Добавил:
Опубликованный материал нарушает ваши авторские права? Сообщите нам.
Вуз: Предмет: Файл:

philips / GP&HSSD / SMALL_S / 9730

.PDF
Источник:
Скачиваний:
45
Добавлен:
06.01.2022
Размер:
66.74 Кб
Скачать

DISCRETE SEMICONDUCTORS

book, halfpage

M3D114

1PS302

High-speed double diode

Product specification

 

1996 Apr 03

File under Discrete Semiconductors, SC01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Philips Semiconductors

Product specification

 

 

 

 

High-speed double diode

1PS302

 

 

 

 

FEATURES

Very small plastic SMD package

High switching speed: max. 4 ns

Continuous reverse voltage: max. 80 V

Repetitive peak reverse voltage: max. 85 V

Repetitive peak forward current: max. 500 mA

Forward voltage: max. 1.2 V.

APPLICATIONS

High-speed switching in e.g. surface mounted circuits.

LIMITING VALUES

DESCRIPTION

The 1PS302 consists of two high-speed switching diodes connected in series, fabricated in planar technology, and encapsulated in the very small rectangular plastic SMD SC70 package.

PINNING

PIN

DESCRIPTION

 

 

1

anode

 

 

2

cathode

 

 

3

common connection

 

 

 

 

2

 

1

 

 

 

 

 

2 1

3

3

Top view

MAM083

Marking code: C3.

Fig.1 Simplified outline (SC70) and symbol.

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

Per diode

 

 

 

 

 

 

 

 

 

 

 

VRRM

repetitive peak reverse voltage

 

85

V

VR

continuous reverse voltage

 

80

V

IF

continuous forward current

single diode loaded; see Fig.2;

200

mA

 

 

note 1

 

 

 

 

 

 

 

 

 

 

 

double diode loaded; see Fig.2;

170

mA

 

 

note 1

 

 

 

 

 

 

 

 

 

IFRM

repetitive peak forward current

 

500

mA

IFSM

non-repetitive peak forward current

square wave; Tj = 25 °C prior to

 

 

 

 

 

surge

 

 

 

 

 

t = 1 μs

4

A

 

 

t = 1 s

0.5

A

 

 

 

 

 

 

Ptot

total power dissipation

Tamb = 25 °C; note 1

300

mW

Tstg

storage temperature

 

65

+150

°C

Tj

junction temperature

 

150

°C

Note

1. Device mounted on an FR4 printed-circuit board.

1996 Apr 03

2

Philips Semiconductors

 

 

Product specification

 

 

 

 

 

 

High-speed double diode

 

 

1PS302

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS

 

 

 

 

Tj = 25 °C; unless otherwise specified.

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Per diode

 

 

 

 

 

 

 

 

 

 

 

VF

forward voltage

see Fig.3

 

 

 

 

 

IF = 1 mA

610

mV

 

 

IF = 10 mA

740

mV

 

 

IF = 50 mA

1.0

V

 

 

IF = 100 mA

1.2

V

IR

reverse current

see Fig.4

 

 

 

 

 

VR = 25 V

30

nA

 

 

VR = 80 V

0.5

μA

 

 

VR = 25 V; Tj = 150 °C

30

μA

 

 

VR = 80 V; Tj = 150 °C

100

μA

Cd

diode capacitance

f = 1 MHz; VR = 0; see Fig.5

1.5

pF

trr

reverse recovery time

when switched from IF = 10 mA to

4

ns

 

 

IR = 10 mA; RL = 100 Ω;

 

 

 

 

 

measured at IR = 1 mA; see Fig.6

 

 

 

Vfr

forward recovery voltage

when switched from IF = 10 mA;

1.75

V

 

 

tr = 20 ns; see Fig.7

 

 

 

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

 

CONDITIONS

VALUE

UNIT

 

 

 

 

 

 

Rth j-tp

thermal resistance from junction to tie-point

 

 

200

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

 

415

K/W

Note

1. Device mounted on an FR4 printed-circuit board.

1996 Apr 03

3

Philips Semiconductors

Product specification

 

 

High-speed double diode

1PS302

 

 

GRAPHICAL DATA

MBG443

300 handbook, halfpage

IF (mA)

200

(1)

(2)

100

0

0

100

Tamb

o

C)

200

 

 

(

 

Device mounted on an FR4 printed-circuit board.

(1)Single diode loaded.

(2)Double diode loaded.

Fig.2 Maximum permissible continuous forward current as a function of ambient temperature.

MBG380

102 handbook, halfpage

IR

(μA)

10

(1)

(2)

(3)

1

10 1

10 2

0

100

Tj

(

o

C)

200

 

 

 

(1)VR = 80 V; maximum values.

(2)VR = 80 V; typical values.

(3)VR = 25 V; typical values.

Fig.4 Reverse current as a function of junction temperature.

MBG382

300 handbook, halfpage

IF (mA)

(1)

(2)

(3)

200

100

0

0

1

VF

(V)

2

 

 

 

(1)Tj = 150 °C; typical values.

(2)Tj = 25 °C; typical values.

(3)Tj = 25 °C; maximum values.

Fig.3 Forward current as a function of forward voltage.

MBG446

0.8 handbook, halfpage

Cd (pF)

0.6

0.4

0.2

0

0

4

8

12 VR (V) 16

f = 1 MHz; Tj = 25 °C.

Fig.5 Diode capacitance as a function of reverse voltage; typical values.

1996 Apr 03

4

Philips Semiconductors

Product specification

 

 

High-speed double diode

1PS302

 

 

handbook, full pagewidth

 

t r

t p

 

 

 

 

 

 

 

t

 

 

D.U.T.

10%

 

 

R = 50 Ω

IF

 

I F

t rr

S

 

SAMPLING

 

t

 

 

OSCILLOSCOPE

 

 

 

 

 

V = VR IF x R S

 

R i = 50 Ω

 

 

 

 

 

90%

(1)

 

 

VR

 

 

 

 

 

 

 

MGA881

 

 

input signal

output signal

(1) IR = 1 mA.

Fig.6 Reverse recovery voltage test circuit and waveforms.

I

1 k Ω

450 Ω

 

 

I

90%

 

V

 

 

 

 

 

RS = 50 Ω

OSCILLOSCOPE

 

 

V fr

 

D.U.T.

Ω

 

 

 

 

R i = 50

 

 

 

 

 

10%

 

 

 

 

MGA882

 

 

t

t

 

 

t r

t p

 

 

 

 

 

input

 

output

 

 

 

signal

 

signal

Fig.7 Forward recovery voltage test circuit and waveforms.

1996 Apr 03

5

Philips Semiconductors

 

 

 

Product specification

High-speed double diode

 

 

1PS302

PACKAGE OUTLINE

 

 

 

 

handbook, full pagewidth

2.2

A

1.35

B

 

1.8

1.15

 

 

X

 

 

 

 

 

 

0.25

 

 

 

 

0.10

 

 

 

 

 

2.2

0.2 M B

 

 

 

2.0

 

 

 

 

 

3

 

 

 

 

 

 

 

0.2

 

 

 

1.0

1.1

 

 

 

0.8 0.1

 

 

 

max

 

 

 

0.0

 

1

0.40

2

 

 

 

0.30

0.2 M A

 

0.3

 

 

 

 

 

 

0.1

 

0.65

 

detail X

 

 

 

 

1.3

 

 

MSA377 - 1

Dimensions in mm.

 

 

 

 

 

 

Fig.8

SC70.

 

DEFINITIONS

 

 

 

 

Data Sheet Status

 

 

 

 

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Apr 03

6

Соседние файлы в папке SMALL_S