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Philips Semiconductors

Product specification

 

 

Silicon Diffused Darlington Power Transistor

BUV90F

 

 

 

 

GENERAL DESCRIPTION

High-voltage, monolithic npn power Darlington transistor in a SOT199 envelope intended for use in car ignition systems, DC and AC motor controls, solenoid drivers, etc.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

 

CONDITIONS

 

 

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

 

 

-

650

V

VCEO

Collector-emitter voltage (open base)

 

 

 

-

400

V

IC

Collector current (DC)

 

 

 

 

-

12

A

ICM

Collector current peak value

Ths 25 ˚C

 

 

-

30

A

Ptot

Total power dissipation

 

 

 

-

34

W

VCEsat

Collector-emitter saturation voltage

IC = 5 A; IB = 0.05 A

 

 

-

1.5

V

VCEsat

Collector-emitter saturation voltage

IC = 10 A; IB = 0.3 A

 

 

-

2

V

ICsat

Collector saturation current

 

 

 

10

 

A

tf

Fall time

 

IC = 5 A; IB(on) = 50 mA

 

 

0.7

-

μs

tf

Fall time

 

IC = 10 A; IB(on) = 300 mA

 

1

-

μs

PINNING - SOT199

PIN CONFIGURATION

SYMBOL

 

 

 

 

PIN

 

DESCRIPTION

 

case

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

 

base

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

 

 

collector

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

emitter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

case

 

isolated

 

1

 

 

2

 

 

3

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

c

b

 

R1

R2

 

e

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

650

V

VCEO

Collector-emitter voltage (open base)

IC = 10 A; IB(on) = 0.3 A; LC = 8 mH

-

400

V

E(BR)

Turn-off breakdown energy with

-

400

mJ

 

inductive load

 

 

 

 

IC

Collector current (DC)

 

-

12

A

ICM

Collector current peak value

 

-

30

A

IB

Base current (DC)

 

-

4

A

IBM

Base current peak value

Ths 25 ˚C

-

6

A

Ptot

Total power dissipation

-

34

W

Tstg

Storage temperature

 

-65

150

˚C

Tj

Junction temperature

 

-

150

˚C

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Rth j-hs

Junction to heatsink

without heatsink compound

-

3.7

K/W

Rth j-hs

Junction to heatsink

with heatsink compound

-

2.8

K/W

June 1993

1

Rev 1.000

Philips Semiconductors

Product specification

 

 

Silicon Diffused Darlington Power Transistor

BUV90F

 

 

ISOLATION

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Visol

Repetitive peak voltage from all

R.H. 65 % ; clean and dustfree

-

-

2500

V

 

three terminals to external

 

 

 

 

 

 

heatsink

 

 

 

 

 

Cisol

Capacitance from T2 to external

f = 1 MHz

-

22

-

pF

 

heatsink

 

 

 

 

 

STATIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

 

 

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

I

Collector cut-off current 1

V =

0 V; V

CE

= V

CESMmax

-

-

1.0

mA

CES

 

BE

 

 

 

 

 

 

ICES

 

VBE =

0 V; VCE = VCESMmax;

-

-

3.0

mA

IEBO

 

Tj = 125 ˚C

 

 

 

 

 

 

 

Emitter cut-off current

VEB =

6 V; IC = 0 A

-

-

20

mA

R1

Base-emitter resistor - driver

 

 

 

 

 

-

500

-

Ω

 

transistor.

 

 

 

 

 

 

 

 

Ω

R2

Base-emitter resistor - output

 

 

 

 

 

-

500

-

 

transistor.

 

 

 

 

 

 

 

 

 

VF

Diode forward voltage

IF = 8

A; IB = 0 A

 

-

-

3

V

VCEOsust

Collector-emitter sustaining voltage

IB = 0 A; IC = 100 mA;

400

-

-

V

 

 

L = 25 mH

 

 

 

 

 

 

 

VCEsat

Saturation voltages

IC = 5 A; IB = 0.05 A

-

-

1.5

V

VBEsat

 

IC = 6 A; IB = 0.1 A;

-

-

2.0

V

VCEsat

 

-

-

1.5

V

VBEsat

 

Ths = 150 ˚C

 

 

-

-

2.0

V

VCEsat

 

IC = 10 A; IB = 0.3 A

-

-

2.0

V

VBEsat

 

 

 

 

 

 

-

-

2.5

V

DYNAMIC CHARACTERISTICS

Ths = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

 

Switching times inductive load

 

 

 

 

μs

tf

Turn-off fall time

IC = 5 A; IB(on) = 50 mA

-

0.7

-

tf

Turn-off fall time

IC = 10 A; IB(on) = 300 mA

-

1

-

μs

1 Measured with half sine-wave voltage (curve tracer).

June 1993

2

Rev 1.000

Philips Semiconductors

Product specification

 

 

Silicon Diffused Darlington Power Transistor

BUV90F

 

 

VCC

 

LC

IBon

LB

 

 

T.U.T.

-VBB

 

 

Fig.1. Test circuit inductive load.

 

VCC = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH

 

 

ICon

 

 

 

90 %

 

IC

 

 

 

 

 

10 %

 

 

ts

tf

t

 

toff

 

 

IB

IBon

 

 

 

 

 

 

 

 

t

-IBoff

Fig.2. Switching times waveforms with inductive load.

+25 V

1.5

8 mH

VZ=400 V

IBon

T.U.T. off

100

IC / A

 

 

 

100

 

 

 

ICMmax

 

 

 

ICmax

 

 

 

10

 

 

 

(1)

 

 

 

1

 

II

 

 

 

 

0.1

I

(2)

 

 

 

 

 

 

0.01

 

 

 

 

 

 

III

0.001

 

 

 

1

10

100

1000

 

 

VCE / V

 

Fig.4. Forward bias safe operating area. Ths = 25 ˚C

I Region of permissible DC operation.

II Extension for repetitive pulse operation.

IIIRepetitive pulse operation is permissible in this region provided VBE < 0 and

tp < 5 ms.

(1)Ptot max line.

(2)Second breakdown limits (independent

of temperature.

NB: Mounted without heatsink compound and 30 ± 5 newton force on the centre of the envelope.

Fig.3. Breakdown energy test circuit.

June 1993

3

Rev 1.000

Philips Semiconductors

Product specification

 

 

Silicon Diffused Darlington Power Transistor

BUV90F

 

 

MECHANICAL DATA

Dimensions in mm Net Mass: 5.5 g

 

 

15.3 max

5.2 max

 

 

 

0.7

 

3.1

 

7.3

3.3

3.2

 

 

 

 

 

 

 

o

 

 

6.2

45

 

 

5.8

 

21.5

max

seating

plane

3.5

3.5 max

not tinned

 

15.7 min

1

2

3

 

 

2.1 max

 

1.2

 

0.7 max

 

 

1.0

M

 

 

 

0.4

2.0

 

 

 

 

 

5.45

5.45

 

 

Fig.5. SOT199; The seating plane is electrically isolated from all terminals.

Notes

1. Accessories supplied on request: refer to mounting instructions for F-pack envelopes.

June 1993

4

Rev 1.000

Philips Semiconductors

Product specification

 

 

Silicon Diffused Darlington Power Transistor

BUV90F

 

 

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

 

 

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. 1994

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

June 1993

5

Rev 1.000

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