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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Order this document by MHPM6B10N120/D

Hybrid Power Module

Integrated Power Stage for 460 VAC Motor Drives

These modules integrate a 3±phase inverter in a single convenient package. They are designed for 2.0, 3.0, and 5.0 hp motor drive applications. The inverter incorporates advanced insulated gate bipolar transistors (IGBT) matched with fast soft free±wheeling diodes to give optimum performance. The top connector pins are designed for easy interfacing to the user's control board.

Short Circuit Rated 10 μs @ 125°C, 720 V

Pin-to-Baseplate Isolation Exceeds 2500 Vac (rms)

Compact Package Outline

Access to Positive and Negative DC Bus

UL Recognized

ORDERING INFORMATION

Device

Current Rating

Package

 

 

 

MHPM6B10N120SL

10

464A±01

MHPM6B15N120SL

15

Style 1

MHPM6B25N120SL

25

 

 

 

 

MHPM6B10N120SS

10

464B±02

MHPM6B15N120SS

15

Style 1

MHPM6B25N120SS

25

 

 

 

 

MAXIMUM DEVICE RATINGS (TJ = 25°C unless otherwise noted)

MHPM6B10N120

MHPM6B15N120

MHPM6B25N120

SERIES

Motorola Preferred Devices

10, 15, 25 A, 1200 V

HYBRID POWER MODULES

SL SUFFIX

CASE 464A±01

Style 1

SS SUFFIX

CASE 464B±02

Style 1

Rating

 

Symbol

Value

Unit

 

 

 

 

 

IGBT Reverse Voltage

 

VCES

1200

V

Gate-Emitter Voltage

 

VGES

± 20

V

Continuous IGBT Collector Current (TC = 80°C)

10A120

ICmax

10

A

 

15A120

 

15

 

 

25A120

 

25

 

 

 

 

 

 

Repetitive Peak IGBT Collector Current (1)

10A120

I

20

A

 

15A120

C(pk)

30

 

 

 

 

 

25A120

 

50

 

 

 

 

 

 

Continuous Diode Current (TC = 25°C)

10A120

IFmax

10

A

 

15A120

 

15

 

 

25A120

 

25

 

 

 

 

 

 

Continuous Diode Current (TC = 80°C)

10A120

IF80

8.3

A

 

15A120

 

11

 

 

25A120

 

14

 

 

 

 

 

 

Repetitive Peak Diode Current (1)

10A120

I

20

A

 

15A120

F(pk)

30

 

 

 

 

 

25A120

 

50

 

 

 

 

 

 

IGBT Power Dissipation per die (TC = 95°C)

10A120

PD

41

W

 

15A120

 

50

 

 

25A120

 

65

 

 

 

 

 

 

Diode Power Dissipation per die (TC = 95°C)

10A120

PD

16

W

 

15A120

 

22

 

 

25A120

 

27

 

 

 

 

 

 

(1) 1.0 ms = 1.0% duty cycle

Preferred devices are Motorola recommended choices for future use and best overall value.

Motorola IGBT Device Data

1

Motorola, Inc. 1998

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

MAXIMUM DEVICE RATINGS (TJ = 25°C unless otherwise noted)

Rating

 

 

 

Symbol

Value

Unit

 

 

 

 

 

 

 

 

 

 

Junction Temperature Range

 

 

 

TJ

± 40 to +150

°C

Short Circuit Duration (VCE = 720 V, TJ = 125°C)

 

 

 

tsc

10

 

 

ms

Isolation Voltage, Pin to Baseplate

 

 

 

VISO

2500

 

 

Vac

Operating Case Temperature Range

 

 

 

TC

± 40 to +95

°C

Storage Temperature Range

 

 

 

Tstg

± 40 to +150

°C

Mounting Torque Ð Heat Sink Mounting Holes

 

 

 

Ð

 

1.4

 

 

Nm

 

 

 

 

 

 

 

 

 

 

ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)

 

 

 

 

 

 

 

Characteristic

 

Symbol

Min

 

Typ

 

Max

 

Unit

 

 

 

 

 

 

 

 

 

 

 

DC AND SMALL SIGNAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Gate-Emitter Leakage Current (VCE = 0 V, VGE = ± 20 V)

 

IGES

Ð

 

Ð

 

± 20

 

μA

Collector-Emitter Leakage Current (VCE = 1200 V, VGE = 0 V)

ICES

Ð

 

5.0

 

100

 

μA

Gate-Emitter Threshold Voltage (VCE = VGE, IC = 1.0 mA)

 

VGE(th)

5.0

 

6.0

 

7.0

 

V

Collector-Emitter Breakdown Voltage (IC = 10 mA, VGE = 0 V)

V(BR)CES

1200

 

Ð

 

Ð

 

V

Collector-Emitter Saturation Voltage (IC = ICmax, VGE = 15 V)

VCE(SAT)

1.7

 

2.35

 

2.9

 

V

TJ = 125°C

 

 

 

Ð

 

2.69

 

Ð

 

 

Forward Transconductance

10A120

gfe

Ð

 

8.3

 

Ð

 

mho

 

15A120

 

 

Ð

 

14

 

Ð

 

 

 

25A120

 

 

Ð

 

19

 

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Diode Forward Voltage (IF = IFmax, VGE = 0 V)

 

VF

1.7

 

2.35

 

3.1

 

V

TJ = 125°C

 

 

 

Ð

 

1.9

 

Ð

 

 

Input Capacitance (VCE = 10 V, VGE = 0 V, f = 1.0 MHz)

10A120

Cies

Ð

 

1880

 

Ð

 

pF

 

15A120

 

 

Ð

 

2620

 

Ð

 

 

 

25A120

 

 

Ð

 

4770

 

Ð

 

 

 

 

 

 

 

 

 

 

 

Input Gate Charge (VCE = 600 V, IC = ICmax, VGE = 15 V)10A120

QT

Ð

 

65

 

Ð

 

nC

 

15A120

 

 

Ð

 

87

 

Ð

 

 

 

25A120

 

 

Ð

 

150

 

Ð

 

 

 

 

 

 

 

 

 

 

 

 

INDUCTIVE SWITCHING CHARACTERISTICS (TJ = 25°C)

 

 

 

 

 

 

 

 

 

Recommended Gate Resistor (RG(on) = RG(off))

10A120

RG

Ð

 

82

 

Ð

 

W

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

82

 

Ð

 

 

 

25A120

 

 

Ð

 

68

 

Ð

 

 

 

 

 

 

 

 

 

 

 

Turn-On Delay Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

td(on)

 

 

 

 

 

 

ns

 

10A120

 

 

Ð

 

174

 

Ð

 

 

 

15A120

 

 

Ð

 

240

 

Ð

 

 

 

25A120

 

 

Ð

 

330

 

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Rise Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

tr

Ð

 

84

 

Ð

 

ns

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

105

 

Ð

 

 

 

25A120

 

 

Ð

 

150

 

Ð

 

 

 

 

 

 

 

 

 

 

 

Turn±Off Delay Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

td(off)

 

 

 

 

 

 

ns

 

10A120

 

 

Ð

 

640

 

Ð

 

 

 

15A120

 

 

Ð

 

780

 

Ð

 

 

 

25A120

 

 

Ð

 

1060

 

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Fall Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

tf

Ð

 

39

 

47

 

ns

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

48

 

58

 

 

 

25A120

 

 

Ð

 

70

 

84

 

 

 

 

 

 

 

 

 

 

 

 

Turn-On Energy (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

Eon

Ð

 

1.5

 

1.8

 

mJ

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

2.7

 

3.3

 

 

 

25A120

 

 

Ð

 

4.6

 

5.6

 

 

 

 

 

 

 

 

 

 

 

 

 

2

Motorola IGBT Device Data

MHPM6B10N120

MHPM6B15N120

MHPM6B25N120 SERIES

 

 

 

 

 

 

 

 

 

 

Characteristic

 

 

Symbol

Min

 

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

INDUCTIVE SWITCHING CHARACTERISTICS (TJ = 25°C) ± continued

 

 

 

 

 

 

Turn-Off Energy (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

 

Eoff

Ð

 

1.1

1.4

mJ

 

 

15A120

 

 

Ð

 

1.7

2.1

 

 

 

25A120

 

 

Ð

 

3.0

3.5

 

 

 

 

 

 

 

 

 

 

 

 

Diode Reverse Recovery Time (IF = IFmax, V = 600 V)

10A120

 

trr

Ð

 

95

Ð

ns

 

 

15A120

 

 

Ð

 

110

Ð

 

 

 

25A120

 

 

Ð

 

124

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Peak Reverse Recovery Current (IF = IFmax, V = 600 V)

10A120

 

Irrm

Ð

 

8.0

Ð

A

 

 

15A120

 

 

Ð

 

9.7

Ð

 

 

 

25A120

 

 

Ð

 

11.5

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Diode Stored Charge (IF = IFmax, V = 600 V)

10A120

 

Qrr

Ð

 

550

Ð

nC

 

 

15A120

 

 

Ð

 

600

Ð

 

 

 

25A120

 

 

Ð

 

740

Ð

 

 

 

 

 

 

 

 

 

 

 

INDUCTIVE SWITCHING CHARACTERISTICS (TJ = 125°C)

 

 

 

 

 

 

 

Characteristic

 

 

Symbol

Min

 

Typ

Max

Unit

 

 

 

 

 

 

 

 

 

 

Turn±On Delay Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

 

td(on)

 

 

 

 

ns

 

 

10A120

 

 

Ð

 

160

Ð

 

 

 

15A120

 

 

Ð

 

220

Ð

 

 

 

25A120

 

 

Ð

 

310

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Rise Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

 

tr

Ð

 

93

Ð

ns

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

110

Ð

 

 

 

25A120

 

 

Ð

 

160

Ð

 

 

 

 

 

 

 

 

 

 

 

Turn±Off Delay Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

 

td(off)

 

 

 

 

ns

 

 

10A120

 

 

Ð

 

680

Ð

 

 

 

15A120

 

 

Ð

 

850

Ð

 

 

 

25A120

 

 

Ð

 

1140

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Fall Time (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

 

tf

Ð

 

51

Ð

ns

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

60

Ð

 

 

 

25A120

 

 

Ð

 

76

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Turn±On Energy (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

 

Eon

Ð

 

2.0

Ð

mJ

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

3.6

Ð

 

 

 

25A120

 

 

Ð

 

6.1

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Turn±Off Energy (VCE = 600 V, IC = ICmax, VGE = 15 V)

10A120

 

Eoff

Ð

 

1.5

Ð

mJ

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

2.4

Ð

 

 

 

25A120

 

 

Ð

 

4.2

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Diode Reverse Recovery Time (IF = IFmax, V = 600 V)

10A120

 

trr

Ð

 

160

Ð

ns

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

210

Ð

 

 

 

25A120

 

 

Ð

 

250

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Peak Reverse Recovery Current (IF = IFmax, V = 600 V)

10A120

 

Irrm

Ð

 

11.0

Ð

A

 

 

 

 

 

 

 

 

15A120

 

 

Ð

 

14.1

Ð

 

 

 

25A120

 

 

Ð

 

17.4

Ð

 

 

 

 

 

 

 

 

 

 

 

 

Diode Stored Charge (IF = IFmax, V = 600 V)

10A120

 

Qrr

Ð

 

995

Ð

nC

 

 

15A120

 

 

Ð

 

1770

Ð

 

 

 

25A120

 

 

Ð

 

2460

Ð

 

 

 

 

 

 

 

 

 

 

 

 

THERMAL CHARACTERISTICS (Each Die)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance Ð IGBT

10A120

 

RqJC

Ð

 

1.1

1.3

°C/W

 

 

15A120

 

 

Ð

 

0.89

1.1

 

 

 

25A120

 

 

Ð

 

0.68

0.85

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Resistance Ð Diode

10A120

 

RqJC

Ð

 

2.8

3.5

°C/W

 

 

15A120

 

 

Ð

 

2.0

2.5

 

 

 

25A120

 

 

Ð

 

1.6

2.0

 

 

 

 

 

 

 

 

 

 

 

 

Motorola IGBT Device Data

3

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

TYPICAL CHARACTERISTICS

(see also application information)

 

 

2.0

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

1.8

CURRENT

)

1.5

 

 

 

TJ = 125°C

 

 

CURRENT

)

1.6

Fmax

 

 

 

 

 

25°C

Cmax

1.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

/I

 

 

 

 

 

 

 

/I

1.2

F

 

 

 

 

 

 

 

C

I

 

 

 

 

 

 

 

I

 

, FORWARD

(NORMALIZED:

1.0

 

 

 

 

 

 

COLLECTOR,

 

1.0

 

 

 

 

 

 

 

 

0.8

 

 

 

 

 

 

 

 

0.6

F

 

 

 

 

 

 

 

 

 

I

0.5

 

 

 

 

 

 

C (NORMALIZED:

0.4

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.2

 

 

0

 

 

 

 

 

 

 

 

0

 

 

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

 

 

 

 

 

 

VF, FORWARD VOLTAGE (VOLTS)

 

 

 

 

Figure 1. Forward Characteristics Ð

Free±Wheeling Diode

 

 

2.0

 

 

 

 

 

 

 

 

 

 

16

 

 

1.8

 

VGE = 18 V

12 V

 

 

 

 

(VOLTS)

14

 

 

 

 

15 V

 

 

 

 

 

 

 

CURRENT

 

1.6

 

 

 

 

 

 

TJ = 125°C

 

)

 

 

 

 

 

 

 

12

Cmax

1.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

/I

1.2

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

COLLECTOR

(NORMALIZED:I

1.0

 

 

 

 

 

 

 

 

 

GATE±EMITTERVOLTAGE

8.0

0.8

 

 

 

 

 

 

 

 

 

6.0

 

 

 

 

 

 

 

 

 

 

0.6

 

 

 

 

 

 

 

 

 

4.0

,

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

I

0.4

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

,

 

 

 

0.2

 

 

 

 

 

 

 

 

9.0 V

GE

2.0

 

 

 

 

 

 

 

 

 

 

 

V

 

 

 

0

1.0

2.0

3.0

4.0

5.0

 

 

 

 

 

0

 

 

0

6.0

7.0

8.0

9.0

10

 

VCE, COLLECTOR±EMITTER VOLTAGE (VOLTS)

 

 

Figure 3. Forward Characteristics, TJ = 125°C

 

 

)

10

 

 

 

 

 

 

 

 

 

 

)

10

 

 

 

 

 

 

 

 

 

TJ = 125°C

 

d(off)typ

 

 

 

 

 

 

 

 

 

d(off)typ

 

 

 

td(off)

 

 

 

 

 

 

TJ = 25°C

 

TIME/t

 

 

 

 

 

 

 

 

 

 

TIME/t

 

1.0

 

 

 

 

 

 

 

 

 

 

1.0

TIME (NORMALIZED:

 

VCE = 600 V

 

 

 

 

 

 

 

TIME (NORMALIZED:

 

 

VGE = 15 V

 

 

 

 

 

 

 

 

 

 

RG = RG(RECOMMENDED)

 

 

 

 

 

 

0.1

 

 

 

 

 

 

 

 

 

 

0.1

 

 

tf

 

 

 

 

 

 

 

 

 

t,

 

 

 

 

 

 

 

 

 

 

 

t,

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

0.01

 

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

 

 

 

IC, COLLECTOR CURRENT (NORMALIZED: IC/ICmax)

 

 

 

 

°

 

V

GE

= 18 V

 

12 V

 

 

 

TJ = 25 C

 

 

 

 

 

 

 

 

 

 

 

15 V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

9.0 V

 

0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

VCE, COLLECTOR±EMITTER VOLTAGE (VOLTS)

 

Figure 2. Forward Characteristics, TJ = 25°C

 

 

 

10N120

 

 

15N120

 

 

 

 

 

 

 

 

 

 

25N120

 

 

 

 

 

 

 

VCE = 400 V

 

 

 

 

 

 

 

VCE = 500 V

 

 

 

 

 

 

 

VCE = 600 V

 

0

20

40

60

80

100

120

140

160

 

 

Qg, TOTAL GATE CHARGE (nC)

 

 

Figure 4. Gate±Emitter Voltage versus Total Gate Charge

VCE = 600 V

VGE = 15 V

IC = ICmax

td(off)

tf

TJ = 125°C

TJ = 25°C

0

0.5

1.0

1.5

2.0

2.5

31..0

RG, GATE RESISTANCE

(NORMALIZED: RG/RG(RECOMMENDED))

Figure 5. Inductive Switching Times versus

Figure 6. Inductive Switching Times versus

Collector Current

Gate Resistance

4

Motorola IGBT Device Data

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

TYPICAL CHARACTERISTICS

 

 

 

 

 

 

 

 

 

 

(see also application information)

 

 

 

 

 

 

 

2.5

 

 

 

25°C

 

 

 

 

 

 

 

 

6.0

 

 

 

 

 

 

 

 

 

td(on)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

)

 

 

 

 

 

 

 

 

 

 

 

)

 

 

 

 

 

 

 

r(typ)

 

 

 

 

 

TJ = 125°C

 

 

 

 

r(typ)

5.0

 

 

 

 

 

 

2.0

 

 

 

 

 

 

 

 

 

 

 

 

25°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TIME/t

 

 

 

 

 

 

 

 

 

 

 

 

TIME/t

 

 

 

 

 

1.5

 

 

 

 

 

 

 

 

 

 

 

4.0

 

 

 

 

TJ = 125°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(NORMALIZED:

 

 

 

 

 

 

 

 

 

 

 

(NORMALIZED:

 

 

 

 

 

 

 

 

 

 

TJ = 125°C

25°C

 

 

 

 

3.0

 

 

 

 

TJ = 125°C

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

tr

 

 

 

 

 

 

 

 

 

2.0

td(on)

 

 

 

25°C

 

 

 

 

 

 

VCE = 600 V

 

 

 

 

 

 

 

 

t,TIME

0.5

 

 

 

 

 

 

 

 

t,TIME

 

 

 

 

 

 

 

 

 

 

 

 

VGE = 15 V

 

 

 

1.0

t

 

 

 

 

 

 

 

 

 

 

 

 

RG = RG(RECOMMENDED)

 

 

 

r

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

 

 

 

 

 

2.2

 

0

 

 

 

 

 

 

 

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

 

0

0.5

1.0

1.5

2.0

2.5

3.0

 

 

IC, COLLECTOR CURRENT (NORMALIZED: IC/ICmax)

 

 

 

 

RG, GATE RESISTANCE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(NORMALIZED: RG/RG(RECOMMENDED))

 

Figure 7. Inductive Switching Times versus

Figure 8. Inductive Switching Times versus

Collector Current

Gate Resistance

 

)

2.5

 

 

 

 

 

 

 

 

 

 

 

 

 

)

3.0

 

 

 

 

 

 

TURN±OFF

off(typ)

 

 

 

Eon, TJ = 125°C

 

 

 

 

 

 

 

TURN±OFF

off(typ)

 

 

 

Eon, TJ = 125°C

 

E/E

 

 

 

 

 

 

 

 

 

 

E/E

2.5

 

 

 

 

Eon, TJ = 25°C

 

 

2.0

 

 

 

 

 

 

 

 

 

 

°

 

 

 

 

 

 

 

 

 

 

Eon, TJ = 25°C

 

 

 

 

 

Eoff, TJ = 125 C

 

 

 

 

 

 

 

 

 

 

EANDTURN±ON,

(NORMALIZED:LOSSES

 

 

 

 

VCE = 600 V

 

 

 

EANDTURN±ON,

(NORMALIZED:LOSSES

 

VCE = 600 V

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.0

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

Eoff, TJ = 125°C

 

off

 

1.5

 

 

 

 

 

 

 

 

 

Eoff, TJ = 25°C

 

off

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Eoff, TJ = 25°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

on

ENERGY

0.5

 

 

 

 

 

V

 

= 15 V

 

 

 

on

ENERGY

0.5

VGE = 15 V

 

 

 

 

 

E

 

 

 

 

 

 

GE

 

 

 

 

 

E

 

IC = ICmax

 

 

 

 

 

 

 

 

 

 

 

 

 

R

= R

G(RECOMMENDED)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

 

 

 

 

 

1.2

1.4

1.6

1.8

2.0

2.2

 

 

0

 

 

 

 

 

 

 

 

0

0.2

0.4

0.6

0.8

1.0

 

 

0

0.5

1.0

1.5

2.0

2.5

3.0

 

 

 

IC, COLLECTOR CURRENT (NORMALIZED: IC/ICmax)

 

 

 

 

 

RG, GATE RESISTANCE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(NORMALIZED: RG/RG(RECOMMENDED))

 

Figure 9. Turn±On and Turn±Off Energy

Figure 10. Turn±On and Turn±Off Energy

Losses versus Collector Current

Losses versus Gate Resistance

CURRENT

 

100

 

 

 

 

 

 

 

 

 

 

 

 

)

 

 

 

 

 

 

 

 

 

 

 

 

TIME

rr(typ)

 

 

 

 

 

 

 

 

 

 

 

 

/I

 

 

 

 

TJ = 125°C

 

 

 

 

 

rr

 

 

 

 

 

 

 

 

 

I

 

 

 

 

 

 

 

 

 

 

 

 

RECOVERY

RECOVERY

10 *

10

Irr

 

 

 

25°C

 

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

rr(typ)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

TJ = 125°C

 

 

 

 

 

/t

 

 

 

 

 

 

 

 

 

REVERSE

REVERSE

rr

 

 

 

 

 

 

 

 

 

t

1.0

trr

 

 

 

 

 

 

 

 

 

 

 

 

 

 

25°C

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

PEAK

,

(NORMALIZED:

 

 

 

 

 

 

 

 

 

 

 

 

rr

 

V = 600 V

 

 

 

 

 

 

 

 

 

,

 

 

 

 

 

 

 

 

 

 

 

 

 

rr t

 

 

 

 

 

 

 

 

 

 

 

 

I

 

 

0.1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.4

1.6

1.8

2.0

2.2

 

 

 

0

0.2

0.4

0.6

0.8

1.0

1.2

 

 

 

 

 

IF, FORWARD CURRENT (NORMALIZED: IF/IFmax)

 

 

(pF/A))

1000

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cmax

 

 

 

 

 

Ciss

 

 

 

TO I

100

 

 

 

 

 

 

 

 

(NORMALIZED

 

 

 

 

 

 

 

 

 

 

 

 

 

Coss

 

 

 

10

 

 

 

 

 

 

 

 

CAPACITANCE

 

 

 

 

 

 

 

 

 

 

 

 

 

Crss

 

 

 

1.0

 

 

 

 

 

 

 

 

C,

 

 

 

 

 

 

 

 

0

5.0

10

15

20

25

30

35

40

 

 

 

VCE, COLLECTOR±EMITTER VOLTAGE (VOLTS)

 

Figure 11. Reverse Recovery Characteristics

Figure 12. Capacitance Variation

Ð Free±Wheeling Diode

 

Motorola IGBT Device Data

5

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

TYPICAL CHARACTERISTICS

(see also application information)

IC, COLLECTOR CURRENT (AMPS)

70

 

 

 

 

VGE = 15 V

 

 

 

1.0

 

 

 

 

 

 

 

 

 

 

 

 

THERMALTRANSIENTEFFECTIVE

 

 

 

 

 

 

 

 

60

 

 

 

 

RG = RG(RECOMMENDED)

 

 

 

 

 

 

 

 

50

 

 

25N120

 

TJ = 25°C

 

 

(NORMALIZED)RESISTANCE

 

 

 

DIODE

 

 

 

 

 

 

 

 

 

 

0.1

 

 

IGBT

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

40

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

30

 

 

15N120

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

20

 

 

10N120

 

 

 

 

 

 

0.01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

10

 

 

 

 

 

 

 

r(t),

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0

200

400

600

800

1000

 

1400

1600

 

0.001

 

 

 

 

 

 

0

1200

 

0.01

0.1

1.0

10

100

1000

10,000

 

VCE, COLLECTOR±EMITTER VOLTAGE (VOLTS)

 

 

 

 

 

t, TIME (ms)

 

 

 

Figure 13. Reverse Biased Safe Operating

Figure 14. Thermal Response

Area (RBSOA)

 

 

 

 

90%

 

 

 

GATE DRIVE OUTPUT

 

 

 

 

10%

td(on)

tr

t

t

f

 

 

d(off)

 

 

 

 

 

90%

 

 

 

 

IC

 

 

 

 

10%

 

 

 

 

3%

 

 

 

 

VCE

 

Eon

 

 

Eoff

 

1.0 ms

 

 

 

Figure 15. Timing Definitions

+15 V

 

 

+15 V

 

MBRS130LT3

MBRS130LT3

 

 

RG(on)

MC33153

RG

MC33153

 

MBRS130LT3

RG(off)

 

MBRS130LT3

MBRS130LT3

Figure 16. Common Gate Drive Circuit

Figure 17. Recommended Gate Drive Circuit

6

Motorola IGBT Device Data

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

APPLICATION INFORMATION

These modules are designed to be used as the power stage of a three±phase AC induction motor drive. They may be used for up to 460 VAC applications. Switching frequencies up to 15 kHz were considered in the design.

Gate resistance recommendations have been listed. These choices were based on the common gate drive circuit shown in Figure 16. However, significant improvements in

Eoff may be gained by either of two methods: use of a negative gate bias, or use of the gate drive shown in Figure 17.

Separate turn±on and turn±off gate resistors give the best re-

sults; in this case, RG(off) should be chosen as small as possible while limiting current to prevent damage to the gate

drive IC. Designers should also note that turn±on and turn± off delay times are measured from the rising and falling edges of the gate drive output, not the gate voltage waveform.

Since all three modules use similar technology, most of the graphs showing typical performance have been normalized. Actual values are listed for each size in the table, ªElectrical Characteristics.º Data on the graphs reflect performance using the common gate drive circuit shown in Figure 16.

The first three curves, showing DC characteristics, are normalized for ICmax. The devices all perform similarly at

rated current. The curves extend to IC(pk), the maximum allowable instantaneous current.

The next two graphs, turn±off and turn±on times versus IC, are also normalized for ICmax. In addition, the time scales are

normalized. Turn±off times are normalized to td(off) at 25°C at rated current with recommended RG, while turn±on times are

normalized to tr at 25°C at rated current with recommended

RG.

The graphs showing switching times as a function of RG are similarly normalized. RG has been normalized to the rec-

ommended value listed under ªElectrical Characteristics.º The time axes are normalized exactly as for the corresponding graphs showing variation with IC.

Similar transformations have been made for the next two figures, showing Eon and Eoff. Energies have been normal-

ized to Eoff at 25°C at ICmax with the recommended RG. IC has been normalized to ICmax, and RG has been normalized to the recommended value.

Reverse recovery characteristics are also normalized. IC has again been normalized to ICmax. Reverse recovery time

trr has been normalized to trr at 25°C at ICmax. Peak reverse recovery current Irrm has been normalized to Irrm at 25°C at

ICmax, then multiplied by 10.

Capacitance has been normalized to device rated ICmax. Since all modules are rated for the same voltage, the voltage scale on Figure 11 does not need to be normalized.

Typical transient thermal impedance is shown for a diode and for an IGBT. All diodes behave quite similarly, as do all IGBTs.

The last two graphs, VGE versus QG and RBSOA, are not normalized.

Many issues beyond the ratings must be considered in a system design. Dynamic characteristics can all be affected by external circuit parameters. For example, excessive bus inductance can dramatically increase voltage overshoot during switching, increasing the switching energy. The choice of gate drive IC can have quite a large effect on rise and fall times, corresponding to differences in switching energies. In many cases, this can be compensated by simply changing the gate resistor accordingly Ð a gate driver with a lower drive capability requires a smaller gate resistor. Ultimately, the module must be tested in the final system to characterize its performance.

1

 

 

 

 

2

 

 

 

 

3

 

 

 

4

5

 

 

 

Q1

D1

 

 

 

Q3

D3

 

 

 

Q5

D5

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Q2

D2

 

 

 

Q4

D4

 

 

 

Q6

D6

 

17

16

15

14

 

13

12

11

10

 

9

8

7

6

 

 

Figure 18. Schematic of Module, Showing Pin±Out

Motorola IGBT Device Data

7

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

RECOMMENDED PCB LAYOUT MODULE SIDE VIEW OF BOARD

(Typical Dimensions in mm)

107.75

16.015.24

 

 

PIN 1

 

 

 

 

 

1.65

16.0

 

 

5.8

 

 

 

KEEP±OUT

 

45.75

32.0

 

41.91

 

ZONES (x4)

 

 

11.0

 

 

 

 

 

3.81

OPTIONAL

 

 

16.0

NON±PLATED

 

 

 

 

 

11.43

THRU±HOLES (x2)

 

 

 

 

 

PLATED THRU±HOLES (x17)

 

Figure 19. Package Footprint

NOTES:

1.Package is symmetrical.

2.Dimension of plated thru±holes indicates finished hole size after plating.

3.Non±plated thru±holes shown for optional access to heat sink mounting screws.

8

Motorola IGBT Device Data

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

PACKAGE DIMENSIONS

 

 

A

 

Q 4 PL

 

 

U

 

Y 2 PL

 

 

 

 

F

 

 

 

 

4 PL

1

2

3

4

5

B P N

H

 

 

 

 

 

 

 

 

 

R

17 16

15

14

13 12

11 10

9

8

7

6

 

S

 

 

 

 

 

 

 

G 6 PL

 

 

 

 

 

 

 

 

 

Z 5 PL

M

D 17 PL

K

X C E

V

CASE 464A±01

ISSUE A

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.

3.LEAD LOCATION DIMENSIONS (ie: G, S, R, H, F...) ARE TO THE CENTER OF THE LEAD.

 

MILLIMETERS

INCHES

DIM

MIN

MAX

MIN

MAX

A

±±±

107.75

±±±

4.242

B

±±±

45.75

±±±

1.801

C

16.37

17.64

0.644

0.694

D

0.77

1.53

0.030

0.060

E

12.49

13.51

0.492

0.532

F

14.86

15.62

0.585

0.615

G

3.43

4.19

0.135

0.165

H

41.53

42.29

1.635

1.665

K

29.99

31.01

1.181

1.221

L

6.29

7.31

0.248

0.288

M

1.59

2.61

0.063

0.103

N

10.49

11.51

0.413

0.453

P

31.49

32.51

1.240

1.280

Q

2.00

2.60

0.079

0.103

R

20.57

21.33

0.810

0.840

S

15.62

16.38

0.615

0.645

U

92.49

93.51

3.641

3.681

V

104.17

105.44

4.101

4.151

W

37.49

38.51

1.476

1.516

X

15.37

16.64

0.605

0.655

Y

5.25

5.75

0.207

0.227

Z

11.05

11.81

0.435

0.465

L

W

Motorola IGBT Device Data

9

MHPM6B10N120 MHPM6B15N120 MHPM6B25N120 SERIES

PACKAGE DIMENSIONS

 

 

A

 

Q 4 PL

 

 

U

 

Y 2 PL

 

 

 

 

F

 

 

 

 

4 PL

1

2

3

4

5

B P N

H

 

 

 

 

 

 

 

 

 

R

17 16

15

14

13 12

11 10

9

8

7

6

 

S

 

 

 

 

 

 

 

G 6 PL

 

 

 

 

 

 

 

 

 

Z 5 PL

M

D 17 PL

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.

3.LEAD LOCATION DIMENSIONS (ie: G, S, R, H, F...) ARE TO THE CENTER OF THE LEAD.

 

MILLIMETERS

INCHES

DIM

MIN

MAX

MIN

MAX

A

±±±

107.75

±±±

4.242

B

±±±

45.75

±±±

1.801

C

16.37

17.64

0.644

0.694

D

0.77

1.53

0.030

0.060

E

12.49

13.51

0.492

0.532

F

14.86

15.62

0.585

0.615

G

3.43

4.19

0.135

0.165

H

41.53

42.29

1.635

1.665

K

19.81

20.60

0.780

0.881

L

6.29

7.31

0.248

0.288

M

1.59

2.61

0.063

0.103

N

10.49

11.51

0.413

0.453

P

31.49

32.51

1.240

1.280

Q

2.00

2.60

0.079

0.103

R

20.57

21.33

0.810

0.840

S

15.62

16.38

0.615

0.645

U

92.49

93.51

3.641

3.681

V

104.17

105.44

4.101

4.151

W

37.49

38.51

1.476

1.516

X

15.37

16.64

0.605

0.655

Y

5.25

5.75

0.207

0.227

Z

11.05

11.81

0.435

0.465

X

C

K

 

E

L

 

 

 

 

 

 

V

 

W

 

 

 

CASE 464B±02

ISSUE A

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ªTypicalº parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including ªTypicalsº must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

 

 

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10

MHPM6B10N120/D

 

Motorola IGBT Device Data

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