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DISCRETE SEMICONDUCTORS

M3D176

1N4150; 1N4151; 1N4153

High-speed diodes

Product specification

1996 Apr 19

Supersedes data of April 1992

File under Discrete Semiconductors, SC01

Philips Semiconductors

Product specification

 

 

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

 

 

FEATURES

Hermetically sealed leaded glass SOD27 (DO-35) package

High switching speed: max. 4 ns

General application

Continuous reverse voltage: max. 50 V

Repetitive peak reverse voltage: max. 75 V

Repetitive peak forward current: max. 600 mA and 450 mA respectively

Forward voltage: max. 1 V.

APPLICATIONS

High-speed switching

DESCRIPTION

The 1N4150, 1N4151, 1N4153 are high-speed switching diodes fabricated in planar technology, and encapsulated in hermetically sealed leaded glass SOD27 (DO-35) packages.

k

a

handbook, halfpage

 

MAM246

The diodes are type branded.

Fig.1 Simplified outline (SOD27; DO-35) and symbol.

1N4150: general purpose use in computer and industrial applications

1N4151 and 1N4153: military and industrial applications.

1996 Apr 19

2

Philips Semiconductors

 

 

 

Product specification

 

 

 

 

 

 

 

High-speed diodes

 

1N4150; 1N4151; 1N4153

 

 

 

 

 

 

 

LIMITING VALUES

 

 

 

 

 

In accordance with the Absolute Maximum Rating System (IEC 134).

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

 

MIN.

MAX.

UNIT

 

 

 

 

 

 

 

VRRM

repetitive peak reverse voltage

 

 

 

 

 

 

1N4151

 

 

75

V

 

1N4153

 

 

75

V

 

 

 

 

 

 

 

VR

continuous reverse voltage

 

 

50

V

IF

continuous forward current

see Fig.2; note 1

 

 

 

 

 

1N4150

 

 

300

mA

 

1N4151

 

 

200

mA

 

1N4153

 

 

200

mA

 

 

 

 

 

 

 

IFRM

repetitive peak forward current

 

 

 

 

 

 

1N4150

 

 

600

mA

 

1N4151

 

 

450

mA

 

1N4153

 

 

450

mA

 

 

 

 

 

 

IFSM

non-repetitive peak forward current

square wave; Tj = 25 °C prior to

 

 

 

 

 

surge; see Fig.4

 

 

 

 

 

 

t = 1 μs

 

4

A

 

 

t = 1 ms

 

1

A

 

 

t = 1 s

 

0.5

A

 

 

 

 

 

 

 

Ptot

total power dissipation

Tamb = 25 °C; note 1

 

500

mW

Tstg

storage temperature

 

 

65

+200

°C

Tj

junction temperature

 

 

200

°C

Note

1. Device mounted on an FR4 printed-circuit board; lead length 10 mm.

1996 Apr 19

3

Philips Semiconductors

 

 

 

Product specification

 

 

 

 

 

 

 

High-speed diodes

 

1N4150; 1N4151; 1N4153

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS

 

 

 

 

 

Tj = 25 °C; unless otherwise specified.

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

 

MIN.

MAX.

UNIT

 

 

 

 

 

 

 

VF

forward voltage

see Fig.3

 

 

 

 

 

1N4150

IF = 1 mA

 

540

620

mV

 

 

IF = 10 mA

 

660

740

mV

 

 

IF = 50 mA

 

760

860

mV

 

 

IF = 100 mA

 

820

920

mV

 

 

IF = 200 mA

 

870

1000

mV

 

1N4151

IF = 50 mA

 

1000

mV

 

1N4153

IF = 0.1 mA

 

490

550

mV

 

 

IF = 0.25 mA

 

530

590

mV

 

 

IF = 1 mA

 

590

670

mV

 

 

IF = 2 mA

 

620

700

mV

 

 

IF = 10 mA

 

700

810

mV

 

 

IF = 50 mA

 

740

880

mV

IR

reverse current

VR = 50 V; see Fig.5

 

 

 

 

 

1N4150

 

 

0.1

μA

 

1N4151

 

 

0.05

μA

 

1N4153

 

 

0.05

μA

 

 

 

 

 

 

 

IR

reverse current

VR = 50 V; Tj = 150 °C; see Fig.5

 

 

 

 

 

1N4150

 

 

100

μA

 

1N4151

 

 

50

μA

 

1N4153

 

 

50

μA

 

 

 

 

 

 

 

Cd

diode capacitance

f = 1 MHz; VR = 0; see Fig.6

 

 

 

 

 

1N4150

 

 

2.5

pF

 

1N4151

 

 

2

pF

 

1N4153

 

 

 

2

pF

 

 

 

 

 

 

 

1996 Apr 19

4

Philips Semiconductors

 

 

Product specification

 

 

 

 

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

trr

reverse recovery time

when switched from IF = 10 mA to

 

 

 

 

1N4150

IR = 1 mA; RL = 100 Ω; measured at

6

ns

 

 

IR = 0.1 mA; see Fig.7

 

 

 

 

 

when switched from IF = 10 mA to

4

ns

 

 

200 mA to IR = 10 mA to 200 mA;

 

 

 

 

 

RL = 100 Ω; measured at IR = 0.1 × IF;

 

 

 

 

 

see Fig.7

 

 

 

 

 

 

 

 

 

 

 

when switched from IF = 200 mA to

6

ns

 

 

400 mA to IR = 200 mA to 400 mA;

 

 

 

 

 

RL = 100 Ω; measured at IR = 0.1 × IF;

 

 

 

 

 

see Fig.7

 

 

 

 

 

 

 

 

 

trr

reverse recovery time

when switched from IF = 10 mA to

 

 

 

 

1N4151

IR = 10 mA; RL = 100 Ω; measured at

4

ns

 

 

IR = 1 mA; see Fig.7

 

 

 

 

 

when switched from IF = 10 mA to

2

ns

 

 

IR = 60 mA; RL = 100 Ω; measured at

 

 

 

 

 

IR = 1 mA; see Fig.7

 

 

 

trr

reverse recovery time

when switched from IF = 10 mA to

 

 

 

 

1N4153

IR = 10 mA; RL = 100 Ω; measured at

4

ns

 

 

IR = 1 mA; see Fig.7

 

 

 

 

 

when switched from IF = 10 mA to

2

ns

 

 

IR = 60 mA; RL = 100 Ω; measured at

 

 

 

 

 

IR = 1 mA; see Fig.7

 

 

 

tfr

forward recovery time

when switched to IF = 200 mA; tr = 0.4 ns;

10

ns

 

 

measured at VF = 1 V; see Fig.8

 

 

 

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

 

 

 

 

 

Rth j-tp

thermal resistance from junction to tie-point

lead length 10 mm

240

K/W

Rth j-a

thermal resistance from junction to ambient

lead length 10 mm; note 1

350

K/W

Note

1. Device mounted on a printed circuit-board without metallization pad.

1996 Apr 19

5

Philips Semiconductors

Product specification

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

GRAPHICAL DATA

400

 

 

 

 

 

MBG456

 

 

 

 

 

 

handbook, halfpage

 

 

 

 

 

 

IF

 

 

 

 

 

 

(mA)

 

 

 

 

 

 

300

 

 

 

 

 

 

 

(1)

 

 

 

 

 

200

 

 

 

 

 

 

 

(2)

 

 

 

 

 

100

 

 

 

 

 

 

0

 

 

 

o

 

 

0

100

Tamb

(

C)

200

 

 

 

 

Device mounted on an FR4 printed-circuit board; lead length 10 mm.

(1)1N4150.

(2)1N4151; 1N4153.

Fig.2 Maximum permissible continuous forward current as a function of ambient temperature.

MGD291

600 handbook, halfpage

IF (mA)

400

(1) (2)

200

0

0

1

VF

(V)

2

 

 

 

(1)Tj = 175 °C; typical values.

(2)Tj = 25 °C; typical values.

Fig.3 Forward current as a function of forward voltage.

MBG704

102 handbook, full pagewidth

IFSM

(A)

10

1

101

1

10

102

103

tp (μs)

104

 

 

 

 

 

Based on square wave currents.

Tj = 25 °C prior to surge.

Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.

1996 Apr 19

6

Philips Semiconductors

Product specification

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

103

MGD290

 

 

handbook, halfpage

IR

(μA) 102

(1) (2)

10

1

101

102

0

100

200

 

Tj

(oC)

(1)VR = 75 V; typical values.

(2)VR = 20 V; typical values.

Fig.5 Reverse current as a function of junction temperature.

MGD004

1.2 handbook, halfpage

Cd (pF)

1.0

0.8

0.6

0.4

0

10

VR

(V)

20

 

 

 

f = 1 MHz; Tj = 25 °C.

Fig.6 Diode capacitance as a function of reverse voltage; typical values.

1996 Apr 19

7

Philips Semiconductors

Product specification

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

handbook, full pagewidth

 

t r

t p

 

 

 

 

 

 

 

t

 

 

D.U.T.

10%

 

 

R = 50 Ω

IF

 

I F

t rr

S

 

SAMPLING

 

t

 

 

 

 

 

OSCILLOSCOPE

 

 

 

 

 

V = VR IF x R S

 

R i = 50 Ω

 

 

 

 

 

90%

(1)

 

 

VR

 

 

 

 

 

 

 

MGA881

 

 

input signal

output signal

(1) The value of IR is dependent on product type.

Fig.7 Reverse recovery voltage test circuit and waveforms.

I

1 k Ω

450 Ω

 

 

I

1.0

 

 

 

90%

RS = 50 Ω

 

 

VF

OSCILLOSCOPE

(V)

 

D.U.T.

Ω

 

 

R i = 50

 

 

 

10%

 

 

MBH181

 

t

 

 

t r

t p

 

 

 

input

 

 

 

signal

Vfr

 

tfr

t

output

 

signal

 

Input signal: forward pulse rise time tr = 0.4 ns; forward pulse duration tp = 100 ns; duty factor δ = 0.01.

Fig.8 Forward recovery time test circuit and waveforms.

1996 Apr 19

8

Philips Semiconductors

Product specification

 

 

High-speed diodes

1N4150; 1N4151; 1N4153

 

 

PACKAGE OUTLINE

 

handbook, full pagewidth

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.56

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

max

 

 

1.85

 

 

 

25.4 min

 

 

4.25

 

 

25.4 min

 

 

MLA428 - 1

 

 

max

 

 

 

 

 

 

 

max

 

 

 

 

 

 

 

 

Dimensions in mm.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Fig.9 SOD27 (DO-35).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DEFINITIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Data Sheet Status

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Objective specification

 

This data sheet contains target or goal specifications for product development.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Preliminary specification

 

This data sheet contains preliminary data; supplementary data may be published later.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Product specification

 

This data sheet contains final product specifications.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Apr 19

9

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