- •FEATURES
- •APPLICATIONS
- •TYPICAL APPLICATION CIRCUITS
- •GENERAL DESCRIPTION
- •TABLE OF CONTENTS
- •REVISION HISTORY
- •SPECIFICATIONS
- •RECOMMENDED SPECIFICATIONS: INPUT AND OUTPUT CAPACITOR
- •ABSOLUTE MAXIMUM RATINGS
- •THERMAL DATA
- •THERMAL RESISTANCE
- •ESD CAUTION
- •PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
- •TYPICAL PERFORMANCE CHARACTERISTICS
- •THEORY OF OPERATION
- •APPLICATIONS INFORMATION
- •CAPACITOR SELECTION
- •Output Capacitor
- •Input Bypass Capacitor
- •Input and Output Capacitor Properties
- •UNDERVOLTAGE LOCKOUT
- •ENABLE FEATURE
- •THERMAL CONSIDERATIONS
- •PCB LAYOUT CONSIDERATIONS
- •OUTLINE DIMENSIONS
- •ORDERING GUIDE
- •AUTOMOTIVE PRODUCTS
Data Sheet |
ADP150 |
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To guarantee the performance of the ADP150, it is imperative |
The ADP150 uses an internal soft start to limit the inrush current |
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that the effects of the dc bias, temperature, and tolerances on |
when the output is enabled. The start-up time for the 3.3 V |
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the behavior of the capacitors be evaluated for each. |
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option is approximately 150 μs from the time the EN active |
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UNDERVOLTAGE LOCKOUT |
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threshold is crossed to when the output reaches 90% of its final |
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value. As shown in Figure 32, the start-up time is dependent on |
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The ADP150 has an internal undervoltage lockout circuit that |
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the output voltage setting. |
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disables all inputs and the output when the input voltage is less |
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than approximately 2.0 V. This ensures that the ADP150 inputs |
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EN |
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and output behave in a predictable manner during power-up. |
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ENABLE FEATURE |
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VOUT = 3.3V |
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The ADP150 uses the EN pin to enable and disable the VOUT |
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VOUT = 2.8V |
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pin under normal operating conditions. As shown in Figure 30, |
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when a rising voltage on EN crosses the active threshold, VOUT |
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VOUT = 1.8V |
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turns on. When a falling voltage on EN crosses the inactive |
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threshold, VOUT turns off. |
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3.5 |
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3.0 |
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-128 |
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CH1 1V |
CH2 1V |
M40.0µs |
A CH1 3.24V |
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08343 |
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2.5 |
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CH3 1V |
CH4 1V |
240.000ns |
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Figure 32. Typical Start-Up Time |
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OUT |
2.0 |
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CURRENT LIMIT AND THERMAL OVERLOAD |
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V |
1.5 |
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PROTECTION |
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1.0 |
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The ADP150 is protected against damage due to excessive |
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power dissipation by current and thermal overload protection |
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0.5 |
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circuits. The ADP150 is designed to limit current when the |
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0 |
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output load reaches 260 mA (typical). When the output load |
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0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 |
08343-101 |
exceeds 260 mA, the output voltage is reduced to maintain a |
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VEN |
constant current limit. |
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Figure 30. Typical EN Pin Operation |
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Thermal overload protection is included, which limits the junction |
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As shown in Figure 30, the EN pin has hysteresis built in. This |
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temperature to a maximum of 150°C (typical). Under extreme |
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prevents on/off oscillations that can occur due to noise on the |
conditions (that is, high ambient temperature and power dissipation) |
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EN pin as it passes through the threshold points. |
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when the junction temperature starts to rise above 150°C, the |
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The EN pin active/inactive thresholds are derived from the VIN |
output is turned off, reducing the output current to zero. When |
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voltage; therefore, these thresholds vary with changing input |
the junction temperature drops below 135°C, the output is turned |
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voltage. Figure 31 shows the typical EN active/inactive thresholds |
on again and the output current is restored to its nominal value. |
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when the input voltage varies from 2.2 V to 5.5 V. |
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Consider the case where a hard short from VOUT to GND occurs. |
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1.1 |
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At first, the ADP150 limits current so that only 260 mA is |
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1.0 |
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conducted into the short. If self-heating of the junction is great |
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RISING |
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enough to cause its temperature to rise above 150°C, thermal |
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0.9 |
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shutdown activates, turning off the output and reducing the |
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THRESHOLD |
0.7 |
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into the short, again causing the junction temperature to rise |
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0.8 |
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output current to zero. As the junction temperature cools and |
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FALLING |
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drops below 135°C, the output turns on and conducts 260 mA |
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0.6 |
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causes a current oscillation between 260 mA and 0 mA that |
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above 150°C. This thermal oscillation between 135°C and 150°C |
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0.5 |
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continues as long as the short remains at the output. |
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Current and thermal limit protections are intended to protect |
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0.4 |
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the device against accidental overload conditions. For reliable |
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2.3 |
2.8 |
3.3 |
3.8 |
4.3 |
4.8 |
5.3 |
5.5 |
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VIN (V) |
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08343102- |
operation, device power dissipation must be externally limited |
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Figure 31. Typical EN Pin Thresholds vs. Input Voltage (VIN) |
so that the junction temperatures do not exceed 125°C. |
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Rev. D | Page 13 of 19 |
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ADP150 |
Data Sheet |
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THERMAL CONSIDERATIONS
In most applications, the ADP150 does not dissipate much heat due to its high efficiency. However, in applications with high ambient temperature and high supply voltage to output voltage differential, the heat dissipated in the package is large enough that it can cause the junction temperature of the die to exceed the maximum junction temperature of 125°C.
When the junction temperature exceeds 150°C, the converter enters thermal shutdown. It recovers only after the junction temperature decreases below 135°C to prevent any permanent damage. Therefore, thermal analysis for the chosen application is very important to guarantee reliable performance over all conditions. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 2.
To guarantee reliable operation, the junction temperature of the ADP150 must not exceed 125°C. To ensure that the junction temperature stays below 125°C, be aware of the parameters that contribute to the junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θJA). The θJA number is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pins to the PCB. Table 7 shows typical θJA values of the 5-lead TSOT and 4-ball WLCSP packages for various PCB copper sizes. Table 8 shows the typical ΨJB value of the 5-lead TSOT and 4-ball WLCSP.
Table 7. Typical θJA Values
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θJA (°C/W) |
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Copper Size (mm2) |
TSOT |
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WLCSP |
01 |
170 |
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260 |
50 |
152 |
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159 |
100 |
146 |
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300 |
134 |
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500 |
131 |
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1 Device soldered to minimum size pin traces.
Table 8. Typical ΨJB Values
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TSOT |
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WLCSP |
42.8 |
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Use Equation 2 to calculate the junction temperature.
TJ = TA + (PD × θJA) |
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where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = ((VIN − VOUT) × ILOAD) + (VIN × IGND)
where:
ILOAD is the load current. IGND is the ground current.
VIN and VOUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to
TJ = TA + (((VIN − VOUT) × ILOAD) × θJA) |
(3) |
As shown in the previous equation, for a given ambient temperature, input-to-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure that the junction temperature does not rise above 125°C. Figure 33 to Figure 46 show the junction temperature calculations for the different ambient temperatures, load currents, VIN-to-VOUT differentials, and areas of PCB copper.
140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
I |
= 1mA |
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ILOADLOAD |
= 10mA |
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= 25mA |
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100 |
ILOADLOAD |
= 50mA |
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TEMPERATURE, |
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ILOAD |
= 75mA |
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80 |
ILOAD |
= 100mA |
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ILOAD |
= 150mA |
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60 |
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JUNCTION |
40 |
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20 |
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0 |
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-228 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 33. TSOT, 500 mm2 of PCB Copper, TA = 25°C |
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140 


MAX JUNCTION TEMPERATURE
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120 |
ILOAD = 1mA |
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ILOAD = 10mA |
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ILOAD = 25mA |
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100 |
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TEMPERATURE, |
ILOAD = 50mA |
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ILOAD = 75mA |
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80 |
ILOAD = 100mA |
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ILOAD = 150mA |
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60 |
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JUNCTION |
40 |
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20 |
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0 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
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VIN – VOUT (V) |
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08343229- |
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Figure 34. TSOT, 100 mm2 of PCB Copper, TA = 25°C |
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Rev. D | Page 14 of 19
Data Sheet |
ADP150 |
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140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
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= 1mA |
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ILOAD |
= 10mA |
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LOAD |
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ILOAD |
= 25mA |
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100 |
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TEMPERATURE, |
ILOAD |
= 50mA |
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ILOAD |
= 75mA |
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80 |
ILOAD |
= 100mA |
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ILOAD |
= 150mA |
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60 |
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JUNCTION |
40 |
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0 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 35. TSOT, 0 mm2 of PCB Copper, TA = 25°C |
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140 |
MAX JUNCTION TEMPERATURE |
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(°C) |
120 |
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J |
100 |
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TEMPERATURE, |
80 |
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JUNCTION |
60 |
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40 |
ILOAD |
= 10mA |
ILOAD = 100mA |
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I |
= 1mA |
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= 75mA |
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20 |
LOAD |
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ILOAD |
= 25mA |
ILOAD |
= 150mA |
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ILOAD |
= 50mA |
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0 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 36. TSOT, 500 mm2 of PCB Copper, TA = 50°C |
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140 |
MAX JUNCTION TEMPERATURE |
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(°C) |
120 |
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J |
100 |
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TEMPERATURE, |
80 |
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JUNCTION |
60 |
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40 |
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ILOAD |
= 1mA |
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= 75mA |
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20 |
ILOAD |
= 10mA |
ILOAD |
= 100mA |
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ILOAD |
= 25mA |
ILOAD |
= 150mA |
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ILOAD |
= 50mA |
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0 |
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-232 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 37. TSOT, 100 mm2 of PCB Copper, TA = 50°C
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MAX JUNCTION TEMPERATURE |
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(°C) |
120 |
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J |
100 |
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TEMPERATURE, |
80 |
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JUNCTION |
60 |
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40 |
ILOAD |
= 10mA |
ILOAD = 100mA |
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I |
= 1mA |
I |
= 75mA |
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20 |
LOAD |
= 25mA |
LOAD |
= 150mA |
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ILOAD |
ILOAD |
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ILOAD |
= 50mA |
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0 |
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VIN – VOUT (V) |
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233-08343 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
Figure 38. TSOT, 0 mm2 of PCB Copper, TA = 50°C
140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
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J |
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T |
100 |
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TEMPERATURE, |
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80 |
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60 |
ILOAD = 1mA |
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ILOAD = 10mA |
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JUNCTION |
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ILOAD = 25mA |
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40 |
ILOAD = 50mA |
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ILOAD = 75mA |
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ILOAD = 100mA |
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20 |
ILOAD = 150mA |
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0 |
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-248 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 39. TSOT, 100 mm2 of PCB Copper, Board Temperature = 85°C
140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
ILOAD = 1mA |
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ILOAD = 10mA |
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J |
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T |
100 |
ILOAD = 25mA |
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TEMPERATURE, |
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ILOAD = 50mA |
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ILOAD = 75mA |
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80 |
ILOAD = 100mA |
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ILOAD = 150mA |
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60 |
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JUNCTION |
40 |
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20 |
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0 |
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-042 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
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Figure 40. WLCSP, 500 mm2 of PCB Copper, TA = 25°C |
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Rev. D | Page 15 of 19
ADP150
140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
ILOAD = 1mA |
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ILOAD = 10mA |
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J |
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T |
100 |
ILOAD = 25mA |
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TEMPERATURE, |
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ILOAD = 50mA |
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ILOAD = 75mA |
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80 |
ILOAD = 100mA |
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ILOAD = 150mA |
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60 |
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JUNCTION |
40 |
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20 |
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0 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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0.5 |
||||||||
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VIN – VOUT (V) |
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08343043- |
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Figure 41. WLCSP, 100 mm2 of PCB Copper, TA = 25°C |
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140 |
MAX JUNCTION |
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TEMPERATURE |
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(°C) |
120 |
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J |
100 |
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T |
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TEMPERATURE, |
80 |
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JUNCTION |
60 |
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40 |
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20 |
ILOAD |
= 1mA |
ILOAD |
= 50mA |
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ILOAD = 100mA |
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ILOAD |
= 10mA |
ILOAD |
= 75mA |
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ILOAD = 150mA |
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0 |
ILOAD |
= 25mA |
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-044 |
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0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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VIN – VOUT (V) |
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08343 |
||
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|
Figure 42. WLCSP, 0 mm2 of PCB Copper, TA = 25°C |
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|
140 |
MAX JUNCTION TEMPERATURE |
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(°C) |
120 |
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J |
100 |
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T |
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TEMPERATURE, |
80 |
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JUNCTION |
60 |
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40 |
ILOAD |
= 10mA |
ILOAD = 100mA |
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I |
= 1mA |
I |
= 75mA |
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20 |
LOAD |
= 25mA |
LOAD |
= 150mA |
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ILOAD |
ILOAD |
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ILOAD |
= 50mA |
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0 |
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-045 |
|
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
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|
VIN – VOUT (V) |
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|
08343 |
||
Figure 43. WLCSP, 500 mm2 of PCB Copper, TA = 50°C
Data Sheet
|
140 |
MAX JUNCTION TEMPERATURE |
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|||
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(°C) |
120 |
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J |
100 |
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T |
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TEMPERATURE, |
80 |
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|
JUNCTION |
60 |
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40 |
ILOAD |
= 10mA |
ILOAD = 100mA |
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|||
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I |
= 1mA |
I |
= 75mA |
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20 |
LOAD |
= 25mA |
LOAD |
= 150mA |
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ILOAD |
ILOAD |
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ILOAD |
= 50mA |
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0 |
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|
-046 |
|
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
|
|
|
|
|
VIN – VOUT (V) |
|
|
|
08343 |
||
|
Figure 44. WLCSP, 100 mm2 of PCB Copper, TA = 50°C |
|
|
|||||||
|
140 |
MAX JUNCTION |
|
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||
|
|
TEMPERATURE |
|
|
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|
(°C) |
120 |
|
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|
J |
100 |
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T |
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|
TEMPERATURE, |
80 |
|
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|
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|
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|
JUNCTION |
60 |
|
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|
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|
|
40 |
ILOAD |
= 10mA |
ILOAD = 100mA |
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|||
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|
I |
= 1mA |
I |
= 75mA |
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|
20 |
LOAD |
|
LOAD |
|
|
|
|
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|
|
ILOAD |
= 25mA |
ILOAD |
= 150mA |
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|
ILOAD |
= 50mA |
|
|
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|
0 |
|
|
|
|
|
|
|
|
-047 |
|
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
|
|
|
|
|
VIN – VOUT (V) |
|
|
|
08343 |
||
Figure 45. WLCSP, 0 mm2 of PCB Copper, TA = 50°C
140
MAX JUNCTION TEMPERATURE
(°C) |
120 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
J |
|
|
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|
T |
100 |
|
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|
|
TEMPERATURE, |
|
|
|
|
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|
|
80 |
|
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|
60 |
ILOAD = 1mA |
|
|
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||
|
ILOAD = 10mA |
|
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|
||
JUNCTION |
|
ILOAD = 25mA |
|
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|
40 |
ILOAD = 50mA |
|
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||
|
ILOAD = 75mA |
|
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||
|
ILOAD = 100mA |
|
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|
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|
||
20 |
ILOAD = 150mA |
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||
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|
|||
|
0 |
|
|
|
|
|
|
|
|
-049 |
|
0.5 |
1.0 |
1.5 |
2.0 |
2.5 |
3.0 |
3.5 |
4.0 |
4.5 |
|
|
|
|
|
VIN – VOUT (V) |
|
|
|
08343 |
||
Figure 46. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C
Rev. D | Page 16 of 19
