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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MGW12N120D/D

Designer's Data Sheet

Insulated Gate Bipolar Transistor with Anti-Parallel Diode

N±Channel Enhancement±Mode Silicon Gate

This Insulated Gate Bipolar Transistor (IGBT) is co±packaged with a soft recovery ultra±fast rectifier and uses an advanced termination scheme to provide an enhanced and reliable high voltage±blocking capability. Short circuit rated IGBT's are specifically suited for applications requiring a guaranteed short circuit withstand time such as Motor Control Drives. Fast switching characteristics result in efficient operation at high frequencies. Co±packaged IGBT's save space, reduce assembly time and cost.

Industry Standard High Power TO±247 Package with

 

 

C

Isolated Mounting Hole

 

 

 

 

 

 

High Speed Eoff: 160 mJ per Amp typical at 125°C

 

 

 

 

High Short Circuit Capability ± 10 ms minimum

 

 

 

 

 

 

 

 

 

 

 

 

Soft Recovery Free Wheeling Diode is included in the package

G

 

 

 

 

 

 

 

 

 

Robust High Voltage Termination

 

 

 

 

 

 

 

Robust RBSOA

 

 

E

 

 

 

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

MGW12N120D

Motorola Preferred Device

IGBT & DIODE IN TO±247

12 A @ 90°C

20 A @ 25°C

1200 VOLTS

SHORT CIRCUIT RATED

G

C

 

E

 

CASE 340F±03, Style 4

 

TO±247AE

 

Rating

Symbol

 

Value

Unit

 

 

 

 

 

Collector±Emitter Voltage

VCES

 

1200

Vdc

Collector±Gate Voltage (RGE = 1.0 MW)

VCGR

 

1200

Vdc

Gate±Emitter Voltage Ð Continuous

VGE

 

± 20

Vdc

Collector Current Ð

Continuous @ T C = 25°C

IC25

 

20

Adc

Ð

Continuous @ T C = 90°C

IC90

 

12

 

Ð Repetitive Pulsed Current (1)

ICM

 

40

Apk

Total Power Dissipation @ TC = 25°C

PD

 

123

Watts

Derate above 25°C

 

 

 

0.98

W/°C

 

 

 

 

 

Operating and Storage Junction Temperature Range

TJ, Tstg

 

± 55 to 150

°C

Short Circuit Withstand Time

tsc

 

10

ms

(VCC = 720 Vdc, VGE = 15 Vdc, TJ = 125°C, RG = 20 W)

 

 

 

 

Thermal Resistance

Ð Junction to Case ± IGBT

RqJC

 

1.0

°C/W

 

Ð Junction to Case ± Diode

RqJC

 

1.4

 

 

Ð Junction to Ambient

RqJA

 

45

 

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 5 seconds

TL

 

260

°C

Mounting Torque, 6±32 or M3 screw

 

10 lbfSin (1.13 NSm)

 

 

 

 

 

 

 

(1) Pulse width is limited by maximum junction temperature. Repetitive rating.

Designer's Data for ªWorst Caseº Conditions Ð The Designer' s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves Ð representing boundaries on device characteristics Ð are given to facilitate ªworst caseº design.

Preferred devices are Motorola recommended choices for future use and best overall value.

REV 1

Motorola, Inc. 1996

MGW12N120D

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector±to±Emitter Breakdown Voltage

 

BVCES

 

 

 

Vdc

(VGE = 0 Vdc, IC = 25 μAdc)

 

 

1200

Ð

Ð

mV/°C

Temperature Coefficient (Positive)

 

 

Ð

870

Ð

 

 

 

 

 

 

 

 

Zero Gate Voltage Collector Current

 

ICES

 

 

 

μAdc

(VCE = 1200 Vdc, VGE = 0 Vdc)

 

 

Ð

Ð

100

 

(VCE = 1200 Vdc, VGE = 0 Vdc, TJ = 125°C)

 

Ð

Ð

2500

 

Gate±Body Leakage Current (VGE = ± 20 Vdc, VCE = 0 Vdc)

IGES

Ð

Ð

250

nAdc

ON CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector±to±Emitter On±State Voltage

 

VCE(on)

 

 

 

Vdc

(VGE = 15 Vdc, IC = 5.0 Adc)

 

 

Ð

2.71

3.37

 

(VGE = 15 Vdc, IC = 5.0 Adc, TJ = 125°C)

 

Ð

3.78

Ð

 

(VGE = 15 Vdc, IC = 10 Adc)

 

 

Ð

3.72

4.42

 

Gate Threshold Voltage

 

VGE(th)

 

 

 

Vdc

(VCE = VGE, IC = 1.0 mAdc)

 

 

4.0

6.0

8.0

mV/°C

Threshold Temperature Coefficient (Negative)

 

Ð

10

Ð

 

 

 

 

 

 

 

Forward Transconductance (VCE = 10 Vdc, IC = 10 Adc)

gfe

Ð

12

Ð

Mhos

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

(VCE = 25 Vdc, VGE = 0 Vdc,

Cies

Ð

1003

Ð

pF

Output Capacitance

 

Coes

Ð

126

Ð

 

 

f = 1.0 MHz)

 

Transfer Capacitance

 

 

Cres

Ð

106

Ð

 

SWITCHING CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

Turn±On Delay Time

 

(VCC = 720 Vdc, IC = 10 Adc,

td(on)

Ð

74

Ð

ns

Rise Time

 

tr

Ð

83

Ð

 

 

VGE = 15 Vdc, L = 300 mH

 

Turn±Off Delay Time

 

RG = 20 Ω, TJ = 25°C)

td(off)

Ð

76

Ð

 

 

 

Energy losses include ªtailº

 

 

 

 

 

Fall Time

 

tf

Ð

231

Ð

 

 

 

 

Turn±Off Switching Loss

 

 

Eoff

Ð

0.55

1.33

mJ

Turn±On Switching Loss

 

 

Eon

Ð

1.21

1.88

 

Total Switching Loss

 

 

Ets

Ð

1.76

3.21

 

Turn±On Delay Time

 

(VCC = 720 Vdc, IC = 10 Adc,

td(on)

Ð

66

Ð

ns

Rise Time

 

tr

Ð

87

Ð

 

 

VGE = 15 Vdc, L = 300 mH

 

Turn±Off Delay Time

 

RG = 20 Ω, TJ = 125°C)

t

Ð

120

Ð

 

 

 

Energy losses include ªtailº

d(off)

 

 

 

 

Fall Time

 

tf

Ð

575

Ð

 

 

 

 

Turn±Off Switching Loss

 

 

Eoff

Ð

1.49

Ð

mJ

Turn±On Switching Loss

 

 

Eon

Ð

2.37

Ð

 

Total Switching Loss

 

 

Ets

Ð

3.86

Ð

 

Gate Charge

 

(VCC = 720 Vdc, IC = 10 Adc,

QT

Ð

29

Ð

nC

 

 

Q1

Ð

13

Ð

 

 

 

V = 15 Vdc)

 

 

 

GE

 

 

 

 

 

 

 

 

Q2

Ð

12

Ð

 

DIODE CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

Diode Forward Voltage Drop

 

VFEC

 

 

 

Vdc

(IEC = 5.0 Adc)

 

 

Ð

2.26

3.32

 

(IEC = 5.0 Adc, TJ = 125°C)

 

 

Ð

1.37

Ð

 

(IEC = 10 Adc)

 

 

Ð

2.86

4.18

 

(1) Pulse Test: Pulse Width 300 μs, Duty Cycle 2%.

 

 

 

 

(continued)

2

Motorola TMOS Power MOSFET Transistor Device Data

MGW12N120D

ELECTRICAL CHARACTERISTICS Ð continued (TJ = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

DIODE CHARACTERISTICS Ð continued

 

 

 

 

 

 

 

 

 

 

 

 

Reverse Recovery Time

 

trr

Ð

116

Ð

ns

 

(IF = 10 Adc, VR = 720 Vdc,

ta

Ð

69

Ð

 

 

dIF/dt = 100 A/ms)

t

Ð

47

Ð

 

 

 

b

 

 

 

 

Reverse Recovery Stored Charge

 

QRR

Ð

0.36

Ð

mC

Reverse Recovery Time

 

trr

Ð

234

Ð

ns

 

(IF = 10 Adc, VR = 720 Vdc,

ta

Ð

149

Ð

 

 

dIF/dt = 100 A/ms, TJ = 125°C)

t

Ð

85

Ð

 

 

 

b

 

 

 

 

Reverse Recovery Stored Charge

 

QRR

Ð

1.40

Ð

mC

INTERNAL PACKAGE INDUCTANCE

 

 

 

 

 

 

 

 

 

 

 

Internal Emitter Inductance

LE

 

 

 

nH

(Measured from the emitter lead 0.25″ from package to emitter bond pad)

 

Ð

13

Ð

 

 

 

 

 

 

 

 

TYPICAL ELECTRICAL CHARACTERISTICS

 

40

TJ = 25°C

 

 

 

 

VGE = 20 V

 

40

(AMPS)

 

 

 

 

 

(AMPS)

 

30

 

 

 

 

 

 

 

30

CURRENT

 

 

 

 

 

 

17.5 V

CURRENT

 

 

 

 

 

 

 

 

20

 

 

 

 

 

 

15 V

20

, COLLECTOR

 

 

 

 

 

 

, COLLECTOR

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

12.5 V

10

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

C

 

I

 

 

 

 

 

 

 

7.5 V

I

 

 

 

 

 

 

 

 

 

 

 

 

0

1

2

3

4

5

6

7

8

0

 

0

 

 

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

 

 

TJ = 125°C

 

 

 

 

 

VGE = 20 V

 

 

 

 

 

 

 

 

17.5 V

 

 

 

 

 

 

 

 

15 V

 

 

 

 

 

 

 

 

12.5 V

 

 

 

 

 

 

 

 

10 V

 

0

1

2

3

4

5

6

7

8

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

 

 

Figure 1. Output Characteristics, TJ = 25°C

 

 

24

VCE = 10 V

 

 

 

 

 

 

 

 

 

 

(AMPS)

20

250 ms PULSE WIDTH

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CURRENT

16

 

 

 

 

 

12

 

 

TJ = 125°C

 

 

, COLLECTOR

 

 

 

 

8

 

 

 

25°C

 

4

 

 

 

 

 

C

 

 

 

 

 

I

 

 

 

 

 

 

0

7

9

11

13

15

 

5

 

 

VGE, GATE±TO±EMITTER VOLTAGE (VOLTS)

 

 

Figure 2. Output Characteristics, TJ = 125°C

 

(VOLTS)

3.8

 

 

 

 

3.6

 

IC = 10 A

 

 

VOLTAGE

 

 

 

3.4

 

 

 

 

3.2

 

 

 

 

COLLECTOR±TO±EMITTER

 

7.5 A

 

 

3.0

 

 

 

 

 

 

 

2.8

 

 

 

 

2.6

 

5 A

 

 

 

 

 

 

2.4

 

 

 

 

2.2

VGE = 15 V

 

 

 

,

 

250 ms PULSE WIDTH

 

 

 

CE

2

 

 

 

 

 

 

 

V

± 50

0

50

100

150

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

Figure 3. Transfer Characteristics

Figure 4. Collector±to±Emitter Saturation

 

Voltage versus Junction Temperature

Motorola TMOS Power MOSFET Transistor Device Data

3

MGW12N120D

 

 

 

 

 

10000

 

 

 

 

TJ = 25°C

 

 

 

 

 

 

(pF)

1000

 

 

Cies

 

 

CAPACITANCE

 

 

 

 

 

 

 

 

Coes

 

 

100

 

 

Cres

 

 

C,

 

 

 

 

 

10

5

10

15

20

25

 

0

GATE±TO±EMITTER OR COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

Figure 5. Capacitance Variation

 

1000

 

 

 

 

 

 

V

GE

= 0 V

 

Cies

 

 

 

 

 

 

 

(pF)

 

 

 

 

 

 

C, CAPACITANCE

100

 

 

 

Coes

 

 

 

 

 

 

 

 

 

 

Cres

 

 

10

 

 

 

 

TJ = 25°C

 

 

 

100

150

200

 

50

 

 

COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

Figure 5b. High Voltage Capacitance

Variation

(VOLTS)

16

 

QT

 

 

 

 

 

 

 

 

 

 

 

VOLTAGE

12

 

 

 

 

Q1

 

Q2

 

 

, GATE±TO±EMITTER

8

 

 

 

 

4

 

 

 

TJ = 25°C

 

 

 

IC = 20 A

 

 

 

 

GE

 

 

 

 

 

V

0

 

 

 

 

 

20

40

60

80

 

0

Qg, TOTAL GATE CHARGE (nC)

Figure 6. Gate±to±Emitter and Collector±to±Emitter Voltage versus Total Charge

(mJ)

3

VCC = 720 V

 

 

 

 

 

 

 

 

VGE = 15 V

 

 

 

ENERGY LOSSES

 

IC = 10 A

 

 

 

TJ = 125°C

 

 

2.5

 

 

 

 

 

 

 

2

 

 

 

 

SWITCHING

 

7.5 A

 

 

 

 

 

 

1.5

 

 

 

 

TOTAL

 

 

5 A

 

 

 

 

 

 

 

 

1

20

30

40

50

 

10

 

 

RG, GATE RESISTANCE (OHMS)

 

Figure 7. Total Switching Losses versus

Gate Resistance

(mJ)

3

 

 

 

 

 

2.8

VCC = 720 V

 

 

 

 

LOSSES

2.6

VGE = 15 V

 

 

 

 

2.4

RG = 20 Ω

 

IC = 10 A

 

 

2.2

 

 

 

 

ENERGY

2

 

 

 

 

 

1.8

 

 

 

 

 

1.6

 

 

7.5 A

 

 

SWITCHING

1.4

 

 

 

 

 

 

 

 

 

1.2

 

 

5 A

 

 

1

 

 

 

 

 

 

 

 

 

0.8

 

 

 

 

 

0.6

 

 

 

 

 

TOTAL

 

 

 

 

 

0.4

 

 

 

 

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

0

50

75

100

125

150

 

25

 

 

 

TC, CASE TEMPERATURE (°C)

 

 

Figure 8. Total Switching Losses versus

Case Temperature

(mJ)

2.4

VCC = 720 V

 

 

 

 

 

 

 

 

 

LOSSES

2.2

VGE = 15 V

 

 

 

 

 

RG = 20 Ω

 

 

 

 

2

TJ = 125°C

 

 

 

 

ENERGY

1.8

 

 

 

 

 

 

 

 

 

 

 

SWITCHING

1.6

 

 

 

 

 

1.4

 

 

 

 

 

 

 

 

 

 

 

TOTAL

1.2

 

 

 

 

 

 

 

 

 

 

 

 

1

6

7

8

9

10

 

5

 

 

IC, COLLECTOR±TO±EMITTER CURRENT (AMPS)

 

Figure 9. Total Switching Losses versus

Collector±to±Emitter Current

4

Motorola TMOS Power MOSFET Transistor Device Data

CURRENTFORWARD(AMPS)

25

 

 

 

CURRENTCOLLECTOR±TO±EMITTER(A)

20

 

 

 

 

 

 

 

 

 

15

 

TJ = 125°C

 

 

INSTANTANEOUS

10

 

 

TJ = 25°C

C

 

 

 

 

 

 

 

 

 

5

 

 

 

 

 

0

 

 

 

,

,

 

 

 

I

F

0

1

2

3

4

I

 

 

VFM, FORWARD VOLTAGE DROP (VOLTS)

 

MGW12N120D

100

10

1

VGE = 15 V

RGE = 20 Ω

TJ = 125°C

0.1

1

10

100

1000

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

Figure 10. Maximum Forward Drop versus

Figure 11. Reverse Biased

Instantaneous Forward Current

Safe Operating Area

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

TRANSIENT THERMAL RESISTANCE

 

D = 0.5

 

 

 

 

 

 

 

 

 

 

 

r(t), NORMALIZED EFFECTIVE

 

0.2

 

 

 

 

 

 

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

0.1

0.05

 

 

P(pk)

 

 

 

 

 

 

 

 

0.02

 

 

 

RθJC(t) = r(t) RθJC

 

 

 

0.01

 

 

 

 

D CURVES APPLY FOR POWER

 

 

 

 

t1

PULSE TRAIN SHOWN

 

SINGLE PULSE

 

 

 

READ TIME AT t1

 

 

 

 

 

 

 

t2

T

J(pk)

± T

= P

(pk)

Rθ

(t)

 

 

 

 

DUTY CYCLE, D = t1/t2

 

C

 

 

JC

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0E±05

1.0E±04

1.0E±03

1.0E±02

1.0E±01

 

 

 

1.0E+00

1.0E+01

t, TIME (s)

Figure 12. Thermal Response

Motorola TMOS Power MOSFET Transistor Device Data

5

MGW12N120D

PACKAGE DIMENSIONS

 

±Q±

 

 

±T±

NOTES:

 

 

 

 

 

 

 

E

1. DIMENSIONING AND TOLERANCING PER ANSI

0.25 (0.010) M T

B

 

 

 

M

±B±

 

C

Y14.5M, 1982.

 

 

 

 

 

 

 

2. CONTROLLING DIMENSION: MILLIMETER.

 

 

 

 

 

 

4

MILLIMETERS

INCHES

 

 

 

 

U

L

DIM

MIN

MAX

MIN

MAX

 

 

 

 

A

20.40

20.90

0.803

0.823

 

 

 

 

 

 

 

 

 

 

 

B

15.44

15.95

0.608

0.628

 

A

 

 

 

 

C

4.70

5.21

0.185

0.205

 

R

 

 

 

D

1.09

1.30

0.043

0.051

 

 

 

 

 

 

 

 

 

 

E

1.50

1.63

0.059

0.064

 

 

 

 

 

 

 

 

1

2

3

 

F

1.80

2.18

0.071

0.086

 

 

 

 

 

 

G

5.45 BSC

0.215 BSC

 

 

 

 

 

±Y±

H

2.56

2.87

0.101

0.113

 

 

P

 

 

J

0.48

0.68

0.019

0.027

 

K

 

 

 

K

15.57

16.08

0.613

0.633

 

 

 

 

 

 

L

7.26

7.50

0.286

0.295

 

 

 

 

 

 

P

3.10

3.38

0.122

0.133

 

 

F

 

 

H

Q

3.50

3.70

0.138

0.145

 

 

 

V

R

3.30

3.80

0.130

0.150

 

 

 

 

J

U

5.30 BSC

0.209 BSC

 

 

D

 

 

V

3.05

3.40

0.120

0.134

 

 

G

 

 

0.25 (0.010) M

Y

Q S

 

 

STYLE 4:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PIN 1. GATE

 

 

 

 

 

 

 

 

 

 

2. COLLECTOR

 

 

 

 

 

 

 

 

 

3. EMITTER

 

 

 

 

 

 

 

 

 

4. COLLECTOR

 

 

CASE 340F±03

TO±247AE

ISSUE E

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ªTypicalº parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including ªTypicalsº must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

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USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;

JAPAN: Nippon Motorola Ltd.; Tatsumi±SPD±JLDC, 6F Seibu±Butsuryu±Center,

P.O. Box 20912; Phoenix, Arizona 85036. 1±800±441±2447 or 602±303±5454

3±14±2 Tatsumi Koto±Ku, Tokyo 135, Japan. 03±81±3521±8315

MFAX: RMFAX0@email.sps.mot.com ± TOUCHTONE 602±244±6609

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

INTERNET: http://Design±NET.com

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852±26629298

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