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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MGP20N35CL/D

Advanced Information

SMARTDISCRETES

Internally Clamped, N-Channel

IGBT

This Logic Level Insulated Gate Bipolar Transistor (IGBT) features Gate±Emitter ESD protection, Gate±Collector overvoltage protection from SMARTDISCRETES monolithic circuitry for usage as an Ignition Coil Driver.

Temperature Compensated Gate±Drain Clamp Limits Stress Applied to Load

Integrated ESD Diode Protection

Low Threshold Voltage to Interface Power Loads to Logic or Microprocessors

Low Saturation Voltage

High Pulsed Current Capability

G

C

Rge

E

MGP20N35CL

20 AMPERES

VOLTAGE CLAMPED N±CHANNEL IGBT

Vce(on) = 1.8 VOLTS 350 VOLTS (CLAMPED)

G

C

E

CASE 221A±06, Style 9

TO±220AB

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

 

Value

Unit

 

 

 

 

 

Collector±Emitter Voltage

VCES

 

CLAMPED

Vdc

Collector±Gate Voltage

VCGR

 

CLAMPED

Vdc

Gate±Emitter Voltage

VGE

 

CLAMPED

Vdc

Collector Current Ð Continuous @ T C = 25°C

IC

 

20

Adc

Reversed Collector Current ± pulse width t 100 ms

ICR

 

12

Apk

Total Power Dissipation @ TC = 25°C (TO±220)

PD

 

150

Watts

Electrostatic Voltage Ð Gate±Emitter

ESD

 

3.5

kV

 

 

 

 

 

Operating and Storage Temperature Range

TJ, Tstg

 

± 55 to 175

°C

THERMAL CHARACTERISTICS

 

 

 

 

 

 

 

 

Thermal Resistance Ð Junction to Case ± (TO±220)

RqJC

 

1.0

°C/W

Thermal Resistance Ð Junction to Ambient

RqJA

 

62.5

 

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 5 seconds

TL

 

275

°C

Mounting Torque, 6±32 or M3 screw

 

10 lbf in (1.13 N m)

 

 

 

 

 

 

UNCLAMPED INDUCTIVE SWITCHING CHARACTERISTICS

 

 

 

 

 

 

 

 

 

Single Pulse Collector±Emitter Avalanche Energy

EAS

 

 

mJ

@ Starting TJ = 25°C

 

 

550

 

@ Starting TJ = 150°C

 

 

150

 

SMARTDISCRETES and TMOS are trademarks of Motorola, Inc.

This document contains information on a new product. Specifications and information herein are subject to change without notice.

Motorola, Inc. 1995

MGP20N35CL

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted)

Characteristic

 

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector±to±Emitter Breakdown Voltage

 

 

BVCES

 

 

 

Vdc

(IClamp = 10 mA, TJ = ±40 to 150°C)

 

 

 

 

320

350

380

 

Zero Gate Voltage Collector Current

 

 

 

ICES

 

 

 

 

(VCE = 250 V, VGE = 0 V, TJ = 125°C)

 

 

 

Ð

Ð

1.0

mA

(VCE = 15 V, VGE = 0 V, TJ = 125°C)

 

 

 

 

Ð

Ð

200

mA

Resistance Gate±Emitter (TJ = ±40 to 150°C)

 

RGE

10k

16k

30k

W

Gate±Emitter Breakdown Voltage (IG = 2 mA)

 

BVGES

11

13

15

"V

Collector±Emitter Reverse Leakage (VCE = ±15 V, TJ = ±40 to 150°C)

ICES

Ð

8

100

mA

Collector±Emitter Reversed Breakdown Voltage (IE = 75 mA)

BVCER

26

40

120

V

ON CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate Threshold Voltage

 

 

 

VGE(th)

 

 

 

V

(VCE = VGE, IC = 1 mA)

 

 

 

 

1.0

1.7

2.4

 

(VCE = VGE, IC = 1 mA, TJ = 150°C)

 

 

 

 

0.75

Ð

1.8

 

Collector±Emitter On±Voltage

 

 

 

VCE(on)

 

 

 

V

(VGE = 5 V, IC = 5 A)

 

 

 

 

Ð

1.1

1.4

 

(VGE = 5 V, IC = 10 A)

 

 

 

 

Ð

1.4

1.9

 

(VGE = 5 V, IC = 10 Adc, TJ = 150°C)

 

 

 

 

Ð

1.4

1.8

 

Forward Transconductance (VCE u 50 V, IC = 10 A)

gfs

10

16

Ð

S

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

(VCE = 25 Vdc, VGE = 0 Vdc,

Ciss

Ð

2800

Ð

pF

Output Capacitance

 

Coss

Ð

200

Ð

 

 

 

 

f = 1.0 MHz)

 

Transfer Capacitance

 

 

 

 

Crss

Ð

25

Ð

 

SWITCHING CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Total Gate Charge

 

 

(VCC = 280 V, IC = 20 A,

Qg

Ð

45

80

nC

Gate±Emitter Charge

 

 

Qgs

Ð

8.0

Ð

 

 

 

 

V = 5 V)

 

 

 

 

 

GE

 

 

 

 

 

Gate±Collector Charge

 

 

 

 

Qgd

Ð

20

Ð

 

Turn±Off Delay Time

 

 

(VCC = 320 V, IC = 20 A,

td(off)

Ð

TBD

TBD

μs

Fall Time

 

 

L = 200 mH, RG = 1 KW)

t

Ð

TBD

TBD

 

 

 

 

 

 

f

 

 

 

 

Turn±On Delay Time

 

 

(V

= 14 V, I = 20 A,

td(on)

Ð

TBD

TBD

μs

 

 

 

CC

C

 

 

 

 

 

Rise Time

 

 

L = 200 mH, RG = 1 KW)

t

Ð

TBD

TBD

 

 

 

 

 

 

r

 

 

 

 

(1) Pulse Test: Pulse Width 300 μs, Duty Cycle 2%.

 

 

 

 

 

2

Motorola TMOS Power MOSFET Transistor Device Data

MGP20N35CL

TYPICAL ELECTRICAL CHARACTERISTICS

 

40

VGE = 10 V

5 V

 

°

 

 

 

 

 

 

 

 

 

TJ = 25 C

 

(AMPS)

30

 

 

 

 

 

CURRENT

 

 

 

4 V

 

 

20

 

 

 

 

 

, COLLECTOR

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

3 V

 

 

I

 

 

 

 

 

 

0

2

4

6

8

10

 

0

 

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

Figure 1. Output Characteristics, TJ = 25°C

 

40

 

 

 

 

(AMPS)

 

VCE = 10 V

 

 

 

30

 

 

 

 

CURRENT

20

 

 

 

 

COLLECTOR,

10

 

TJ = 125°C

25°C

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

I

 

 

 

 

 

 

0

2

3

4

5

 

1

VGE, GATE±TO±EMITTER VOLTAGE (VOLTS)

Figure 3. Transfer Characteristics

 

40

 

 

 

 

 

 

 

TJ = 125°C

 

 

VGE = 10 V

 

5 V

 

 

 

 

(AMPS)

30

 

 

 

 

 

 

 

4 V

 

 

CURRENT

 

 

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

 

 

 

 

, COLLECTOR

10

 

 

 

 

 

 

 

3 V

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

0

1

2

3

4

5

6

7

8

9

10

 

0

 

 

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

 

 

 

Figure 2. Output Characteristics, TJ = 125°C

 

(VOLTS)

2.2

 

 

 

 

 

 

 

 

 

 

 

VGE = 5 V

 

 

 

 

 

 

 

 

VOLTAGE

2.0

 

 

 

 

IC = 20 A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.8

 

 

 

 

 

 

 

 

 

 

, COLLECTOR±TO±EMITTER

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

15 A

 

 

 

 

 

1.6

 

 

 

 

 

 

 

 

 

 

1.4

 

 

 

 

10 A

 

 

 

 

 

1.2

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

CE

 

 

 

 

 

 

 

 

 

 

±50

 

 

0

 

50

 

 

100

 

150

V

 

 

 

 

 

 

 

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

Figure 4. Collector±to±Emitter Saturation

Voltage versus Junction Temperature

 

10000

 

 

 

 

 

 

 

TJ = 25°C

 

 

V

CE

= 0 V

 

 

Ciss

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(pF)

1000

 

 

 

 

 

 

 

 

(pF)

 

 

 

 

 

 

 

 

 

CAPACITANCEC,

 

 

 

 

 

Crss

 

 

 

CAPACITANCEC,

 

100

 

 

 

 

Coss

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

 

 

 

1.0

25

50

75

100

125

150

175

200

 

0

1000

VCE = 0 V

100

10

1.0

10

TJ = 25°C

Ciss

Coss

Crss

100

1000

COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

DRAIN±TO±SOURCE VOLTAGE (VOLTS)

Figure 5. Capacitance Variation

Figure 6. High Voltage Capacitance Variation

Motorola TMOS Power MOSFET Transistor Device Data

3

MGP20N35CL

 

 

 

(VOLTS)

8

 

Qg

 

 

 

 

 

 

 

 

 

 

 

VOLTAGE

6

 

 

 

 

 

Qgs

Qgd

 

 

GATE±TO±EMITTER

 

 

 

4

 

 

 

 

2

 

 

TJ = 25°C

 

 

 

 

 

 

 

 

IC = 20 A

 

,

 

 

 

 

 

GE

 

 

 

 

 

V

0

 

 

 

 

 

10

20

30

40

 

0

Qg, TOTAL GATE CHARGE (nC)

(mJ)

60

VDD = 320 V

 

 

 

60

 

 

 

 

 

SWITCHING ENERGY LOSSES

50

VGE = 5 V

 

 

 

50

TJ = 125°C

 

 

 

40

IC = 20 A

 

Eoff

Td(off)

40

 

 

 

30

 

 

 

 

30

20

 

 

 

 

20

 

 

 

 

 

TIMESWITCHINGS)m(

TOTAL

10

 

 

TF

 

10

 

 

 

 

 

 

 

0

1000

2000

3000

4000

0

 

0

5000

 

 

 

RG, GATE RESISTANCE (OHMS)

 

Figure 7. Gate±to±Emitter and

Figure 8. Total Switching Losses

Collector±to±Emitter Voltage vs Total Charge

versus Gate Temperature

50

 

 

 

 

6

 

26

VCC = 320 V

 

 

6

SWITCHINGTOTALENERGY LOSSES (mJ)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

mS)(TIMESWITCHING

24

VGE = 5 V

 

 

mS)(TIMESWITCHING

 

 

 

 

5

SWITCHINGTOTALENERGY LOSSES(mJ)

RG = 1000 W

 

 

40

 

Eoff

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

22

L = 200 mH

 

 

 

30

 

 

 

 

4

 

 

IC = 20 A

Td(off)

 

 

 

Td(off)

 

 

 

 

20

 

E

off

 

 

 

 

 

 

3

 

 

 

 

 

20

 

 

VDD = 320 V

 

 

18

 

 

 

 

 

TF

 

 

 

 

 

 

 

 

 

V

= 5 V

2

 

 

 

 

 

 

 

 

 

GE

 

 

16

 

 

 

 

 

 

 

TJ = 25°C

 

 

 

 

 

 

10

 

 

IC = 20 A

1

 

14

 

 

 

 

 

 

 

 

 

 

 

 

 

TF

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

1000

2000

3000

4000

0

 

12

50

75

100

4

0

5000

 

25

125

 

 

RG, GATE RESISTANCE (OHMS)

 

 

 

 

TC, CASE TEMPERATURE (°C)

 

Figure 9. Total Switching Losses

Figure 10. Total Switching Losses

versus Gate Resistance

versus Case Temperature

 

25

VCC = 320 V

 

25

 

20

(mJ)

 

 

 

 

 

 

VGE = 5 V

Eoff

 

 

 

SWITCHINGENERGY LOSSES

 

 

 

16

20

RG = 1000 W

20

LATCH CURRENT (AMPS)

L = 200 mH

 

 

 

 

 

 

 

TJ = 125°C

 

 

12

 

 

 

 

15

 

Td(off)

15

 

 

 

 

 

8.0

10

 

 

10

4.0

 

 

 

S)TIMESWITCHINGm(

TOTAL

 

TF

 

 

 

 

5

 

 

5

 

0

 

10

15

 

 

5

20

 

 

 

 

IC, COLLECTOR±TO±EMITTER CURRENT (AMPS)

 

 

 

 

 

 

 

3 mH

 

 

 

 

 

10 mH

 

0

25

50

75

100

125

TEMPERATURE (°C)

Figure 11. Total Switching Losses

Figure 12. Latch Current versus Temperature

versus Collector Current

 

4

Motorola TMOS Power MOSFET Transistor Device Data

 

 

 

 

 

 

 

 

 

 

MGP20N35CL

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

D = 0.5

 

 

 

 

 

 

 

 

 

 

 

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

0.1

0.05

 

 

 

P(pk)

RθJC(t) = r(t) RθJC

 

 

NORMALIZEDr(t),EFFECTIVE

TRANSIENTRESISTANCETHERMAL

 

 

 

 

 

 

 

0.02

 

 

 

 

D CURVES APPLY FOR POWER

 

 

 

 

PULSE TRAIN SHOWN

 

 

 

 

 

t1

 

 

0.01

 

 

READ TIME AT t1

 

 

 

 

 

t2

T

J(pk)

± T

= P

Rθ

(t)

 

 

 

 

DUTY CYCLE, D = t1/t2

 

C

(pk)

JC

 

 

SINGLE PULSE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

1.0E± 05

1.0E± 04

1.0E± 03

1.0E± 02

1.0E± 01

 

 

1.0E+00

 

1.0E+01

t, TIME (s)

Figure 13. Thermal Response

PACKAGE DIMENSIONS

 

 

 

 

±T±

PLANESEATING

 

 

B

 

F

C

 

 

 

 

 

T

S

 

 

4

 

 

 

 

 

 

Q

 

 

A

 

 

 

1

2

3

U

 

STYLE 9:

 

 

PIN 1.

GATE

H

 

 

 

 

2.

COLLECTOR

 

 

 

 

3.

EMITTER

 

 

 

 

 

 

 

 

K

 

4.

COLLECTOR

Z

 

 

 

 

 

 

 

 

 

 

 

L

 

 

 

R

 

 

V

 

 

 

J

 

 

G

 

 

 

 

 

 

 

 

 

D

 

 

 

 

N

 

 

 

 

 

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.

 

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A

0.570

0.620

14.48

15.75

B

0.380

0.405

9.66

10.28

C

0.160

0.190

4.07

4.82

D

0.025

0.035

0.64

0.88

F

0.142

0.147

3.61

3.73

G

0.095

0.105

2.42

2.66

H

0.110

0.155

2.80

3.93

J

0.018

0.025

0.46

0.64

K

0.500

0.562

12.70

14.27

L

0.045

0.060

1.15

1.52

N

0.190

0.210

4.83

5.33

Q

0.100

0.120

2.54

3.04

R

0.080

0.110

2.04

2.79

S

0.045

0.055

1.15

1.39

T

0.235

0.255

5.97

6.47

U

0.000

0.050

0.00

1.27

V

0.045

±±±

1.15

±±±

Z

±±±

0.080

±±±

2.04

CASE 221A±06 (TO±220AB)

ISSUE Y

Motorola TMOS Power MOSFET Transistor Device Data

5

MGP20N35CL

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ªTypicalº parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including ªTypicalsº must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

How to reach us:

 

USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;

JAPAN: Nippon Motorola Ltd.; Tatsumi±SPD±JLDC, 6F Seibu±Butsuryu±Center,

P.O. Box 20912; Phoenix, Arizona 85036. 1±800±441±2447 or 602±303±5454

3±14±2 Tatsumi Koto±Ku, Tokyo 135, Japan. 03±81±3521±8315

MFAX: RMFAX0@email.sps.mot.com ± TOUCHTONE 602±244±6609

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

INTERNET: http://Design±NET.com

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852±26629298

MGP20N35CL/D

*MGP20N35CL/D*

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