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Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BUX86P

 

BUX87P

 

 

 

 

GENERAL DESCRIPTION

High voltage, high speed glass passivated npn power transistors in a SOT82 envelope intended for use in converters, inverters, switching regulators, motor control systems and switching applications.

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

BUX

86P

 

87P

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

800

 

1000

V

VCEO

Collector-emitter voltage (open base)

 

-

400

 

450

V

VCESAT

Collector-emitter saturation voltage

IC = 0.2 A; IB = 20 mA

-

 

1

V

IC

Collector current (DC)

 

-

 

0.5

A

ICM

Collector current peak value

Tmb 25 ˚C

-

 

1

A

Ptot

Total power dissipation

-

 

42

W

tf

Fall time

IC = 0.2 A; IB(on) = 20 mA

0.28

 

-

μs

PINNING - SOT82

PIN CONFIGURATION

SYMBOL

 

PIN

 

 

DESCRIPTION

 

 

 

 

 

 

 

 

 

 

 

 

c

 

 

 

 

 

 

 

 

 

 

1

 

 

emitter

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2

 

 

collector

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

b

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

3

 

 

base

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1

 

2

 

3

 

 

 

 

e

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

LIMITING VALUES

Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

 

 

 

 

 

BUX

86P

 

87P

 

 

 

 

 

 

 

 

 

VCESM

Collector-emitter voltage peak value

VBE = 0 V

-

800

 

1000

V

VCEO

Collector-emitter voltage (open base)

 

-

400

 

450

V

VEBO

Emitter-base voltage (open collector)

 

-

 

5

V

IC

Collector current (DC)

 

-

 

0.5

A

ICM

Collector current (peak value) tp = 2 ms

 

-

 

1

A

IB

Base current (DC)

 

-

 

0.2

A

IBM

Base current (peak value)

 

-

 

0.3

A

-I

Reverse base current (peak value)1

 

-

 

0.3

A

BM

 

Tmb 25 ˚C

 

 

 

 

 

Ptot

Total power dissipation

-

 

42

W

Tstg

Storage temperature

 

-40

 

150

˚C

Tj

Junction temperature

 

-

 

150

˚C

1 Turn-off current.

November 1995

1

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BUX86P

 

BUX87P

 

 

THERMAL RESISTANCES

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

Rth j-mb

Junction to mounting base

 

-

3

K/W

Rth j-a

Junction to ambient

in free air

100

-

K/W

STATIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

 

MIN.

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

 

ICES

 

VBE = 0

V; VCE = VCESMmax

-

-

100

μA

ICES

 

VBE = 0

V; VCE = VCESMmax;

-

-

1.0

mA

IEBO

 

Tj = 125 ˚C

 

 

 

 

 

Emitter cut-off current

VEB = 5

V; IC = 0 A

 

-

-

1

mA

VCEsat

Collector-emitter saturation voltages

IC = 0.1 A; IB = 10 mA

-

-

0.8

V

VCEsat

 

IC = 0.2 A; IB = 20 mA

-

-

1

V

VBEsat

Base-emitter saturation voltage

IC = 0.2 A; IB = 20 mA

-

-

1

V

hFE

DC current gain

IC = 50 mA; VCE = 5 V

26

50

125

 

VCEOsust

Collector-emitter sustaining voltage

IC = 100 mA;

BUX86P

400

-

-

V

 

 

IBoff = 0; L = 25 mH

BUX87P

450

-

-

V

DYNAMIC CHARACTERISTICS

Tmb = 25 ˚C unless otherwise specified

SYMBOL

PARAMETER

CONDITIONS

TYP.

MAX.

UNIT

 

 

 

 

 

 

 

Switching times (resistive load).

IC = 0.2 A; IBon = 20 mA; -IBoff = 40 mA;

 

 

 

ton

Turn-on time

VCC = 250 V

0.25

0.5

μs

 

ts

Turn-off storage time

 

2

3.5

μs

tf

Turn-off fall time

 

0.28

-

μs

tf

Turn-off fall time

Tmb = 95 ˚C

-

1.3

μs

November 1995

2

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BUX86P

 

BUX87P

 

 

 

 

VCC

 

 

RL

VIM

 

RB

0

 

 

T.U.T.

 

tp

 

 

T

 

Fig.1.

Test circuit resistive load. VIM = -6 to +8 V

VCC = 250 V; tp = 20 ms; d = tp / T = 0.01.

RB and RL calculated from ICon and IBon requirements.

 

90 %

ICon

 

90 %

IC

 

 

 

 

10 %

 

 

ts

 

ton

tf

 

 

toff

IB

 

IBon

 

 

 

10 %

 

 

tr 30ns

 

 

 

-IBoff

Fig.2. Switching times waveforms with resistive load.

120

PD%

 

 

 

Normalised Power Derating

 

 

 

 

 

 

 

 

110

 

 

 

 

 

 

 

 

100

 

 

 

 

 

 

 

 

90

 

 

 

 

 

 

 

 

80

 

 

 

 

 

 

 

 

70

 

 

 

 

 

 

 

 

60

 

 

 

 

 

 

 

 

50

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

30

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

0

0

20

40

60

80

100

120

140

 

 

 

 

 

 

Tmb /

C

 

 

Fig.3. Normalised power dissipation.

PD% = 100×PD/PD 25 ˚C = f (Tmb)

10

Zth / (K/W)

 

 

 

 

bux86p

 

 

 

 

 

 

 

0.5

 

 

 

 

 

1

 

 

 

 

 

 

 

0.2

 

 

 

 

 

 

0.1

 

 

 

 

 

 

0.05

 

P

tp

 

t p

 

 

 

D = T

0.1

 

D

 

 

0.02

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

T

t

 

 

 

 

 

 

 

D= 0

 

 

 

 

 

0.01

1.0E-06

0.0001

0.01

 

 

1

 

 

 

 

 

 

t / s

 

 

 

Fig.4. Transient thermal impedance.

Zth j-mb = f(t); parameter D = tp/T

VBESAT / V

 

 

 

BUX86P

0.9

 

 

 

 

 

 

 

IC =

 

 

 

 

0.2 A

 

0.8

 

 

0.1 A

 

 

 

 

50 mA

 

0.7

 

 

 

 

0.6

5

10

15

20

0

IB / mA

Fig.5. Typical base-emitter saturation voltage. VBEsat = f(IB); parameter IC

VCESAT / V

 

 

 

 

BUX86P

10

 

 

 

 

 

 

8

 

 

 

 

 

 

 

 

 

IC =

 

 

 

6

 

 

50 mA

 

 

 

 

 

0.1 A

 

 

 

 

 

 

 

 

 

 

 

 

0.2 A

 

 

 

4

 

 

 

 

 

 

2

 

 

 

 

 

 

0

5

10

15

20

25

30

0

IB / mA

Fig.6. Typical collector-emitter saturation voltage. VCEsat = f(IB); parameter IC

November 1995

3

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

 

 

 

BUX86P

 

 

 

 

 

 

 

BUX87P

hFE

 

 

BUX86P

 

IC / A

 

BUX87P

VCE=5V

 

 

Typical gain

 

 

1000

 

 

 

 

 

 

 

Tj=25 C

 

 

Limit gain

10

 

 

 

100

 

 

 

 

 

 

 

 

 

 

 

 

 

= 0.01

 

 

 

 

 

1

ICM max

 

10

 

 

 

 

IC max

 

 

 

 

 

 

 

 

1

0.01

0.1

1

 

 

II

tp =

0.001

0.1

 

 

 

IC / A

 

 

 

 

 

 

 

 

 

 

 

Fig.7. Typical DC current gain.

 

 

 

 

hFE = f(IC); parameter VCE.

 

 

 

 

1 ms

Arrows indicate conditions protected by 100% test.

 

 

 

 

 

 

 

 

0.01

 

I

10 ms

hFE

 

 

BUX86P

 

 

DC

1000

 

 

Typical gain

 

 

 

VCE=5V

 

 

 

 

 

Tj=95 C

 

 

Limit gain

 

 

 

 

100

 

 

 

 

 

 

 

 

 

 

 

0.001

 

100

1000

 

 

 

 

10

 

 

 

 

 

 

 

VCE / V

10

 

 

 

Fig.10. Forward bias safe operating area. Tmb = 25 ˚C

 

 

 

 

 

 

 

 

I

 

Region of permissible DC operation.

0.001

0.01

0.1

1

II

 

Extension for repetitive pulse operation.

NB:

Mounted with heatsink compound and

1

 

 

 

 

 

 

 

 

 

IC / A

 

 

 

30 ± 5 newton force on the centre of the

Fig.8.

Typical DC current gain.

 

 

envelope.

 

hFE = f(IC); parameter VCE

 

 

 

 

 

hFE

 

 

 

BUX86P

1000

 

 

 

 

 

VCE=5V

 

 

 

Typical gain

 

 

 

 

 

 

 

 

Tj= -40 C

 

 

 

Limit gain

 

 

 

 

 

 

100

 

 

 

10

 

 

 

1

0.01

0.1

1

0.001

 

 

IC / A

 

Fig.9. Typical DC current gain. hFE = f(IC); parameter VCE

November 1995

4

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BUX86P

 

BUX87P

 

 

MECHANICAL DATA

Dimensions in mm

Net Mass: 0.8 g

mounting

2.8

7.8

base

2.3

max

3.1

3.75

 

2.5

11.1

 

max

1)

2.54

max

1.2

15.3 min

 

 

 

 

 

 

1

2

3

 

0.5

 

 

 

 

 

 

 

 

 

4.58

 

 

 

 

 

2.29

 

0.88

1) Lead dimensions within this

max

 

zone uncontrolled.

 

Fig.11. SOT82; pin 2 connected to mounting base.

Notes

1.Refer to mounting instructions for SOT82 envelopes.

2.Epoxy meets UL94 V0 at 1/8".

November 1995

5

Rev 1.100

Philips Semiconductors

Product specification

 

 

Silicon Diffused Power Transistor

BUX86P

 

BUX87P

 

 

DEFINITIONS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

© Philips Electronics N.V. 1995

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

November 1995

6

Rev 1.100

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