SLVSCE8C –JANUARY 2015–REVISED SEPTEMBER 2018

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MIN

MAX

UNIT

Input voltage

Unregulated input, IN

–40

45

V

EN, EN1, and EN2

–0.3

45

V

(3)(4)

–0.3

6

V

Regulated output(2)

VCC

OUT1 and OUT2

–0.3

45

V

SENSE, SENSE1, and SENSE2(3)(4)

–0.3

V + 0.3

V

Low-voltage pins

CC

LIM, LIM1, LIM2,

, SENSE_SEL,

FB, FB1, and

SENSE_EN

ERR,

–0.3

7

V

FB2(3)(4)

Operating junction temperature, TJ

–40

150

°C

Operating ambient temperature, TA

–40

125

°C

Storage Temperature, Tstg

–65

150

°C

6.2

ESD Ratings

VALUE

UNIT

Human body model (HBM), per AEC Q100-002(1)

±2000

V(ESD)

Electrostatic discharge

Charged device model (CDM), per AEC

Corner pins (1, 8, 9, and 16)

±750

V

Q100-011

Other pins

±500

MIN

MAX

UNIT

VI

Unregulated input

4.5

40

V

EN, EN1, and EN2

0

40

V

Low-voltage pins

SENSE, SENSE1, SENSE2,

SENSE_EN

, SEN_SEL ,

0

5.3

V

ERR , FB, FB1, FB2, LIM, LIM1, LIM2, and VCC

OUT1, OUT2, and OUT

Normal-mode operation

1.5

20

V

Switched-mode operation

1.5

35

CO

Output capacitor stability range

2.2

100

µF

CO(ESR)

Output capacitor ESR stability range

0.001

5

Ω

TJ

Junction temperature

–40

150

°C

TA

Ambient temperature

–40

125

°C

4

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TPS7B7701-Q1

TPS7B7702-Q1

THERMAL METRIC(1)

PWP

PWP

UNIT

(HTSSOP)

(HTSSOP)

16 PINS

16 PINS

R

Junction-to-ambient thermal resistance (2)

45.9

40.3

°C/W

θJA

RθJC(top)

Junction-to-case (top) thermal resistance

29.2

27.7

°C/W

RθJB

Junction-to-board thermal resistance

24.7

22.3

°C/W

ψJT

Junction-to-top characterization parameter

1.3

0.8

°C/W

ψJB

Junction-to-board characterization parameter

24.5

22

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

3.7

2.7

°C/W

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

SUPPLY VOLTAGE AND CURRENT (IN)

VI

Input voltage

4.5

40

V

TPS7B7701-Q1: VI = 4.5 to 40 V, V(EN) ≥ 2 V,

0.6

1

I(OUT) = 0.1 mA

IQ

Quiescent current

mA

TPS7B7702-Q1: VI = 4.5 to 40 V, V(EN1)

and

0.6

1

V(EN2) ≥ 2 V, I(OUT1) and I(OUT2) = 0.1 mA

I(shutdown)

Shutdown current

TPS7B7701-Q1: EN = GND

5

µA

TPS7B7702-Q1: EN1 = EN2 = GND

5

TPS7B7701-Q1: V(EN) ≥ 2 V, I(OUT) ≤ 300 mA,

4.5

GND current

Inom

Operating current

mA

TPS7B7702-Q1: V(EN1) and V(EN2) ≥ 2 V, I(OUT1)

6

and I(OUT2) ≤ 300 mA, GND current

V(BG)

Bandgap

Reference voltage for FB

–2%

1.233

2%

V

V(UVLO)

Undervoltage lockout falling

Ramp IN down until the output turns off

4

V

Vhys

Hysteresis

0.4

V

INPUT CONTROL PINS (EN, EN1, EN2,

AND SENSE_SEL)

SENSE_EN,

VIL

Logic input low level

For EN, EN1, EN2,

SENSE_EN,

and

0

0.7

V

SENSE_SEL

For EN, EN1, EN2,

and

VIH

Logic input high level

SENSE_EN,

2

V

SENSE_SEL

II(SENSE_EN)

input current

V(SENSE_EN) = 5 V, V(ENx) ≥ 2 V

10

µA

SENSE_EN

II(SENSE_SEL)

SENSE_SEL input current

V(SENSE_EN) = 5 V, V(ENx) ≥ 2 V

10

µA

II(EN)

Enable input current

V(ENx) ≤ 40 V

10

µA

REGULATED OUTPUT (OUT, OUT1, AND OUT2)

VO

Regulated output

40 V ≥ VI ≥ VO + 1.5 V and VI ≥ 4.5 V, IO = 1 to

–2%

2%

300 mA(1)

VO(

VI)

Line regulation

VI = VO + 1.5 V to 40 V and VI ≥ 6 V, IO = 10

10

mV

mA, voltage variation on FB pin

VO(

IO)

Load regulation

IO = 1 mA to 200 mA, voltage variation on FB

20

mV

pin

V(DROPOUT)

Dropout voltage

Measured between IN and OUTx, IO = 100 mA

500

mV

IO

Output current

VO in regulation

0

300

mA

PSRR

Power supply ripple rejection(2)

IO = 100 mA, CO = 2.2 µF, ƒ = 100 Hz

73

dB

CURRENT SENSE AND CURRENT-LIMIT

IO/ISENSE

OUTx to SENSEx current ratio (IO / ISENSEx)

VI = 4.5 V to 40 V, 5 mA ≤ IO ≤ 300 mA

198

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PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

IO = 100 to 300 mA

–3%

3%

OUTx to SENSEx current ratio accuracy

IO = 50 to 100 mA

–5%

5%

IO = 10 to 50 mA

–10%

10%

IO = 5 to 10 mA

–20%

20%

IO/ILIM

OUTx to LIMx current ratio (IO / ILIM)

VI = 4.5 V to 40 V, 50 mA ≤ I(LIMx) ≤ 300 mA

198

I(LIMx)

Programmable current-limit accuracy(3)

VI = 4.5 V to 40 V, 50 mA ≤ I(LIMx) ≤ 300 mA

–8%

8%

IL(LIMx)

Internal current-limit

LIMx shorted to GND

340

550

mA

Ilkg

SENSE, SENSE1, SENSE2, LIM, LIM1,

ENx = GND, TA = 25°C

2

µA

and LIM2 leakage current

V(LIMx_th)

Current-limit threshold voltage

Voltage on the LIM, LIM1, and LIM2 pins when

1.233

V

output current is limited

V(SENSEx_stb)

Current-sense short-to-battery fault voltage

When short-to-battery or reverse current

3.05

3.2

3.3

V

conditions are detected

V(SENSEx_tsd)

Current-sense thermal shutdown fault

When thermal shutdown is detected

2.7

2.85

3

V

voltage

V(SENSEx_cl)

Current-sense current-limit fault voltage

When current-limit conditions are detected

2.4

2.55

2.65

V

When short-to-battery, reverse current, thermal

I(SENSEx_H)

Current-sense fault condition current

shutdown, or current-limit conditions are

3.3

mA

detected

FAULT DETECTION

V(stb_th)

Short-to-battery threshold

V(OUTx) – VI, checked during turnon sequence

–500

–55

110

mV

I(REV)

Reverse current detection level

Power FET on (SW or LDO mode)

–100

–40

–1

mA

TSD

Thermal shutdown

Junction temperature

175

°C

TSD(hys)

Thermal shutdown hysteresis

15

°C

INTERFACE CIRCUITRY

VOL

ERR

output low

I(SINK) = 5 mA

0.4

V

high impedance, 5-V external voltage is

ERR

Ilkg

ERR open-drain leakage current

1

µA

applied at ERR

R(OUTx-off)

OUT pulldown resistor(2)

ENx = GND

50

kΩ

IR(lkg)

Reverse leakage current

–40 V < VI < 0 V, reverse current to IN

0.6

mA

VCC

Internal voltage regulator

VI = 5.5 to 40 V, ICC = 0 mA

4.25

4.5

4.75

V

ICC(lim)

Internal voltage-regulator current-limit

15

70

mA

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

CURRENT SENSE AND CURRENT-LIMIT

td(SENSE_SEL_r)

Current-sense delay time from the rising edge

V(ENx) ≥ 2 V,

SENSE_EN

= GND,

10

µs

of SENSE_SEL(1)

SENSE_SEL rise from 0 to 5 V

Current-sense delay time from the falling edge

V(ENx) ≥ 2 V,

= GND,

td(SENSE_SEL_f)

SENSE_EN

10

µs

of SENSE_SEL(1)

SENSE_SEL fall from 5 to 0 V

Current-sense delay time from rising edge of

V(ENx) ≥ 2 V,

rise from 0 to

td(SENSE_EN_r)

SENSE_EN

10

µs

SENSE_EN(1)

5 V

Current-sense delay time from falling edge of

V(ENx) ≥ 2 V,

fall from 5 to

td(SENSE_EN_f)

SENSE_EN

10

µs

SENSE_EN(1)

0 V

FAULT DETECTION

Reverse current (Short-to-BAT) shutdown

Delay to shut down the switch or LDO

t(PD_RC)

after a drop over ron becomes negative,

5

20

µs

deglitch time

I(OUTx) = –200 mA (typical), TA = 25°C

Blanking time for reverse-current

t(BLK_RC)

Reverse current blanking time

detection after power up, the rising

16

ms

edge of the ENx pin, or the current

limiting event is over

6

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SLVSCE8C –JANUARY 2015–REVISED SEPTEMBER 2018

at VI = 14 V (unless otherwise specified)

4.5

3

4

2.5

(mA)

3.5

(mA)

2

Current

3

Current

2.5

1.5

Quiescent

2

Quiescent

1

1.5

1

40qC

0.5

40qC

q

q

25 C

25 C

0.5

125qC

0

125qC

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Output Current (mA)

D001

Output Current (mA)

D012

Figure 1. Quiescent Current vs Output Current

Figure 2. Quiescent Current vs Output Current

(TPS7B7702-Q1)

(TPS7B7701-Q1)

3.5

0.8

3

0.75

(PA)

2.5

(mA)

0.7

Current

Current

2

0.65

Shutdown

1.5

Quiescent

1

0.6

0.5

I(shutdown) (VI = 13.5 V)

0.55

0

I(shutdown) (VI = 40 V)

0.5

-40

-25

-10

5

20

35

50

65

80

95

110 125

-40

-25

-10

5

20

35

50

65

80

95

110 125

Ambient Temperature (qC)

D002

Ambient Temperature (qC)

D003

IO = 0.1 mA

Figure 3. Shutdown Current vs Ambient Temperature

Figure 4. Quiescent Current vs Ambient Temperature

(TPS7B7702-Q1)

(TPS7B7702-Q1)

0.6

1.28

1.27

0.55

1.26

Quiescent Current (mA)

0.5

FB Voltage (V)

1.25

1.24

0.45

1.23

1.22

0.4

1.21

1.2

0.35

1.19

0.3

1.18

-40

-25

-10

5

20

35

50

65

80

95

110 125

-40

-25

-10

5

20

35

50

65

80

95

110 125

Ambient Temperature (qC)

D013

Ambient Temperature (qC)

D004

IO = 0.1 mA

IO = 10 mA

Figure 5. Quiescent Current vs Ambient Temperature

Figure 6. FB Voltage vs Ambient Temperature

(TPS7B7701-Q1)

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at VI = 14 V (unless otherwise specified)

1500

306

1400

40qC

1300

25qC

304

1200

125qC

302

Voltage (V)

1100

Limit (mA)

1000

300

900

800

298

700

Dropout

Current

600

296

500

400

294

300

200

292

100

0

290

0

30

60

90

120

150

180

210

240

270

300

-40

-25

-10

5

20

35

50

65

80

95

110

125

Output Current (mA)

D005

Ambient Temperature (qC)

D006

ILIM = 300 mA

Figure 7. Dropout Voltage vs Output Current

Figure 8. Current Limit vs Ambient Temperature

120

0.52

(dB)

0.516

40qC

25qC

100

0.512

125qC

Power Supply Rejection Ration

Current Sense Ratio, 1/'i

80

0.508

0.504

60

0.5

0.496

40

0.492

20