DISCRETE SEMICONDUCTORS
M3D176
BA316; BA317; BA318
High-speed diodes
Product specification |
1996 Apr 03 |
Supersedes data of April 1992
File under Discrete Semiconductors, SC01
Philips Semiconductors |
Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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FEATURES
∙Hermetically sealed leaded glass SOD27 (DO-35) package
∙High switching speed: max. 4 ns
∙General application
∙Continuous reverse voltage: 10 V, 30 V, 50 V
∙Repetitive peak reverse voltage: max. 15 V, 40 V, 60 V
∙Repetitive peak forward current: max. 225 mA
∙Forward voltage: max. 1.1 V.
APPLICATIONS
∙ High-speed switching.
DESCRIPTION
The BA316, BA317, BA318 are high-speed switching diodes fabricated in planar technology, and encapsulated in hermetically sealed leaded glass SOD27 (DO-35) packages.
k |
a |
handbook, halfpage |
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MAM246
The diodes are type branded.
Fig.1 Simplified outline (SOD27; DO-35) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
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VRRM |
repetitive peak reverse voltage |
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− |
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BA316 |
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− |
15 |
V |
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BA317 |
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40 |
V |
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BA318 |
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60 |
V |
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VR |
continuous reverse voltage |
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BA316 |
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− |
10 |
V |
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BA317 |
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30 |
V |
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BA318 |
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50 |
V |
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IF |
continuous forward current |
see Fig.2; note 1 |
− |
100 |
mA |
IFRM |
repetitive peak forward current |
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− |
225 |
mA |
IFSM |
non-repetitive peak forward current |
square wave; Tj = 25 °C prior to |
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surge; see Fig.4 |
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t = 1 μs |
− |
4 |
A |
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t = 1 ms |
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1 |
A |
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t = 1 s |
− |
0.5 |
A |
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Ptot |
total power dissipation |
Tamb = 25 °C; note 1 |
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350 |
mW |
Tstg |
storage temperature |
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−65 |
+200 |
°C |
Tj |
junction temperature |
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− |
200 |
°C |
Note
1. Device mounted on an FR4 printed circuit-board; lead length 10 mm.
1996 Apr 03 |
2 |
Philips Semiconductors |
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Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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ELECTRICAL CHARACTERISTICS |
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Tj = 25 °C; unless otherwise specified. |
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
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VF |
forward voltage |
see Fig.3 |
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IF = 1 mA |
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700 |
mV |
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IF = 10 mA |
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850 |
mV |
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IF = 100 mA |
− |
1100 |
mV |
IR |
reverse current |
see Fig.5 |
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BA316 |
VR = 10 V |
− |
200 |
nA |
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VR = 10 V; Tj = 150 °C |
− |
100 |
μA |
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BA317 |
VR = 10 V |
− |
50 |
nA |
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VR = 30 V |
− |
200 |
nA |
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VR = 30 V; Tj = 150 °C |
− |
100 |
μA |
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BA318 |
VR = 30 V |
− |
50 |
nA |
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VR = 50 V |
− |
200 |
nA |
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VR = 50 V; Tj = 150 °C |
− |
100 |
μA |
Cd |
diode capacitance |
f = 1 MHz; VR = 0; see Fig.6 |
− |
2 |
pF |
trr |
reverse recovery time |
when switched from IF = 10 mA to |
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4 |
ns |
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IR = 60 mA; RL = 100 Ω; |
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measured at IR = 1 mA; see Fig.7 |
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Vfr |
forward recovery voltage |
when switched from IF = 50 mA; |
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2.5 |
V |
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tr = 20 ns; see Fig.8 |
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THERMAL CHARACTERISTICS
SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT |
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Rth j-tp |
thermal resistance from junction to tie-point |
lead length 10 mm |
240 |
K/W |
Rth j-a |
thermal resistance from junction to ambient |
lead length 10 mm; note 1 |
500 |
K/W |
Note
1. Device mounted on a printed circuit-board without metallization pad.
1996 Apr 03 |
3 |
Philips Semiconductors |
Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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GRAPHICAL DATA |
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200 |
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MBG452 |
300 |
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MBG465 |
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handbook, halfpage |
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handbook, halfpage |
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IF |
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IF |
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(mA) |
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(mA) |
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200 |
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(1) |
(2) |
(3) |
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100 |
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100 |
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0 |
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o |
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0 |
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0 |
100 |
Tamb |
C) |
200 |
0 |
1 |
VF (V) |
2 |
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( |
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(1) |
Tj = 175 °C; typical values. |
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(2) |
Tj = 25 |
°C; typical values. |
Device mounted on an FR4 printed-circuit board; lead length 10 mm. |
(3) |
Tj = 25 |
°C; maximum values. |
Fig.2 Maximum permissible continuous forward |
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Fig.3 Forward current as a function of |
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current as a function of ambient temperature. |
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forward voltage. |
MBG704
102 handbook, full pagewidth
IFSM
(A)
10
1
10−1
1 |
10 |
102 |
103 |
tp (μs) |
104 |
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Based on square wave currents.
Tj = 25 °C prior to surge.
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
1996 Apr 03 |
4 |
Philips Semiconductors |
Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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103 |
MGD008 |
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handbook, halfpage
IR
(μA) 102
10
1
10−1
10−2
0 |
100 |
200 |
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Tj |
(oC) |
VR = VRmax.
Solid line; maximum values.
Dotted line; typical values.
Fig.5 Reverse current as a function of junction temperature.
MGD004
1.2 handbook, halfpage
Cd (pF)
1.0
0.8
0.6
0.4
0 |
10 |
VR |
(V) |
20 |
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f = 1 MHz; Tj = 25 °C.
Fig.6 Diode capacitance as a function of reverse voltage; typical values.
1996 Apr 03 |
5 |
Philips Semiconductors |
Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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handbook, full pagewidth |
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t r |
t p |
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t |
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D.U.T. |
10% |
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R = 50 Ω |
IF |
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I F |
t rr |
S |
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SAMPLING |
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t |
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OSCILLOSCOPE |
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V = VR IF x R S |
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R i = 50 Ω |
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90% |
(1) |
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VR |
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MGA881 |
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input signal |
output signal |
(1) IR = 1 mA.
Fig.7 Reverse recovery voltage test circuit and waveforms.
I |
1 k Ω |
450 Ω |
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I |
90% |
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V |
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RS = 50 Ω |
OSCILLOSCOPE |
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V fr |
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D.U.T. |
Ω |
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R i = 50 |
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10% |
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MGA882 |
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t |
t |
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t r |
t p |
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input |
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output |
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signal |
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signal |
Fig.8 Forward recovery voltage test circuit and waveforms.
1996 Apr 03 |
6 |
Philips Semiconductors |
Product specification |
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High-speed diodes |
BA316; BA317; BA318 |
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PACKAGE OUTLINE |
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handbook, full pagewidth |
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0.56 |
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max |
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1.85 |
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25.4 min |
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4.25 |
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25.4 min |
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MLA428 - 1 |
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max |
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max |
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Dimensions in mm. |
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Fig.9 SOD27 (DO-35). |
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DEFINITIONS |
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Data Sheet Status |
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Objective specification |
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This data sheet contains target or goal specifications for product development. |
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Preliminary specification |
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This data sheet contains preliminary data; supplementary data may be published later. |
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Product specification |
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This data sheet contains final product specifications. |
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Limiting values |
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Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Apr 03 |
7 |