PACKAGING

MOTOROLA

MC68181/D

3-1

Y

NC

25

R

S6

16

READY

N

A

S7

SS

SYMCLK

PRELIMI

VDD

SCK

VSS

EXTS0

MOSI

Orientation Mark

(Top View)

EXTS1

MISO

LOBAT

CLKOUT

32

9

NC

AA122

Figure 3-1

MC68181 Thin Quad Flat Pack (TQFP), Top View

3-2

MC68181/D

MOTOROLA

S6

16

25

NC

PRELIMINARY

S7

READY

YMCLK

SS

VDD

SCK

EXTS0

VSS

EXTS1

(Bottom View)

MOSI

LOBAT

Orientation Mark

MISO

NC

9

32

CLKOUT

AA122

Figure 3-2

MC68181 Thin Quad Flat Pack (TQFP), Bottom View

MOTOROLA

MC68181/D

3-3

Pin #

Signal Name

Pin #

Signal Name

Pin #

Signal Name

Pin #

Signal Name

1

NC1

9

NC1

17

NC1

25

NC1

2

OSCPD

10

LOBAT

18

S5

26

READY

3

VDD

11

EXTS1

19

S4

27

SS

SS

Y

4

VSS2

12

EXTS0

20

S3

28

SCK

5

XTAL

13

VDD

21

S2

29

VSS2

6

EXTAL

14

SYMCLK

22

S1

R

MOSI

30

7

V

2

15

S7

23

S0

31

MISO

VSS2

A

8

16

S6

24

RESET

32

CLKOUT

Note:

1.

NC indicates reserved pins. These pins must not be connected to any external line.

2.

To ensure proper chip operation, all VSS pins must be connected to GND.

N

Table 3-2 Signal by Name

Signal Name

PRELIMI

Signal Name

Pin #

Signal Name

Pin #

Pin #

Signal Name Pin #

CLKOUT

32

NC

9

S2

21

SYMCLK

14

EXTAL

6

NC

17

S3

20

VDD

3

EXTS0

12

NC

25

S4

19

VDD

13

EXTS1

11

OSCPD

2

S5

18

VSS

4

LOBAT

10

READY

26

S6

16

VSS

7

MISO

31

RESET

24

S7

15

VSS

8

MOSI

30

S0

23

SCK

28

VSS

29

1

S1

22

27

XTAL

5

NC

SS

3-4

MC68181/D

MOTOROLA

A

4X

A1

0.20

AB T-U Z

32

25

-T-

1

-U-

B

V

AE

B1

DETAIL Y

P

V1

8

17

AE

9

DETAIL Y

-Z-

4X

9

0.20

AC T-U

Z

S1

S

NOTES:

1.

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

DETAIL AD

2.

CONTROLLING DIMENSION: MILLIMETER.

G

3.

DATUM PLANE -AB- IS LOCATED AT BOTTOM OF LEAD

-AB-

AND IS COINCIDENT WITH THE LEAD WHERE THE

LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF

THE PARTING LINE.

SEATING

-AC-

4. DATUMS -T-, -U-, AND -Z- TO BE DETERMINED AT

PLANE

0.10

AC

DATUM PLANE -AB-.

BASE

5.

DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE -AC-.

6.

DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.250

(0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE

M

MOLD MISMATCH AND ARE DETERMINED AT DATUM

PLANE -AB-.

D

7.

DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

8X M

°

CAUSE THE D DIMENSION TO EXCEED 0.520.

R

J

MILLIMETERS

DIM

MIN

MAX

A

7.000 BSC

A1

3.500 BSC

C

E

SECTION AE-AE

B

7.000 BSC

B1

3.500 BSC

C

1.400

1.600

D

0.300

0.450

E

1.350

1.450

W

F

0.300

0.400

H

K

Q

°

G

0.800 BSC

H

0.050

0.150

X

J

0.090

0.200

PLANE

K

0.500

0.700

M

12°žREF

DETAIL AD

GAUGE

N

0.090

0.160

P

0.400 BSC

Q

1°žž

5°ž

R

0.150

0.250

S

9.000 BSC

S1

4.500 BSC

V

9.000 BSC

V1

4.500 BSC

W

0.200 REF

X

1.000 REF

PRELIMINARY

CASE 873A-02

ISSUE A

MOTOROLA

MC68181/D

3-5

(602) 244-6591

The

• The receiving facsimile telephone number including area code or country

code

Y

• The caller’s Personal Identification Number (PIN)

R

Note:

A

PIN,

•

– Instructions for using the system

– A literature order form

N

– Specific part technical information or data sheets

– Other information described by the system messages

A total of three documents may be ordered per call.

The MC68181 32-pin TQFP package mechanical drawing is referenced as

873A-02.

PRELIMI

3-6

MC68181/D

MOTOROLA