED |
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DEFINED |
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(PREFERRED)
SOLDER MASK DETAIL
4219870/A 03/2018
NOTES: (continued)
4.This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5.Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
|
EXAMPLE STENCIL DESIGN |
NDP0003B |
TO-252 - 2.55 mm max height |
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TRANSISTOR OUTLINE |
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(1.35) TYP |
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2X (2.15) |
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2X (1.3) |
(0.26) |
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(R0.05) TYP |
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(1.32) TYP
(4.57)
16X (1.12)
16X (1.15) 
(4.38)
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
4219870/A 03/2018
NOTES: (continued)
6.Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
7.Board assembly site may have different recommendations for stencil design.
www.ti.com