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DISCRETE SEMICONDUCTORS

handbook, 2 columns

M3D116

BYV98

Fast soft-recovery rectifier

Product specification

1996 Jun 07

Supersedes data of May 1993

File under Discrete Semiconductors, SC01

Philips Semiconductors

Product specification

 

 

 

 

Fast soft-recovery rectifier

BYV98

 

 

 

 

FEATURES

Glass passivated

High maximum operating temperature

Low leakage current

Excellent stability

Available in ammo-pack.

DESCRIPTION

construction. This package is

Rugged glass SOD57 package,

hermetically sealed and fatigue free

as coefficients of expansion of all

using a high temperature alloyed

used parts are matched.

 

k

a

2/3 page (Datasheet)

 

MAM047

Fig.1 Simplified outline (SOD57) and symbol.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

 

 

 

 

 

 

VRSM

non-repetitive peak reverse voltage

 

2100

V

VRRM

repetitive peak reverse voltage

 

2000

V

IF(AV)

average forward current

Ttp = 55 °C; lead length = 10 mm

1.00

A

 

 

see Fig. 2;

 

 

 

 

 

averaged over any 20 ms period;

 

 

 

 

 

see also Fig. 6

 

 

 

 

 

 

 

 

 

IF(AV)

average forward current

Tamb = 60 °C; PCB mounting (see

0.43

A

 

 

Fig.11); see Fig. 3;

 

 

 

 

 

averaged over any 20 ms period;

 

 

 

 

 

see also Fig. 6

 

 

 

 

 

 

 

 

 

IFRM

repetitive peak forward current

Ttp = 55 °C; see Fig. 4

9.0

A

 

 

Tamb = 60 °C; see Fig. 5

4.5

A

IFSM

non-repetitive peak forward current

t = 10 ms half sine wave;

15

A

 

 

Tj = Tj max prior to surge;

 

 

 

 

 

VR = VRRMmax

 

 

 

Tstg

storage temperature

 

65

+175

°C

Tj

junction temperature

see Fig.7

65

+175

°C

1996 Jun 07

2

Philips Semiconductors

 

 

 

Product specification

 

 

 

 

 

 

 

 

 

 

 

 

 

Fast soft-recovery rectifier

 

 

 

BYV98

 

 

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS

 

 

 

 

 

 

Tj = 25 °C unless otherwise specified.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

 

UNIT

 

 

 

 

 

 

 

 

 

 

 

 

VF

forward voltage

IF = 2 A; Tj = Tj max; see Fig. 8

-

-

2.2

 

V

 

 

 

 

 

 

IF = 2 A; see Fig. 8

-

-

2.4

 

V

IR

reverse current

VR = VRRMmax; see Fig. 9

-

-

5

 

mA

 

 

 

 

 

 

VR = VRRMmax; Tj = 125 °C;

-

-

50

 

mA

 

 

 

 

 

 

see Fig. 9

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

trr

reverse recovery time

when switched from IF = 0.5 A

-

-

300

 

ns

 

 

 

 

 

 

to IR = 1 A; measured at

 

 

 

 

 

 

 

 

 

 

 

IR = 0.25 A; see Fig. 12

 

 

 

 

 

Cd

diode capacitance

f = 1 MHz; VR = 0 V; see Fig 10

-

30

-

 

pF

 

dIR

 

 

maximum slope of

when switched from IF = 1 A to

-

-

5

 

A/ms

 

 

 

 

--------

 

 

reverse recovery current

VR ³ 30 V and dIF/dt = -1 A/ms;

 

 

 

 

 

 

dt

 

 

 

 

see Fig.13

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SYMBOL

PARAMETER

CONDITIONS

VALUE

 

UNIT

 

 

 

 

 

 

 

 

 

Rth j-tp

thermal resistance from junction to tie-point

lead length = 10 mm

46

 

K/W

Rth j-a

thermal resistance from junction to ambient

note 1

 

100

 

K/W

Note

1.Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ³40 mm, see Fig.11. For more information please refer to the ‘General Part of Handbook SC01’.

1996 Jun 07

3

Philips Semiconductors

Product specification

 

 

Fast soft-recovery rectifier

BYV98

 

 

GRAPHICAL DATA

MGC601

1.6 handbook, halfpage

IF(AV)

(A)

1.2

 

 

 

 

 

 

 

 

0.8

 

 

 

 

 

 

 

 

 

 

 

 

0.4

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

 

 

0

100

200

 

 

 

Ttp (oC)

a = 1.42; VR = VRRMmax; δ = 0.5.

 

 

Switched mode application.

 

 

Fig.2

Maximum permissible average forward

current as a function of tie-point temperature (including losses due to reverse leakage).

MGC600

0.6 handbook, halfpage

IF(AV)

(A)

0.4

0.2

0

 

 

 

 

 

 

200

0

100

 

 

Tamb

(oC)

a = 1.42; VR = VRRMmax; δ = 0.5.

 

 

Device mounted as shown in Fig.11.

 

 

Switched mode application.

 

 

Fig.3

Maximum permissible average forward

 

 

current as a function of ambient temperature

 

 

(including losses due to reverse leakage).

10

 

 

 

 

 

 

MGC603

 

 

 

 

 

 

 

handbook, full pagewidth

δ =

 

 

 

 

 

IFRM

 

 

 

 

 

 

 

0.05

 

 

 

 

 

(A)

 

 

 

 

 

 

 

8

 

 

 

 

 

 

 

6

 

0.1

 

 

 

 

 

4

 

0.2

 

 

 

 

 

2

 

0.5

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

0

–2

10 –1

 

 

10 2

10 3

10 4

10

1

10

 

 

 

 

 

 

 

tp (ms)

Ttp = 55°C; Rth j-tp = 46 K/W.

VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V.

Fig.4 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.

1996 Jun 07

4

Philips Semiconductors

Product specification

 

 

Fast soft-recovery rectifier

BYV98

 

 

5

 

 

 

 

 

 

MGC604

 

δ =

 

 

 

 

 

handbook, full pagewidth

 

 

 

 

 

IFRM

 

0.05

 

 

 

 

 

(A)

 

 

 

 

 

 

 

4

 

 

 

 

 

 

 

3

 

0.1

 

 

 

 

 

2

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

1

 

0.5

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

0

–2

10 –1

 

 

10 2

10 3

10 4

10

1

10

 

 

 

 

 

 

 

tp (ms)

Tamb = 60 °C; Rth j-a = 100 K/W.

VRRMmax during 1 − δ; curves include derating for Tj max at VRRM = 2000 V.

Fig.5 Maximum repetitive peak forward current as a function of pulse time (square pulse) and duty factor.

3

 

 

 

MGC599

200

 

MEA524 - 1

 

 

 

 

 

 

handbook, halfpage

a=3

2.5

2

1.57

handbook, halfpage

 

 

P

 

 

 

 

 

 

 

Tj

 

 

(W)

 

 

 

 

 

 

 

 

 

 

1.42

( o C)

 

 

2

 

 

 

 

 

 

 

 

 

 

 

 

100

 

 

1

 

 

 

 

 

 

 

0

 

 

 

 

0

 

 

0

0.5

 

 

1.0

0

1000

2000

 

IF(AV) (A)

 

 

VR

(V)

a = IF(RMS)/IF(AV); VR = VRRMmax; δ = 0.5.

Fig.6 Maximum steady state power dissipation

Solid line = VRRM; δ = 0.1.

Dotted line = VRRM; δ = 0.5.

(forward plus leakage current losses,

 

excluding switching losses) as a function

Fig.7 Maximum permissible junction temperature

of average forward current.

as a function of reverse voltage.

1996 Jun 07

5

Philips Semiconductors

Product specification

 

 

Fast soft-recovery rectifier

BYV98

 

 

10

 

 

 

 

MEA523

 

 

 

 

 

handbook, halfpage

 

 

 

 

 

IF

 

 

 

 

 

(A)

 

 

 

 

 

8

 

 

 

 

 

6

 

 

 

 

 

4

 

 

 

 

 

2

 

 

 

 

 

0

1

2

3

4

 

0

5

 

 

 

 

 

VF (V)

Dotted line: Tj = 175 °C.

Solid line: Tj = 25 °C.

Fig.8 Forward current as a function of forward voltage; maximum values.

103

 

MLC319

 

 

handbook, halfpage

 

I R

 

 

(μA)

 

 

102

 

 

10

 

 

1

100

200

0

 

T

(oC)

 

j

 

VR = VRRMmax.

 

Fig.9

Reverse current as a function of junction

 

temperature; maximum values.

10

2

 

 

MGC602

 

 

 

handbook, halfpage

 

 

 

Cd

 

 

 

 

(pF)

 

 

 

 

10

 

 

 

1

 

102

103

 

1

10

 

 

 

 

VR (V)

f = 1 MHz; Tj = 25 °C.

Fig.10 Diode capacitance as a function of reverse voltage; typical values.

50

handbook, halfpage

25

7

50

2

3

MGA200

Dimensions in mm.

Fig.11 Device mounted on a printed-circuit board.

1996 Jun 07

6

Philips Semiconductors

Product specification

 

 

Fast soft-recovery rectifier

BYV98

 

 

handbook, full pagewidth

DUT

IF

 

 

 

(A)

 

 

+

0.5

t rr

10 Ω

25 V

 

 

 

1 Ω

 

 

50 Ω

0

 

 

 

0.25

t

 

 

 

 

 

0.5

 

 

 

IR

 

 

 

(A)

MAM057

 

 

1

 

 

 

Input impedance oscilloscope: 1 MΩ, 22 pF; tr 7 ns.

Source impedance: 50 Ω; tr 15 ns.

Fig.12 Test circuit and reverse recovery time waveform and definition.

ndbook,I

halfpage

 

F

 

 

 

dI F

 

 

dt

 

 

trr

 

 

10%

t

 

dI R

 

 

dt

 

 

100%

 

IR

MGC499

Fig.13 Reverse recovery definitions.

1996 Jun 07

7

Philips Semiconductors

Product specification

 

 

Fast soft-recovery rectifier

BYV98

 

 

PACKAGE OUTLINE

 

handbook, full pagewidth

k

a

0.81 max

3.81

28 min

4.57

28 min

MBC880

max

max

 

 

 

 

Dimensions in mm.

The marking band indicates the cathode.

Fig.14 SOD57.

DEFINITIONS

Data Sheet Status

Objective specification

This data sheet contains target or goal specifications for product development.

 

 

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

 

 

Product specification

This data sheet contains final product specifications.

 

 

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

1996 Jun 07

8

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