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Data Sheet

ADP150

 

 

To guarantee the performance of the ADP150, it is imperative

The ADP150 uses an internal soft start to limit the inrush current

that the effects of the dc bias, temperature, and tolerances on

when the output is enabled. The start-up time for the 3.3 V

the behavior of the capacitors be evaluated for each.

 

option is approximately 150 μs from the time the EN active

UNDERVOLTAGE LOCKOUT

 

threshold is crossed to when the output reaches 90% of its final

 

value. As shown in Figure 32, the start-up time is dependent on

The ADP150 has an internal undervoltage lockout circuit that

the output voltage setting.

 

 

 

disables all inputs and the output when the input voltage is less

 

 

 

 

 

T

 

 

than approximately 2.0 V. This ensures that the ADP150 inputs

 

 

 

 

 

 

 

EN

 

and output behave in a predictable manner during power-up.

 

 

 

 

 

 

ENABLE FEATURE

 

 

 

 

VOUT = 3.3V

 

The ADP150 uses the EN pin to enable and disable the VOUT

 

 

 

VOUT = 2.8V

 

pin under normal operating conditions. As shown in Figure 30,

 

 

 

 

 

 

 

 

 

when a rising voltage on EN crosses the active threshold, VOUT

 

 

 

VOUT = 1.8V

 

turns on. When a falling voltage on EN crosses the inactive

 

 

 

 

 

 

threshold, VOUT turns off.

 

1

 

 

 

 

 

 

 

 

 

 

 

3.5

 

 

 

 

 

 

 

 

3.0

 

 

 

 

 

 

-128

 

 

 

 

CH1 1V

CH2 1V

M40.0µs

A CH1 3.24V

 

 

 

 

08343

 

2.5

 

 

CH3 1V

CH4 1V

240.000ns

 

 

 

 

 

Figure 32. Typical Start-Up Time

 

 

 

 

 

 

 

OUT

2.0

 

 

CURRENT LIMIT AND THERMAL OVERLOAD

 

 

 

 

 

 

 

 

 

 

 

 

 

V

1.5

 

 

PROTECTION

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

The ADP150 is protected against damage due to excessive

 

 

 

power dissipation by current and thermal overload protection

 

 

 

 

 

0.5

 

 

circuits. The ADP150 is designed to limit current when the

 

0

 

 

output load reaches 260 mA (typical). When the output load

 

0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6

08343-101

exceeds 260 mA, the output voltage is reduced to maintain a

 

0

 

 

VEN

constant current limit.

 

 

 

 

 

 

 

 

 

 

 

Figure 30. Typical EN Pin Operation

 

 

Thermal overload protection is included, which limits the junction

As shown in Figure 30, the EN pin has hysteresis built in. This

temperature to a maximum of 150°C (typical). Under extreme

prevents on/off oscillations that can occur due to noise on the

conditions (that is, high ambient temperature and power dissipation)

EN pin as it passes through the threshold points.

 

when the junction temperature starts to rise above 150°C, the

The EN pin active/inactive thresholds are derived from the VIN

output is turned off, reducing the output current to zero. When

voltage; therefore, these thresholds vary with changing input

the junction temperature drops below 135°C, the output is turned

voltage. Figure 31 shows the typical EN active/inactive thresholds

on again and the output current is restored to its nominal value.

when the input voltage varies from 2.2 V to 5.5 V.

 

Consider the case where a hard short from VOUT to GND occurs.

 

1.1

 

 

 

 

 

 

 

At first, the ADP150 limits current so that only 260 mA is

 

1.0

 

 

 

 

 

 

 

conducted into the short. If self-heating of the junction is great

 

 

 

 

RISING

 

 

 

enough to cause its temperature to rise above 150°C, thermal

(V)

 

 

 

 

 

 

 

0.9

 

 

 

 

 

 

 

shutdown activates, turning off the output and reducing the

THRESHOLD

0.7

 

 

 

 

 

 

 

into the short, again causing the junction temperature to rise

 

0.8

 

 

 

 

 

 

 

output current to zero. As the junction temperature cools and

 

 

 

 

FALLING

 

 

 

drops below 135°C, the output turns on and conducts 260 mA

TYPICAL

 

 

 

 

 

 

 

0.6

 

 

 

 

 

 

 

causes a current oscillation between 260 mA and 0 mA that

 

 

 

 

 

 

 

 

 

above 150°C. This thermal oscillation between 135°C and 150°C

 

0.5

 

 

 

 

 

 

 

continues as long as the short remains at the output.

 

 

 

 

 

 

 

 

Current and thermal limit protections are intended to protect

 

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

the device against accidental overload conditions. For reliable

 

2.3

2.8

3.3

3.8

4.3

4.8

5.3

5.5

 

 

 

 

VIN (V)

 

 

08343102-

operation, device power dissipation must be externally limited

 

Figure 31. Typical EN Pin Thresholds vs. Input Voltage (VIN)

so that the junction temperatures do not exceed 125°C.

 

 

 

 

 

 

 

 

Rev. D | Page 13 of 19

ADP150

Data Sheet

 

 

THERMAL CONSIDERATIONS

In most applications, the ADP150 does not dissipate much heat due to its high efficiency. However, in applications with high ambient temperature and high supply voltage to output voltage differential, the heat dissipated in the package is large enough that it can cause the junction temperature of the die to exceed the maximum junction temperature of 125°C.

When the junction temperature exceeds 150°C, the converter enters thermal shutdown. It recovers only after the junction temperature decreases below 135°C to prevent any permanent damage. Therefore, thermal analysis for the chosen application is very important to guarantee reliable performance over all conditions. The junction temperature of the die is the sum of the ambient temperature of the environment and the temperature rise of the package due to the power dissipation, as shown in Equation 2.

To guarantee reliable operation, the junction temperature of the ADP150 must not exceed 125°C. To ensure that the junction temperature stays below 125°C, be aware of the parameters that contribute to the junction temperature changes. These parameters include ambient temperature, power dissipation in the power device, and thermal resistances between the junction and ambient air (θJA). The θJA number is dependent on the package assembly compounds that are used and the amount of copper used to solder the package GND pins to the PCB. Table 7 shows typical θJA values of the 5-lead TSOT and 4-ball WLCSP packages for various PCB copper sizes. Table 8 shows the typical ΨJB value of the 5-lead TSOT and 4-ball WLCSP.

Table 7. Typical θJA Values

 

 

θJA (°C/W)

 

 

 

 

Copper Size (mm2)

TSOT

 

WLCSP

01

170

 

260

50

152

 

159

100

146

 

157

300

134

 

153

500

131

 

151

 

 

 

 

1 Device soldered to minimum size pin traces.

Table 8. Typical ΨJB Values

 

ΨJB (°C/W)

TSOT

 

WLCSP

42.8

 

58.4

Use Equation 2 to calculate the junction temperature.

TJ = TA + (PD × θJA)

(2)

where:

TA is the ambient temperature.

PD is the power dissipation in the die, given by

PD = ((VIN VOUT) × ILOAD) + (VIN × IGND)

where:

ILOAD is the load current. IGND is the ground current.

VIN and VOUT are input and output voltages, respectively.

Power dissipation due to ground current is quite small and can be ignored. Therefore, the junction temperature equation simplifies to

TJ = TA + (((VIN VOUT) × ILOAD) × θJA)

(3)

As shown in the previous equation, for a given ambient temperature, input-to-output voltage differential, and continuous load current, there exists a minimum copper size requirement for the PCB to ensure that the junction temperature does not rise above 125°C. Figure 33 to Figure 46 show the junction temperature calculations for the different ambient temperatures, load currents, VIN-to-VOUT differentials, and areas of PCB copper.

140

MAX JUNCTION TEMPERATURE

(°C)

120

I

= 1mA

 

 

 

 

 

 

 

 

ILOADLOAD

= 10mA

 

 

 

 

 

 

 

J

 

I

= 25mA

 

 

 

 

 

 

 

T

100

ILOADLOAD

= 50mA

 

 

 

 

 

 

 

TEMPERATURE,

 

ILOAD

= 75mA

 

 

 

 

 

 

 

80

ILOAD

= 100mA

 

 

 

 

 

 

 

ILOAD

= 150mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

40

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-228

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

 

Figure 33. TSOT, 500 mm2 of PCB Copper, TA = 25°C

 

 

140 MAX JUNCTION TEMPERATURE

(°C)

120

ILOAD = 1mA

 

 

 

 

 

 

 

ILOAD = 10mA

 

 

 

 

 

 

J

 

ILOAD = 25mA

 

 

 

 

 

 

T

100

 

 

 

 

 

 

TEMPERATURE,

ILOAD = 50mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILOAD = 75mA

 

 

 

 

 

 

80

ILOAD = 100mA

 

 

 

 

 

 

 

ILOAD = 150mA

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

40

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

0.5

 

 

 

 

VIN – VOUT (V)

 

 

08343229-

 

 

Figure 34. TSOT, 100 mm2 of PCB Copper, TA = 25°C

 

Rev. D | Page 14 of 19

Data Sheet

ADP150

 

 

140

MAX JUNCTION TEMPERATURE

(°C)

120

I

= 1mA

 

 

 

 

 

 

 

 

ILOAD

= 10mA

 

 

 

 

 

 

 

 

 

LOAD

 

 

 

 

 

 

 

 

J

 

ILOAD

= 25mA

 

 

 

 

 

 

 

T

100

 

 

 

 

 

 

 

TEMPERATURE,

ILOAD

= 50mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILOAD

= 75mA

 

 

 

 

 

 

 

80

ILOAD

= 100mA

 

 

 

 

 

 

 

 

ILOAD

= 150mA

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

40

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-230

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

 

Figure 35. TSOT, 0 mm2 of PCB Copper, TA = 25°C

 

 

 

140

MAX JUNCTION TEMPERATURE

 

 

 

 

 

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

ILOAD

= 10mA

ILOAD = 100mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

= 1mA

I

= 75mA

 

 

 

 

 

20

LOAD

 

LOAD

 

 

 

 

 

 

 

 

ILOAD

= 25mA

ILOAD

= 150mA

 

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-231

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

 

Figure 36. TSOT, 500 mm2 of PCB Copper, TA = 50°C

 

 

 

140

MAX JUNCTION TEMPERATURE

 

 

 

 

 

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILOAD

= 1mA

ILOAD

= 75mA

 

 

 

 

 

20

ILOAD

= 10mA

ILOAD

= 100mA

 

 

 

 

 

 

ILOAD

= 25mA

ILOAD

= 150mA

 

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-232

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

Figure 37. TSOT, 100 mm2 of PCB Copper, TA = 50°C

 

140

MAX JUNCTION TEMPERATURE

 

 

 

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

40

ILOAD

= 10mA

ILOAD = 100mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

= 1mA

I

= 75mA

 

 

 

 

 

20

LOAD

= 25mA

LOAD

= 150mA

 

 

 

 

 

ILOAD

ILOAD

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

0

 

 

VIN – VOUT (V)

 

 

233-08343

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

Figure 38. TSOT, 0 mm2 of PCB Copper, TA = 50°C

140

MAX JUNCTION TEMPERATURE

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

T

100

 

 

 

 

 

 

 

 

 

TEMPERATURE,

 

 

 

 

 

 

 

 

 

80

 

 

 

 

 

 

 

 

 

60

ILOAD = 1mA

 

 

 

 

 

 

 

 

ILOAD = 10mA

 

 

 

 

 

 

 

JUNCTION

 

ILOAD = 25mA

 

 

 

 

 

 

 

40

ILOAD = 50mA

 

 

 

 

 

 

 

 

ILOAD = 75mA

 

 

 

 

 

 

 

 

ILOAD = 100mA

 

 

 

 

 

 

 

20

ILOAD = 150mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-248

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

Figure 39. TSOT, 100 mm2 of PCB Copper, Board Temperature = 85°C

140

MAX JUNCTION TEMPERATURE

(°C)

120

ILOAD = 1mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILOAD = 10mA

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

T

100

ILOAD = 25mA

 

 

 

 

 

 

 

TEMPERATURE,

 

ILOAD = 50mA

 

 

 

 

 

 

 

 

ILOAD = 75mA

 

 

 

 

 

 

 

80

ILOAD = 100mA

 

 

 

 

 

 

 

 

ILOAD = 150mA

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

40

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-042

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

Figure 40. WLCSP, 500 mm2 of PCB Copper, TA = 25°C

 

 

Rev. D | Page 15 of 19

ADP150

140

MAX JUNCTION TEMPERATURE

(°C)

120

ILOAD = 1mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ILOAD = 10mA

 

 

 

 

 

 

J

 

 

 

 

 

 

 

T

100

ILOAD = 25mA

 

 

 

 

 

 

TEMPERATURE,

 

ILOAD = 50mA

 

 

 

 

 

 

 

ILOAD = 75mA

 

 

 

 

 

 

80

ILOAD = 100mA

 

 

 

 

 

 

 

ILOAD = 150mA

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

40

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

0.5

 

 

 

 

VIN – VOUT (V)

 

 

08343043-

 

Figure 41. WLCSP, 100 mm2 of PCB Copper, TA = 25°C

 

 

140

MAX JUNCTION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TEMPERATURE

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

ILOAD

= 1mA

ILOAD

= 50mA

 

ILOAD = 100mA

 

 

 

 

ILOAD

= 10mA

ILOAD

= 75mA

 

ILOAD = 150mA

 

 

 

0

ILOAD

= 25mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

-044

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

 

Figure 42. WLCSP, 0 mm2 of PCB Copper, TA = 25°C

 

 

 

140

MAX JUNCTION TEMPERATURE

 

 

 

 

 

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

ILOAD

= 10mA

ILOAD = 100mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

= 1mA

I

= 75mA

 

 

 

 

 

 

20

LOAD

= 25mA

LOAD

= 150mA

 

 

 

 

 

 

ILOAD

ILOAD

 

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-045

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

Figure 43. WLCSP, 500 mm2 of PCB Copper, TA = 50°C

Data Sheet

 

140

MAX JUNCTION TEMPERATURE

 

 

 

 

 

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

ILOAD

= 10mA

ILOAD = 100mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

= 1mA

I

= 75mA

 

 

 

 

 

 

20

LOAD

= 25mA

LOAD

= 150mA

 

 

 

 

 

 

ILOAD

ILOAD

 

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-046

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

 

Figure 44. WLCSP, 100 mm2 of PCB Copper, TA = 50°C

 

 

 

140

MAX JUNCTION

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TEMPERATURE

 

 

 

 

 

 

 

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

100

 

 

 

 

 

 

 

 

 

T

 

 

 

 

 

 

 

 

 

TEMPERATURE,

80

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

JUNCTION

60

 

 

 

 

 

 

 

 

 

40

ILOAD

= 10mA

ILOAD = 100mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

= 1mA

I

= 75mA

 

 

 

 

 

 

20

LOAD

 

LOAD

 

 

 

 

 

 

 

 

ILOAD

= 25mA

ILOAD

= 150mA

 

 

 

 

 

 

ILOAD

= 50mA

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-047

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

Figure 45. WLCSP, 0 mm2 of PCB Copper, TA = 50°C

140

MAX JUNCTION TEMPERATURE

(°C)

120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

T

100

 

 

 

 

 

 

 

 

 

TEMPERATURE,

 

 

 

 

 

 

 

 

 

80

 

 

 

 

 

 

 

 

 

60

ILOAD = 1mA

 

 

 

 

 

 

 

 

ILOAD = 10mA

 

 

 

 

 

 

 

JUNCTION

 

ILOAD = 25mA

 

 

 

 

 

 

 

40

ILOAD = 50mA

 

 

 

 

 

 

 

 

ILOAD = 75mA

 

 

 

 

 

 

 

 

ILOAD = 100mA

 

 

 

 

 

 

 

20

ILOAD = 150mA

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

-049

 

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

 

 

 

 

VIN – VOUT (V)

 

 

 

08343

Figure 46. WLCSP, 100 mm2 of PCB Copper, Board Temperature = 85°C

Rev. D | Page 16 of 19

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