LM2597, LM2597HV
www.ti.com |
SNVS119D –MARCH 1998 –REVISED MAY 2016 |
12 Device and Documentation Support
12.1 Related Links
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.
Table 7. Related Links
PARTS |
PRODUCT FOLDER |
SAMPLE & BUY |
TECHNICAL |
TOOLS & |
SUPPORT & |
|
DOCUMENTS |
SOFTWARE |
COMMUNITY |
||||
|
|
|
||||
LM2597 |
Click here |
Click here |
Click here |
Click here |
Click here |
|
LM2597HV |
Click here |
Click here |
Click here |
Click here |
Click here |
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
SIMPLE SWITCHER is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 1998–2016, Texas Instruments Incorporated |
Submit Documentation Feedback |
39 |
Product Folder Links: LM2597 LM2597HV
PACKAGE OPTION ADDENDUM
www.ti.com |
30-Sep-2021 |
|
|
PACKAGING INFORMATION
Orderable Device |
Status |
Package Type |
Package |
Pins |
Package |
Eco Plan |
Lead finish/ |
MSL Peak Temp |
Op Temp (°C) |
Device Marking |
Samples |
|
|
(1) |
|
Drawing |
|
Qty |
(2) |
Ball material |
(3) |
|
(4/5) |
|
|
|
|
|
|
|
|
|
(6) |
|
|
|
|
|
LM2597HVM-12/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
Call TI | SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-12 |
|
|
LM2597HVM-3.3/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-3.3 |
|
|
LM2597HVM-5.0/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-5.0 |
|
|
LM2597HVM-ADJ |
NRND |
SOIC |
D |
8 |
95 |
Non-RoHS |
Call TI |
Level-1-235C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
& Green |
|
|
|
M-ADJ |
|
|
LM2597HVM-ADJ/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-ADJ |
|
|
LM2597HVMX-12/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-12 |
|
|
LM2597HVMX-3.3/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-3.3 |
|
|
LM2597HVMX-5.0/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-5.0 |
|
|
LM2597HVMX-ADJ/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597H |
|
|
|
|
|
|
|
|
|
|
|
|
M-ADJ |
|
|
LM2597HVN-12/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
SN |
Level-1-NA-UNLIM |
-40 to 125 |
LM2597HV |
|
|
|
|
|
|
|
|
|
|
|
|
N-12 P+ |
|
|
LM2597HVN-3.3/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
-40 to 125 |
LM2597HV |
|
|
|
|
|
|
|
|
|
|
|
|
N-3.3 P+ |
|
|
LM2597HVN-5.0/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
-40 to 125 |
LM2597HV |
|
|
|
|
|
|
|
|
|
|
|
|
N-5.0 P+ |
|
|
LM2597HVN-ADJ/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
-40 to 125 |
LM2597HV |
|
|
|
|
|
|
|
|
|
|
|
|
N-ADJ P+ |
|
|
LM2597M-12/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
|
|
|
|
M-12 |
|
|
LM2597M-3.3/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
|
|
|
|
M-3.3 |
|
|
LM2597M-5.0 |
NRND |
SOIC |
D |
8 |
95 |
Non-RoHS |
Call TI |
Level-1-235C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
& Green |
|
|
|
M-5.0 |
|
|
LM2597M-5.0/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
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|
|
|
|
|
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|
|
|
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|
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com |
30-Sep-2021 |
|
|
Orderable Device |
Status |
Package Type |
Package |
Pins |
Package |
Eco Plan |
Lead finish/ |
MSL Peak Temp |
Op Temp (°C) |
Device Marking |
Samples |
|
(1) |
|
Drawing |
|
Qty |
(2) |
Ball material |
(3) |
|
(4/5) |
|
|
|
|
|
|
|
|
(6) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
M-5.0 |
|
LM2597M-ADJ/NOPB |
ACTIVE |
SOIC |
D |
8 |
95 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597 |
|
|
|
|
|
|
|
|
|
|
|
M-ADJ |
|
LM2597MX-12/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
|
|
|
M-12 |
|
LM2597MX-3.3/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
|
|
|
M-3.3 |
|
LM2597MX-5.0/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
|
2597 |
|
|
|
|
|
|
|
|
|
|
|
M-5.0 |
|
LM2597MX-ADJ/NOPB |
ACTIVE |
SOIC |
D |
8 |
2500 |
RoHS & Green |
SN |
Level-1-260C-UNLIM |
-40 to 125 |
2597 |
|
|
|
|
|
|
|
|
|
|
|
M-ADJ |
|
LM2597N-12/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
|
LM2597N |
|
|
|
|
|
|
|
|
|
|
|
-12 P+ |
|
LM2597N-3.3/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
|
LM2597N |
|
|
|
|
|
|
|
|
|
|
|
-3.3 P+ |
|
LM2597N-5.0/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
|
LM2597N |
|
|
|
|
|
|
|
|
|
|
|
-5.0 P+ |
|
LM2597N-ADJ/NOPB |
ACTIVE |
PDIP |
P |
8 |
40 |
RoHS & Green |
Call TI | SN |
Level-1-NA-UNLIM |
-40 to 125 |
LM2597N |
|
|
|
|
|
|
|
|
|
|
|
-ADJ P+ |
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.
(3)MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com |
30-Sep-2021 |
|
|
(5)Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceedthe total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com |
4-Feb-2016 |
|
|
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device |
Package |
Package |
Pins |
SPQ |
Reel |
Reel |
A0 |
B0 |
K0 |
P1 |
W |
Pin1 |
|
Type |
Drawing |
|
|
Diameter |
Width |
(mm) |
(mm) |
(mm) |
(mm) |
(mm) |
Quadrant |
|
|
|
|
|
(mm) |
W1 (mm) |
|
|
|
|
|
|
LM2597HVMX-12/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
LM2597HVMX-3.3/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
LM2597HVMX-5.0/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
LM2597HVMX-ADJ/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
LM2597MX-12/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
LM2597MX-3.3/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
LM2597MX-5.0/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
LM2597MX-ADJ/NOPB |
SOIC |
D |
8 |
2500 |
330.0 |
12.4 |
6.5 |
5.4 |
2.0 |
8.0 |
12.0 |
Q1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com |
4-Feb-2016 |
|
|
*All dimensions are nominal
Device |
Package Type |
Package Drawing |
Pins |
SPQ |
Length (mm) |
Width (mm) |
Height (mm) |
|
|
|
|
|
|
|
|
LM2597HVMX-12/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
LM2597HVMX-3.3/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
|
|
|
|
|
|
|
|
LM2597HVMX-5.0/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
|
|
|
|
|
|
|
|
LM2597HVMX-ADJ/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
LM2597MX-12/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
|
|
|
|
|
|
|
|
LM2597MX-3.3/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
|
|
|
|
|
|
|
|
LM2597MX-5.0/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
LM2597MX-ADJ/NOPB |
SOIC |
D |
8 |
2500 |
367.0 |
367.0 |
35.0 |
|
|
|
|
|
|
|
|
Pack Materials-Page 2
|
|
PACKAGE OUTLINE |
D0008A |
|
SOIC - 1.75 mm max height |
|
SCALE 2.800 |
|
|
|
SMALL OUTLINE INTEGRATED CIRCUIT |
|
|
|
|
|
C |
|
|
|
|
|
|
SEATING PLANE |
|
|
.228-.244 TYP |
|
|
|
|
|
|
[5.80-6.19] |
|
|
|
.004 [0.1] C |
|
A |
PIN 1 ID AREA |
|
|
|
|
|
|
|
|
|
|
||
|
6X |
.050 |
|
|
|
|
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|
|
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|
||
|
|
8 |
[1.27] |
|
|
|
1 |
|
|
|
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|
|
|
|
|
|
|
.189-.197 |
|
2X |
|
|
|
|
[4.81-5.00] |
|
.150 |
|
|
|
|
NOTE 3 |
|
[3.81] |
|
|
|
|
|
|
|
|
4X (0 -15 ) |
|
|
4 |
|
|
|
|
|
|
|
|
5 |
|
|
|
|
|
|
8X .012-.020 |
|
|
||
B |
.150-.157 |
[0.31-0.51] |
.069 MAX |
|
||
|
[3.81-3.98] |
.010 [0.25] |
C A B |
|
||
|
[1.75] |
|
||||
|
NOTE 4 |
|
|
|
|
|
|
|
.005-.010 |
TYP |
|
|
|
|
|
[0.13-0.25] |
|
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|
4X (0 -15 ) |
|
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|
SEE DETAIL A |
|
|
|
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|
.010 |
|
|
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|
|
[0.25] |
|
|
|
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|
|
0 - 8 |
|
|
.004-.010 |
|
|
|
|
|
[0.11-0.25] |
||
|
|
|
|
|
||
|
|
.016-.050 |
|
|
|
|
|
|
[0.41-1.27] |
|
DETAIL A |
|
|
|
|
|
|
(.041) |
TYPICAL |
|
|
|
|
|
[1.04] |
|
|
|
|
|
|
|
4214825/C |
02/2019 |
NOTES: |
|
|
|
|
|
|
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
www.ti.com
|
EXAMPLE BOARD LAYOUT |
D0008A |
SOIC - 1.75 mm max height |
|
SMALL OUTLINE INTEGRATED CIRCUIT |
8X (.061 ) |
|
|
|
[1.55] |
SYMM |
|
SEE |
|
|
||
|
1 |
|
DETAILS |
|
|
|
|
|
|
8 |
|
8X (.024) |
|
|
|
[0.6] |
|
|
SYMM |
|
|
|
|
|
|
|
(R.002 ) TYP |
|
|
5 |
[0.05] |
|
4 |
|
|
6X (.050 ) |
|
|
|
|
|
|
|
[1.27] |
(.213) |
|
|
|
|
|
|
|
[5.4] |
|
|
|
LAND PATTERN EXAMPLE |
|
|
|
EXPOSED METAL SHOWN |
|
|
|
SCALE:8X |
|
|
METAL |
SOLDER MASK |
SOLDER MASK |
METAL UNDER |
|
OPENING |
OPENING |
|||
|
SOLDER MASK |
|||
|
|
|
||
EXPOSED |
|
EXPOSED |
|
|
METAL |
|
|
||
|
METAL |
|
||
|
.0028 MAX |
.0028 MIN |
||
|
|
|||
|
[0.07] |
|
[0.07] |
|
|
ALL AROUND |
|
ALL AROUND |
|
NON SOLDER MASK |
|
SOLDER MASK |
||
|
DEFINED |
|
DEFINED |
|
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
6.Publication IPC-7351 may have alternate designs.
7.Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
|
EXAMPLE STENCIL DESIGN |
D0008A |
SOIC - 1.75 mm max height |
|
SMALL OUTLINE INTEGRATED CIRCUIT |
8X (.061 |
) |
|
|
[1.55] |
|
SYMM |
|
|
1 |
|
|
|
|
8 |
|
8X (.024) |
|
|
|
[0.6] |
|
|
SYMM |
|
|
|
|
|
|
|
(R.002 ) TYP |
|
4 |
5 |
[0.05] |
|
|
||
6X (.050 ) |
|
|
|
|
|
|
|
[1.27] |
|
(.213) |
|
|
|
|
|
|
|
[5.4] |
|
|
|
SOLDER PASTE EXAMPLE |
|
|
BASED ON .005 INCH [0.125 MM] THICK STENCIL |
|
|
|
|
SCALE:8X |
|
4214825/C 02/2019
NOTES: (continued)
8.Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
9.Board assembly site may have different recommendations for stencil design.
www.ti.com
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