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Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

 

 

GENERAL DESCRIPTION

Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

1500

V

VCEO

Collector-emitter voltage (open base)

 

-

700

V

IC

Collector current (DC)

 

-

8

A

ICM

Collector current peak value

Ths 25 ˚C

-

15

A

Ptot

Total power dissipation

-

35

W

VCEsat

Collector-emitter saturation voltage

IC = 4.5 A; IB = 1.29 A

-

1.0

V

VCEsat

Collector-emitter saturation voltage

IC = 4.5 A; IB = 1.1 A

-

5.0

V

ICsat

Collector saturation current

 

4.5

-

A

tf

Fall time

ICM = 4.5 A; IB(end) = 1.1 A

0.4

0.6

μs

PINNING - SOT186A

PIN CONFIGURATION

SYMBOL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN

 

 

 

DESCRIPTION

 

 

case

 

 

 

 

 

 

c

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

base

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

 

 

collector

 

 

 

 

 

 

 

 

b

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

emitter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

case

 

isolated

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1 2 3

 

 

 

 

 

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LIMITING VALUES

 

 

 

 

 

 

 

 

 

 

 

 

Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)

 

 

 

 

 

 

SYMBOL

 

PARAMETER

 

 

 

CONDITIONS

 

MIN.

 

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

VCESM

 

 

Collector-emitter voltage peak value

 

 

VBE = 0 V

 

-

 

1500

V

 

VCEO

 

 

Collector-emitter voltage (open base)

 

 

 

 

 

 

-

 

700

V

 

IC

 

 

Collector current (DC)

 

 

 

 

 

 

 

-

 

8

A

 

ICM

 

 

Collector current peak value

 

 

 

 

 

 

-

 

15

A

 

IB

 

 

Base current (DC)

 

 

 

 

 

 

 

-

 

4

A

 

IBM

 

 

Base current peak value

 

 

 

 

 

 

 

-

 

6

A

 

-IB(AV)

 

 

Reverse base current

 

 

 

average over any 20 ms period

-

 

100

mA

 

-I

 

 

Reverse base current peak value 1

 

 

 

 

 

 

-

 

5

A

 

BM

 

 

 

 

 

 

 

 

Ths 25 ˚C

 

 

 

 

 

 

 

Ptot

 

 

Total power dissipation

 

 

 

 

-

 

35

W

 

Tstg

 

 

Storage temperature

 

 

 

 

 

 

 

-65

 

150

˚C

 

Tj

 

 

Junction temperature

 

 

 

 

 

 

 

-

 

150

˚C

THERMAL RESISTANCES

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

 

PARAMETER

 

 

 

CONDITIONS

 

TYP.

 

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Rth j-hs

 

 

Junction to heatsink

 

 

 

with heatsink compound

-

 

3.6

K/W

 

Rth j-a

 

 

Junction to ambient

 

 

 

in free air

 

55

 

-

K/W

1 Turn-off current.

November 1995

1

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Visol

R.M.S. isolation voltage from all

f = 50-60 Hz; sinusoidal

-

 

2500

V

 

three terminals to external

waveform;

 

 

 

 

 

heatsink

R.H. 65% ; clean and dustfree

 

 

 

 

 

 

 

 

 

 

 

Cisol

Capacitance from T2 to external

f = 1 MHz

-

10

-

pF

 

heatsink

 

 

 

 

 

STATIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

 

 

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

I

Collector cut-off current 2

V =

0 V; V

CE

= V

CESMmax

-

-

1.0

mA

CES

 

BE

 

 

 

 

 

 

 

ICES

 

VBE =

0 V; VCE = VCESMmax;

-

-

2.0

mA

 

 

Tj = 125 ˚C

 

 

 

 

 

 

 

IEBO

Emitter cut-off current

VEB =

7.5 V; IC = 0 A

-

-

1.0

mA

BVEBO

Emitter-base breakdown voltage

IB = 1 mA

 

 

 

7.5

13.5

-

V

VCEOsust

Collector-emitter sustaining voltage

IB = 0 A; IC = 100 mA;

700

-

-

V

 

 

L = 25 mH

 

 

 

 

 

 

 

VCEsat

Collector-emitter saturation voltages

IC = 4.5

A; IB =

1.1

A

-

-

5.0

V

VCEsat

 

IC = 4.5

A; IB =

1.29 A

-

-

1.0

V

VBEsat

Base-emitter saturation voltage

IC = 4.5

A; IB =

1.7

A

-

-

1.3

V

hFE

DC current gain

IC = 100 mA; VCE = 5 V

6

13

26

 

hFE

 

IC = 4.5

A; VCE = 1

V

3.5

5.5

7.5

 

DYNAMIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Cc

Collector capacitance

IE = 0 A; VCB = 10 V; f = 1 MHz

80

-

pF

 

Switching times (line deflection

ICM = 4.5 A; IB(end) = 1.1 A; LB = 6 μH;

 

 

 

ts

circuit)

-VBB = 4 V; (-dIB/dt = 0.6 A/μs)

5.0

6.0

μs

Turn-off storage time

 

tf

Turn-off fall time

 

0.4

0.6

μs

2 Measured with half sine-wave voltage (curve tracer).

November 1995

2

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

+ 50v 100-200R

Horizontal

Oscilloscope

Vertical

100R

1R

6V

30-60 Hz

Fig.1. Test circuit for VCEOsust.

IC / mA

250

200

100

0

VCE / V

min

VCEOsust

Fig.2. Oscilloscope display for VCEOsust.

 

ICM

 

TRANSISTOR

IC

DIODE

 

t

IB

IBend

 

t

20us

26us

64us

VCE

t

Fig.3. Switching times waveforms.

 

ICM

 

90 %

IC

 

 

10 %

tf

t

ts

 

IB

 

IBend

 

 

t

- IBM

Fig.4. Switching times definitions.

+ 150 v nominal adjust for ICM

1mH

IBend

LB

BU1508AX

BY228

12nF

-VBB

Fig.5. Switching times test circuit (BU1508AX).

h FE

 

 

 

100

 

 

 

 

 

 

5V

10

 

 

 

 

1V

 

 

 

 

Tj = 25 C

 

 

 

Tj = 125 C

 

1

0.1

1

10

0.01

 

 

IC / A

 

Fig.6. Typical DC current gain. hFE = f (IC) parameter VCE

November 1995

3

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

1.2

VBESAT / V

 

 

 

 

 

1.1

Tj = 25 C

 

 

Tj = 125 C

 

 

 

 

 

1.0

 

 

 

0.9

 

 

 

0.8

 

 

IC/IB=

0.7

 

 

3

 

 

4

 

 

 

0.6

 

 

5

 

 

 

0.5

 

 

 

0.4

0.1

1

10

 

 

 

IC / A

 

Fig.7. Typical base-emitter saturation voltage.

 

 

VBEsat = f (IC); parameter IC/IB

 

1.0

VCESAT / V

 

 

 

 

0.9

 

IC/IB=

 

0.8

 

5

 

0.7

 

4

 

0.6

 

3

 

0.5

 

Tj = 25 C

 

0.4

 

 

 

Tj = 125 C

 

 

 

 

0.3

 

 

 

0.2

 

 

 

0.1

 

 

 

0

0.1

1

10

 

 

 

IC / A

 

Fig.8. Typical collector-emitter saturation voltage.

 

 

VCEsat = f (IC); parameter IC/IB

 

1.2

VBESAT / V

 

 

 

 

 

 

 

 

 

 

Tj = 25 C

 

 

 

1.1

 

Tj = 125 C

 

 

 

1.0

 

 

 

 

 

0.9

 

 

 

 

IC=

 

 

 

 

 

 

 

 

 

 

6A

0.8

 

 

 

 

4.5A

 

 

 

 

 

3A

0.7

 

 

 

 

2A

 

 

 

 

 

0.6

0

1

2

3

4

 

 

 

 

IB / A

 

 

Fig.9. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC

VCESAT / V

 

 

10

 

 

 

 

Tj = 25 C

 

 

Tj = 125 C

 

6A

 

 

4.5A

 

1

 

 

 

3A

 

IC=2A

 

 

0.1

 

 

0.1

1

10

 

IB / A

 

Fig.10. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC

1000

Eoff / uJ

 

 

 

 

 

 

IC = 4.5A

 

 

 

3.5A

 

 

100

 

 

 

10

0.1

1

10

 

 

 

IB / A

 

Fig.11.

Typical turn-off losses. Tj = 85˚C

 

 

Eoff = f (IB); parameter IC

 

12

ts, tf / us

 

 

 

 

11

 

 

ts

10

 

 

 

 

 

9

 

 

 

8

 

 

 

7

 

 

 

6

 

 

 

5

 

IC =

 

4

 

 

 

 

 

3

 

4.5A

 

2

 

3.5A

 

 

 

tf

1

 

 

 

 

 

0

0.1

1

10

 

 

 

IB / A

 

Fig.12. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85˚C

November 1995

4

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

 

 

 

 

BU1508AX

120

PD%

 

 

Normalised Power Derating

 

IC / A

 

 

 

 

 

 

 

with heatsink compound

100

 

 

 

 

110

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

100

 

 

 

 

 

 

 

 

 

 

 

 

 

 

90

 

 

 

 

 

 

 

 

 

 

 

= 0.01

 

80

 

 

 

 

 

 

 

 

 

 

 

 

70

 

 

 

 

 

 

 

 

 

ICM max

 

 

 

tp =

60

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

IC max

 

 

 

 

50

 

 

 

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

II

10 us

30

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

0

20

40

60

80

100

120

140

 

 

Ptot max

 

 

 

 

1

 

 

 

 

 

 

 

 

 

 

Ths / C

 

 

 

 

 

 

 

100 us

Fig.13.

Normalised power dissipation.

 

 

 

 

 

 

 

 

 

 

 

 

 

PD% = 100×PD/PD 25˚C = f (Ths)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I

 

 

1 ms

 

 

Zth / (K/W)

 

 

 

 

 

0.1

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10 ms

 

 

0.5

 

 

 

 

 

 

 

 

 

 

 

DC

1

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

0.01

 

 

 

 

 

 

 

0.05

 

 

 

 

 

 

1

 

100

1000

0.1

 

0.02

 

 

P

tp

D =

tp

 

10

 

 

 

 

 

 

 

VCE / V

 

 

 

 

 

 

D

 

T

 

 

 

 

 

 

 

D = 0

 

 

 

 

 

 

Fig.15. Forward bias safe operating area. Ths = 25˚C

 

 

 

 

 

 

T

 

t

I Region of permissible DC operation.

 

0.01

 

 

 

 

 

 

 

 

II Extension for repetitive pulse operation.

1E-06

1E-04

 

1E-02

1E+00

 

 

 

 

 

 

 

 

 

 

 

t / s

 

 

 

NB: Mounted with heatsink compound and

Fig.14.

Transient thermal impedance.

30

± 5 newton force on the centre of

 

 

 

Zth j-hs = f(t); parameter D = tp/T

 

the envelope.

 

 

 

November 1995

5

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

MECHANICAL DATA

Dimensions in mm

Net Mass: 2 g

 

10.3

 

 

 

 

 

max

 

 

4.6

 

 

 

 

 

 

 

 

 

 

max

 

 

3.2

 

 

2.9 max

 

3.0

 

 

Recesses (2x)

 

2.8

 

 

 

 

 

 

 

 

2.5

 

 

 

6.4

 

0.8 max. depth

 

 

 

 

 

 

 

 

 

seating

15.8

 

 

15.8

19

max

 

 

max.

max.

plane

 

3 max.

 

 

 

 

 

not tinned

 

 

 

 

 

 

 

3

 

2.5

 

 

 

 

 

 

13.5

 

 

 

 

 

min.

 

 

 

 

 

1

2

3

 

 

 

0.4 M

 

 

 

 

1.0 (2x)

 

 

2.54

 

0.6

0.9

 

 

 

0.5

 

 

 

0.7

 

 

 

 

 

 

 

 

 

 

5.08

 

 

2.5

1.3

Fig.16. SOT186A; The seating plane is electrically isolated from all terminals.

Notes

1.Refer to mounting instructions for F-pack envelopes.

2.Epoxy meets UL94 V0 at 1/8".

November 1995

6

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BU1508AX

 

 

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

 

 

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. 1995

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

November 1995

7

Rev 1.100

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