DISCRETE SEMICONDUCTORS
handbook, 2 columns
M3D116
1N5059 to 1N5062
Controlled avalanche rectifiers
Product specification |
1996 Jun 20 |
Supersedes data of April 1992
File under Discrete Semiconductors, SC01
Philips Semiconductors |
Product specification |
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Controlled avalanche rectifiers |
1N5059 to 1N5062 |
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FEATURES
∙Glass passivated
∙High maximum operating temperature
∙Low leakage current
∙Excellent stability
∙Guaranteed avalanche energy absorption capability
∙Available in ammo-pack.
LIMITING VALUES
DESCRIPTION |
This package is hermetically sealed |
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Rugged glass package, using a high |
and fatigue free as coefficients of |
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expansion of all used parts are |
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temperature alloyed construction. |
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matched. |
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k |
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MAM047 |
Fig.1 Simplified outline (SOD57) and symbol.
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
MAX. |
UNIT |
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VRRM |
repetitive peak reverse voltage |
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1N5059 |
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200 |
V |
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1N5060 |
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400 |
V |
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1N5061 |
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600 |
V |
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1N5062 |
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800 |
V |
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VRWM |
crest working reverse voltage |
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1N5059 |
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200 |
V |
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1N5060 |
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400 |
V |
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1N5061 |
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600 |
V |
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1N5062 |
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800 |
V |
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VR |
continuous reverse voltage |
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1N5059 |
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200 |
V |
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1N5060 |
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400 |
V |
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1N5061 |
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600 |
V |
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1N5062 |
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800 |
V |
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IF(AV) |
average forward current |
Ttp = 45 °C; |
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2.0 |
A |
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lead length = 10 mm; |
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averaged over any 20 ms |
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period; see Figs 2 and 4 |
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Tamb = 80 °C; PCB mounting |
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0.8 |
A |
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(see Fig.9); averaged over any |
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20 ms period; see Figs 3 and 4 |
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IFSM |
non-repetitive peak forward current |
t = 10 ms half sinewave |
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50 |
A |
ERSM |
non-repetitive peak reverse avalanche |
L = 120 mH; Tj = Tj max prior to |
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20 |
mJ |
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energy |
surge; inductive load switched off |
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Tstg |
storage temperature |
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−65 |
+175 |
°C |
Tj |
junction temperature |
see Fig.5 |
−65 |
+175 |
°C |
1996 Jun 20 |
2 |
Philips Semiconductors |
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Product specification |
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Controlled avalanche rectifiers |
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1N5059 to 1N5062 |
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ELECTRICAL CHARACTERISTICS |
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Tj = 25 °C; unless otherwise specified. |
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SYMBOL |
PARAMETER |
CONDITIONS |
MIN. |
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TYP. |
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MAX. |
UNIT |
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VF |
forward voltage |
IF = 1 A; Tj = Tj max; see Fig.6 |
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0.8 |
V |
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IF = 1 A; see Fig.6 |
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1.0 |
V |
V(BR)R |
reverse avalanche |
IR = 0.1 mA |
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breakdown voltage |
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1N5059 |
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225 |
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- |
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V |
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1N5060 |
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450 |
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- |
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V |
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1N5061 |
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650 |
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- |
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V |
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1N5062 |
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900 |
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- |
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V |
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IR |
reverse current |
VR = VRRMmax; see Fig.7 |
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1 |
mA |
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VR = VRRMmax; Tj = 165 °C; see Fig.7 |
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150 |
mA |
trr |
reverse recovery time |
when switched from IF = 0.5 A to IR = 1 A; |
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3 |
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ms |
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measured at IR = 0.25 A; see Fig.10 |
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Cd |
diode capacitance |
VR = 0 V; f = 1 MHz; see Fig.8 |
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50 |
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pF |
THERMAL CHARACTERISTICS
SYMBOL |
PARAMETER |
CONDITIONS |
VALUE |
UNIT |
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Rth j-tp |
thermal resistance from junction to tie-point |
lead length = 10 mm |
46 |
K/W |
Rth j-a |
thermal resistance from junction to ambient |
note 1 |
100 |
K/W |
Note
1.Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ³40 mm, see Fig.9. For more information please refer to the “General Part of Handbook SC01”.
1996 Jun 20 |
3 |
Philips Semiconductors |
Product specification |
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Controlled avalanche rectifiers |
1N5059 to 1N5062 |
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GRAPHICAL DATA
MBG044
3 handbook, halfpage
IF(AV)
(A)
2
1
0 |
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0 |
40 |
80 |
120 |
160 |
200 |
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Ttp (°C) |
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a = 1.57; VR = VRRMmax; δ = 0.5. Lead length 10 mm.
Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage).
MGC745
4 |
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handbook, halfpage |
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P |
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(W) |
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3 |
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2.5 |
2 |
1.57 1.42 |
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a = 3 |
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IF(AV) (A) |
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a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5. |
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Fig.4 |
Maximum steady state power dissipation |
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(forward plus leakage current losses, |
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excluding switching losses) as a function |
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of average forward current. |
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MBG054
1.6 handbook, halfpage
IF(AV)
(A)
1.2
0.8
0.4
0
0 40 80 120 160 200 Tamb (°C)
a = 1.57; VR = VRRMmax; δ = 0.5. Device mounted as shown in Fig.9.
Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage).
MBH388
200 handbook, halfpage
Tj (°C)
100
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60 |
61 |
62 |
0
0 |
400 |
800 |
VR (V) |
1200 |
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Solid line = VR.
Dotted line = VRRM; δ = 0.5.
Fig.5 Maximum permissible junction temperature as a function of reverse voltage.
1996 Jun 20 |
4 |
Philips Semiconductors |
Product specification |
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Controlled avalanche rectifiers |
1N5059 to 1N5062 |
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MGC735
15 handbook, halfpage
IF
(A)
10
5
0
0 |
1 |
2 |
VF (V)
Solid line: Tj = 25 °C.
Dotted line: Tj = 175 °C.
Fig.6 Forward current as a function of forward voltage; maximum values.
MGC734
103 handbook, halfpage
IR
(μA)
102
max
10
1
10 −1
0 |
40 |
80 |
120 |
160 |
200 |
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Tj ( C)
VR = VRRMmax.
Fig.7 Reverse current as a function of junction temperature; maximum values.
MBG031
10 2 handbook, halfpage
Cd (pF)
10
1 |
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102 |
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1 |
10 |
VR |
(V) |
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f = 1 MHz; Tj = 25 °C.
Fig.8 Diode capacitance as a function of reverse voltage; typical values.
50
handbook, halfpage
25
7 
50
2
3
MGA200
Dimensions in mm.
Fig.9 Device mounted on a printed-circuit board.
1996 Jun 20 |
5 |
Philips Semiconductors |
Product specification |
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Controlled avalanche rectifiers |
1N5059 to 1N5062 |
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DUT |
IF |
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(A) |
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+ |
0.5 |
t rr |
10 Ω |
25 V |
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1 Ω |
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50 Ω |
0 |
t |
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0.25 |
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0.5 |
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IR |
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(A) |
MAM057 |
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1 |
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Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns.
Source impedance: 50 Ω; tr ≤ 15 ns.
Fig.10 Test circuit and reverse recovery time waveform and definition.
1996 Jun 20 |
6 |
Philips Semiconductors |
Product specification |
|
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Controlled avalanche rectifiers |
1N5059 to 1N5062 |
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PACKAGE OUTLINE |
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k |
a |
0.81 
max
3.81 |
28 min |
4.57 |
28 min |
MBC880 |
max |
max |
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Dimensions in mm.
Fig.11 SOD57
DEFINITIONS
Data sheet status
Objective specification |
This data sheet contains target or goal specifications for product development. |
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Preliminary specification |
This data sheet contains preliminary data; supplementary data may be published later. |
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Product specification |
This data sheet contains final product specifications. |
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Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jun 20 |
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