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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MGW21N60ED/D

Preliminary Data Sheet

Insulated Gate Bipolar Transistor

N±Channel Enhancement±Mode Silicon Gate

This Insulated Gate Bipolar Transistor (IGBT) is co±packaged with a soft recovery ultra±fast rectifier and uses an advanced termination scheme to provide an enhanced and reliable high voltage±blocking capability. Its new 600V IGBT technology is specifically suited for applications requiring both a high tempera-

ture short circuit capability and a low VCE(on). It also provides fast switching characteristics and results in efficient operation at high

frequencies. Co±packaged IGBTs save space, reduce assembly time and cost. This new E±series introduces an energy efficient, ESD protected, and rugged short circuit device.

Industry Standard TO±247 Package

 

 

 

C

 

 

 

 

 

 

 

 

 

High Speed: Eoff = 65 mJ/A typical at 125°C

 

 

 

 

 

 

 

 

High Voltage Short Circuit Capability ± 10 ms minimum at

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

125°C, 400 V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Low On±Voltage Ð 2.1 V typical at 20 A, 125 °C

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Soft Recovery Free Wheeling Diode is included in the Package

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Robust High Voltage Termination

 

 

 

 

 

 

 

 

ESD Protection Gate±Emitter Zener Diodes

 

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MGW21N60ED

IGBT IN TO±247

21 A @ 90°C

31 A @ 25°C

600 VOLTS

SHORT CIRCUIT RATED

ON±VOLTAGE

G

C

E

CASE 340K±01,

TO±247 AE

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Rating

Symbol

 

Value

Unit

 

 

 

 

 

Collector±Emitter Voltage

VCES

 

600

Vdc

Collector±Gate Voltage (RGE = 1.0 MW)

VCGR

 

600

Vdc

Gate±Emitter Voltage Ð Continuous

VGE

 

± 20

Vdc

Collector Current Ð Continuous @ T C = 25°C

IC25

 

31

Adc

Ð Continuous @ T C = 90°C

IC90

 

21

 

Ð Repetitive Pulsed Current (1)

ICM

 

42

Apk

Total Power Dissipation @ TC = 25°C

PD

 

142

Watts

Derate above 25°C

 

 

1.14

W/°C

 

 

 

 

 

Operating and Storage Junction Temperature Range

TJ, Tstg

 

± 55 to 150

°C

Short Circuit Withstand Time

tsc

 

10

ms

(VCC = 400 Vdc, VGE = 15 Vdc, TJ = 125°C, RG = 20 W)

 

 

 

 

Thermal Resistance Ð Junction to Case ± IGBT

RqJC

 

0.88

°C/W

Ð Junction to Diode

RqJC

 

1.4

 

Ð Junction to Ambient

RqJA

 

45

 

Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 5 seconds

TL

 

260

°C

Mounting Torque, 6±32 or M3 screw

 

10 lbfSin (1.13 NSm)

 

 

 

 

 

 

(1) Pulse width is limited by maximum junction temperature. Repetitive rating.

This document contains information on a new product. Specifications and information herein are subject to change without notice.

 

IGBT Device Data

1

 

Motorola,Inc. 1997

 

MGW21N60ED

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

 

OFF CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector±to±Emitter Breakdown Voltage

 

V(BR)CES

 

 

 

Vdc

(VGE = 0 Vdc, IC = 25 μAdc)

 

 

600

Ð

Ð

mV/°C

Temperature Coefficient (Positive)

 

 

Ð

870

Ð

 

 

 

 

 

 

 

Emitter±to±Collector Breakdown Voltage (VGE = 0 Vdc, IEC = 100 mAdc)

BVECS

15

Ð

Ð

Vdc

Zero Gate Voltage Collector Current

 

ICES

 

 

 

μAdc

(VCE = 600 Vdc, VGE = 0 Vdc)

 

 

Ð

Ð

10

 

(VCE = 600 Vdc, VGE = 0 Vdc, TJ = 125°C)

 

Ð

Ð

200

 

Gate±Body Leakage Current (VGE = ± 20 Vdc, VCE = 0 Vdc)

IGES

Ð

Ð

50

μAdc

ON CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Collector±to±Emitter On±State Voltage

 

VCE(on)

 

 

 

Vdc

(VGE = 15 Vdc, IC = 10 Adc)

 

 

Ð

1.7

2.1

 

(VGE = 15 Vdc, IC = 10 Adc, TJ = 125°C)

 

Ð

1.5

Ð

 

(VGE = 15 Vdc, IC = 20 Adc)

 

 

Ð

2.2

2.5

 

Gate Threshold Voltage

 

VGE(th)

 

 

 

Vdc

(VCE = VGE, IC = 1.0 mAdc)

 

 

4.0

6.0

8.0

mV/°C

Threshold Temperature Coefficient (Negative)

 

Ð

10

Ð

 

 

 

 

 

 

 

Forward Transconductance (VCE = 10 Vdc, IC = 20 Adc)

gfe

Ð

8.6

Ð

Mhos

DYNAMIC CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Input Capacitance

 

(VCE = 25 Vdc, VGE = 0 Vdc,

Cies

Ð

1605

Ð

pF

Output Capacitance

 

Coes

Ð

146

Ð

 

 

f = 1.0 MHz)

 

Transfer Capacitance

 

 

Cres

Ð

23

Ð

 

SWITCHING CHARACTERISTICS (1)

 

 

 

 

 

 

 

 

 

 

 

 

 

Turn±On Delay Time

 

 

td(on)

Ð

29

Ð

ns

Rise Time

 

 

tr

Ð

60

Ð

 

Turn±Off Delay Time

 

(VCC = 360 Vdc, IC = 20 Adc,

td(off)

Ð

238

Ð

 

 

 

VGE = 15 Vdc, L = 300 mH,

 

 

 

 

 

Fall Time

 

tf

Ð

140

Ð

 

 

RG = 20 Ω, TJ = 25°C)

 

Turn±Off Switching Loss

 

Eoff

Ð

0.8

1.15

mJ

 

Energy losses include ªtailº

Turn±On Switching Loss

 

 

Eon

Ð

0.6

Ð

 

Total Switching Loss

 

 

Ets

Ð

1.4

Ð

 

Turn±On Delay Time

 

 

td(on)

Ð

28

Ð

ns

Rise Time

 

 

tr

Ð

62

Ð

 

Turn±Off Delay Time

 

(VCC = 360 Vdc, IC = 20 Adc,

td(off)

Ð

338

Ð

 

 

 

VGE = 15 Vdc, L = 300 mH,

 

 

 

 

 

Fall Time

 

tf

Ð

220

Ð

 

 

RG = 20 Ω, TJ = 125°C)

 

Turn±Off Switching Loss

 

Eoff

Ð

1.3

Ð

mJ

 

Energy losses include ªtailº

Turn±On Switching Loss

 

 

Eon

Ð

0.8

Ð

 

Total Switching Loss

 

 

Ets

Ð

2.1

Ð

 

Gate Charge

 

(VCC = 360 Vdc, IC = 20 Adc,

QT

Ð

86

Ð

nC

 

 

Q1

Ð

18

Ð

 

 

 

VGE = 15 Vdc)

 

 

 

 

Q2

Ð

39

Ð

 

DIODE CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

Diode Forward Voltage Drop

 

VFEC

 

 

 

Vdc

(IEC = 10 Adc)

 

 

Ð

1.6

1.9

 

(IEC = 10 Adc, TJ = 125°C)

 

 

Ð

1.3

Ð

 

(IEC = 17 Adc)

 

 

1.7

2.0

2.3

 

(1) Pulse Test: Pulse Width 300 μs, Duty Cycle 2%.

 

 

 

 

(continued)

2

Motorola IGBT Device Data

MGW21N60ED

ELECTRICAL CHARACTERISTICS Ð continued (TJ = 25°C unless otherwise noted)

Characteristic

Symbol

Min

Typ

Max

Unit

 

 

 

 

 

 

 

DIODE CHARACTERISTICS Ð continued

 

 

 

 

 

 

 

 

 

 

 

 

Reverse Recovery Time

 

trr

Ð

94

Ð

ns

 

(IF = 20 Adc, VR = 360 Vdc,

ta

Ð

32

Ð

 

 

dIF/dt = 200 A/ms)

t

Ð

62

Ð

 

 

 

b

 

 

 

 

Reverse Recovery Stored Charge

 

QRR

Ð

0.16

Ð

mC

Reverse Recovery Time

 

trr

Ð

145

Ð

ns

 

(IF = 20 Adc, VR = 360 Vdc,

ta

Ð

50

Ð

 

 

dIF/dt = 200 A/ms, TJ = 125°C)

t

Ð

95

Ð

 

 

 

b

 

 

 

 

Reverse Recovery Stored Charge

 

QRR

Ð

0.75

Ð

mC

INTERNAL PACKAGE INDUCTANCE

 

 

 

 

 

 

 

 

 

 

 

Internal Emitter Inductance

LE

 

 

 

nH

(Measured from the emitter lead 0.25″ from package to emitter bond pad)

 

Ð

13

Ð

 

 

 

 

 

 

 

 

 

60

 

17.5 V

15 V

 

60

 

 

TJ = 25°C

 

 

 

 

 

 

 

 

(AMPS)

 

 

20 V

 

(AMPS)

 

 

 

 

12.5 V

 

CURRENT

40

 

 

CURRENT

40

 

 

 

VGE = 10 V

 

, COLLECTOR

 

 

 

, COLLECTOR

 

20

 

 

 

20

 

 

 

 

 

C

 

 

 

 

C

 

I

 

 

 

 

I

 

 

0

2

4

 

 

0

 

0

 

6

 

 

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

 

 

TJ = 125°C

17.5 V

15 V

 

 

 

 

 

 

20 V

12.5 V

 

 

 

 

VGE = 10 V

 

0

2

4

6

8

 

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

 

Figure 1. Output Characteristics

Figure 2. Output Characteristics

 

60

 

 

 

 

 

 

(VOLTS)

2.3

 

 

VCE = 100 V

 

 

 

 

 

 

CURRENT(AMPS)

50

 

 

 

 

 

VOLTAGE

 

5 ms PULSE WIDTH

 

 

 

 

 

 

 

 

 

 

2.1

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

30

 

 

 

 

 

 

1.9

,COLLECTOR

20

TJ = 125°C

 

 

 

 

COLLECTOR±TO±EMITTER

 

 

 

 

 

 

1.7

10

 

 

 

 

 

 

 

C

 

25°C

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

,

1.5

 

 

 

 

 

 

 

CE

 

5

7

9

11

13

15

17

 

 

V

 

 

 

 

VGE, GATE±TO±EMITTER VOLTAGE (VOLTS)

 

 

 

 

 

IC = 20 A

 

 

 

 

 

 

 

 

15 A

 

 

 

 

VGE = 15 V

 

 

 

10 A

 

 

 

 

 

 

 

 

 

 

 

 

80 ms PULSE WIDTH

 

 

 

 

 

 

±50

±25

0

25

50

75

100

125

150

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

Figure 3. Transfer Characteristics

Figure 4. Collector±To±Emitter Saturation

 

Voltage versus Junction Temperature

Motorola IGBT Device Data

3

MGW21N60ED

 

 

 

 

 

4000

 

 

 

 

(VOLTS)

20

 

 

 

 

TJ = 25°C

 

3200

 

 

 

VGE = 0 V

16

 

 

 

GATE±TO±EMITTERVOLTAGE

2400

 

 

Cies

 

12

 

 

 

 

 

1600

Coes

 

 

 

8

800

Cres

 

 

 

4

(pF)CAPACITANCEC,

 

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

 

GE

 

0

 

 

 

 

V

0

 

 

 

 

 

0

5

10

15

20

25

 

 

 

QT

 

 

 

Q1

 

Q2

 

 

 

 

 

 

 

TJ = 25°C

 

 

 

 

 

VCC = 300 V

 

 

 

 

 

IC = 20 A

 

0

25

50

75

100

125

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

QG, TOTAL GATE CHARGE (nC)

Figure 5. Capacitance Variation

Figure 6. Gate±To±Emitter Voltage versus

 

Total Charge

 

3.0

TJ = 125°C

 

 

 

 

(mJ)

 

 

 

 

 

2.5

VDD = 360 V

 

 

 

IC = 20 A

LOSSES

VGE = 15 V

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

ENERGY

1.5

 

 

 

 

15 A

 

 

 

 

 

 

 

 

 

 

 

, TOTAL

1.0

 

 

 

 

10 A

 

 

 

 

 

 

TS

0.5

 

 

 

 

 

E

 

 

 

 

 

 

0

10

20

30

40

50

 

5

RG, GATE RESISTANCE (OHMS)

Figure 7. Total Energy Losses versus

Gate Resistance

 

2.5

 

 

 

 

 

 

 

(mJ)

 

VCC = 360 V

 

 

 

IC = 20 A

 

2.0

VGE = 15 V

 

 

 

 

 

 

LOSSES

RG = 20 W

 

 

 

 

 

 

 

 

 

 

 

 

 

1.5

 

 

 

 

 

 

15 A

 

 

 

 

 

 

 

ENERGY

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

10 A

, TOTAL

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TS

0.5

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

0

±25

0

25

50

75

100

125

 

±50

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

Figure 8. Total Energy Losses versus

Junction Temperature

 

 

 

 

 

 

1.5

ENERGY LOSSES (mJ)

2.0

TJ = 125°C

 

 

ENERGY LOSSES (mJ)

 

 

VCC = 360 V

 

 

1.3

1.6

VGE = 15 V

 

 

RG = 20 W

 

 

 

1.2

 

 

 

1.1

 

 

 

 

 

 

 

 

0.9

, TOTAL

0.8

 

 

 

TURN±OFF,

 

 

 

 

 

 

 

 

 

TS

0.4

 

 

 

0.7

E

 

 

 

 

off

 

 

 

 

 

 

E

 

 

0

 

 

 

 

0.5

 

0

5

10

15

20

 

IC, COLLECTOR CURRENT (AMPS)

 

 

IC = 20 A

 

 

 

 

 

 

TJ = 125°C

 

 

 

 

VDD = 360 V

 

 

 

 

VGE = 15 V

 

 

15 A

 

 

 

 

10 A

 

 

5

15

25

35

45

 

 

RG, GATE RESISTANCE (OHMS)

 

Figure 9. Total Energy Losses versus

Figure 10. Turn±Off Losses versus

Collector Current

Gate Resistance

4

Motorola IGBT Device Data

 

 

 

 

 

 

 

 

 

 

 

1.4

(mJ)

1.6

VCC = 360 V

 

 

 

 

 

 

(mJ)

1.2

VGE = 15 V

 

 

 

 

 

 

 

LOSSES

 

 

 

 

 

IC = 20 A

 

 

LOSSES

 

 

RG = 20 W

 

 

 

 

 

 

1.0

1.2

 

 

 

 

 

 

 

15 A

 

 

 

 

 

 

 

 

ENERGY

 

 

 

 

 

 

 

 

 

ENERGY

0.8

0.8

 

 

 

 

 

 

 

10 A

0.6

, TURN±OFF

 

 

 

 

 

 

 

 

,TURN±OFF

 

 

 

 

 

 

 

 

 

0.4

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.2

off

 

 

 

 

 

 

 

 

 

off

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

E

0

 

0

 

 

 

 

 

 

 

 

 

 

±50

±25

0

25

50

75

100

125

150

 

 

 

 

 

TJ, JUNCTION TEMPERATURE (°C)

 

 

 

 

 

 

 

 

MGW21N60ED

TJ = 125°C

 

 

 

VCC = 360 V

 

 

 

VGE = 15 V

 

 

 

R

G

= 20 W

 

 

 

 

 

 

 

 

0

 

5

10

15

20

IC, COLLECTOR CURRENT (AMPS)

Figure 11. Turn±Off Losses versus

Figure 12. Turn±Off Losses versus

Junction Temperature

Collector Current

100

FORWARDINSTANTANEOUS (AMPS)CURRENT 10 ,

I F

1

0.5

TJ = 125°C

25°C

1.0

1.5

2.0

2.5

VFM, FORWARD VOLTAGE DROP (VOLTS)

 

Figure 13. Forward Characteristics

versus Current

IC, COLLECTOR CURRENT (AMPS)

100

10

TJ = 125°C

RGE = 20 W

VGE = 15 V

1

1

10

100

1000

VCE, COLLECTOR±TO±EMITTER VOLTAGE (VOLTS)

Figure 14. Reverse Biased Safe

Operating Area

Motorola IGBT Device Data

5

MGW21N60ED

PACKAGE DIMENSIONS

 

±Q±

 

 

±T±

 

 

 

 

 

 

 

 

E

 

 

 

 

 

0.25 (0.010) M T

B

M

±B±

 

NOTES:

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

DIMENSIONING AND TOLERANCING PER ANSI

 

 

 

 

 

4

Y14.5M, 1982.

 

 

 

 

 

U

 

 

L

CONTROLLING DIMENSION: MILLIMETER.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

MILLIMETERS

INCHES

 

A

 

 

 

 

DIM

MIN

MAX

MIN

MAX

 

 

 

 

R

A

19.7

20.3

0.776

0.799

 

 

 

 

 

B

15.3

15.9

0.602

0.626

 

 

 

 

 

 

 

 

1

2

3

 

C

4.7

5.3

0.185

0.209

 

 

 

D

1.0

1.4

0.039

0.055

 

 

 

 

 

 

 

 

 

 

 

 

E

1.27 REF

0.050 REF

 

 

 

 

 

±Y±

F

2.0

2.4

0.079

0.094

 

 

P

 

 

G

5.5 BSC

0.216 BSC

 

K

 

 

 

H

2.2

2.6

0.087

0.102

 

 

 

 

 

 

 

 

 

 

J

0.4

0.8

0.016

0.031

 

 

 

 

 

 

 

 

 

 

 

 

K

14.2

14.8

0.559

0.583

 

 

 

 

 

 

L

5.5 NOM

0.217 NOM

 

 

 

 

V

H

P

3.7

4.3

0.146

0.169

 

 

F

 

Q

3.55

3.65

0.140

0.144

 

 

G

 

J

R

5.0 NOM

0.197 NOM

 

 

 

 

 

 

D

 

 

U

5.5 BSC

0.217 BSC

 

 

 

 

 

V

3.0

3.4

0.118

0.134

0.25 (0.010) M

Y

Q S

 

 

 

 

STYLE 4:

 

 

 

 

 

 

 

 

 

PIN 1. GATE

 

 

 

 

 

 

 

CASE 340K±01

 

 

2. COLLECTOR

 

 

 

 

 

 

 

 

3. EMITTER

 

ISSUE A

4. COLLECTOR

 

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ªTypicalº parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including ªTypicalsº must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

 

 

Mfax is a trademark of Motorola, Inc.

How to reach us:

 

 

USA / EUROPE / Locations Not Listed: Motorola Literature Distribution;

JAPAN: Nippon Motorola Ltd.: SPD, Strategic Planning Office, 141,

P.O. Box 5405, Denver, Colorado 80217. 1±303±675±2140 or 1±800±441±2447

4±32±1 Nishi±Gotanda, Shagawa±ku, Tokyo, Japan. 03±5487±8488

Customer Focus Center: 1±800±521±6274

 

Mfax : RMFAX0@email.sps.mot.com ± TOUCHTONE 1±602±244±6609

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park,

Motorola Fax Back System

± US & Canada ONLY 1±800±774±1848

51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852±26629298

 

± http://sps.motorola.com/mfax/

 

HOME PAGE: http://motorola.com/sps/

 

 

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MGW21N60ED/D

 

Motorola IGBT Device Data

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