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MOTOROLA

SEMICONDUCTOR TECHNICAL DATA

Product Preview

MC54/74HC393A

 

Dual 4-Stage

Binary Ripple Counter

High±Performance Silicon±Gate CMOS

The MC54/74HC393A is identical in pinout to the LS393. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs.

This device consists of two independent 4±bit binary ripple counters with parallel outputs from each counter stage. A 256 counter can be obtained by cascading the two binary counters.

Internal flip±flops are triggered by high±to±low transitions of the clock input. Reset for the counters is asynchronous and active±high. State changes of the Q outputs do not occur simultaneously because of internal ripple delays. Therefore, decoded output signals are subject to decoding spikes and should not be used as clocks or as strobes except when gated with the Clock of the HC393A.

Output Drive Capability: 10 LSTTL Loads

Outputs Directly Interface to CMOS, NMOS, and TTL

Operating Voltage Range: 2 to 6 V

Low Input Current: 1 μA

High Noise Immunity Characteristic of CMOS Devices

In Compliance with the Requirements Defined by JEDEC Standard No. 7A

Chip Complexity: 236 FETs or 59 Equivalent Gates

LOGIC DIAGRAM

 

 

 

 

3, 11

Q1

 

 

 

 

4, 10

 

1, 13

 

BINARY

Q2

CLOCK

 

5, 9

 

 

 

 

COUNTER

Q3

 

 

 

6, 8

 

 

 

 

Q4

 

 

 

 

 

 

 

 

 

 

 

RESET 2, 12

PIN 14 = VCC

PIN 7 = GND

 

J SUFFIX

CERAMIC PACKAGE

14

CASE 632±08

1

 

 

N SUFFIX

PLASTIC PACKAGE

14

CASE 646±06

 

1

 

 

D SUFFIX

14

SOIC PACKAGE

1

CASE 751A±03

 

DT SUFFIX

14

TSSOP PACKAGE

1

CASE 948G±01

 

ORDERING INFORMATION

MC54HCXXXAJ

Ceramic

MC74HCXXXAN

Plastic

MC74HCXXXAD

SOIC

MC74HCXXXADT TSSOP

PIN ASSIGNMENT

CLOCK a

1

14

VCC

RESET a

2

13

CLOCK b

Q1a

3

12

RESET b

Q2a

4

11

Q1b

Q3a

5

10

Q2b

Q4a

6

9

Q3b

GND

7

8

Q4b

FUNCTION TABLE

Inputs

 

 

Clock

Reset

 

Outputs

X

H

 

L

H

L

No Change

L

L

No Change

 

L

No Change

 

L

Advance to

 

 

 

Next State

This document contains information on a product under development. Motorola reserves the right to change or discontinue this product without notice.

10/95

Motorola, Inc. 1995

REV 0

MC54/74HC393A

MAXIMUM RATINGS*

Symbol

Parameter

Value

Unit

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

± 0.5 to + 7.0

V

Vin

DC Input Voltage (Referenced to GND)

± 1.5 to VCC + 1.5

V

Vout

DC Output Voltage (Referenced to GND)

± 0.5 to VCC + 0.5

V

Iin

DC Input Current, per Pin

± 20

mA

Iout

DC Output Current, per Pin

± 25

mA

ICC

DC Supply Current, VCC and GND Pins

± 50

mA

PD

Power Dissipation in Still Air, Plastic or Ceramic DIP²

750

mW

 

SOIC Package²

500

 

 

TSSOP Package²

450

 

 

 

 

 

Tstg

Storage Temperature

± 65 to + 150

_C

TL

Lead Temperature, 1 mm from Case for 10 Seconds

 

_C

 

Plastic DIP, SOIC or TSSOP Package

260

 

 

(Ceramic DIP)

300

 

 

 

 

 

This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high±impedance circuit. For proper operation, Vin and

Vout should be constrained to the

range GND v (Vin or Vout) v VCC. Unused inputs must always be

tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.

*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions.

²Derating Ð Plastic DIP: ± 10 mW/ _C from 65_ to 125_C Ceramic DIP: ± 10 mW/_C from 100_ to 125_C

SOIC Package: ± 7 mW/_C from 65_ to 125_C

TSSOP Package: ± 6.1 mW/_C from 65_ to 125_C

For high frequency or heavy load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

RECOMMENDED OPERATING CONDITIONS

Symbol

Parameter

 

Min

Max

Unit

 

 

 

 

 

 

VCC

DC Supply Voltage (Referenced to GND)

 

2.0

6.0

V

Vin, Vout

DC Input Voltage, Output Voltage (Referenced to GND)

0

VCC

V

TA

Operating Temperature, All Package Types

 

± 55

+ 125

_C

tr, tf

Input Rise and Fall Time

VCC = 2.0 V

0

1000

ns

 

 

VCC = 3.0 V

0

600

 

 

(Figure 1)

VCC = 4.5 V

0

500

 

 

 

VCC = 6.0 V

0

400

 

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

VCC

 

 

 

 

 

 

 

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

VIH

Minimum High±Level Input

Vout = 0.1 V or VCC ± 0.1 V

2.0

1.5

1.5

1.5

V

 

Voltage

|Iout| v 20 μA

3.0

2.1

2.1

2.1

 

 

 

 

4.5

3.15

3.15

3.15

 

 

 

 

6.0

4.2

4.2

4.2

 

 

 

 

 

 

 

 

 

VIL

Maximum Low±Level Input

Vout = 0.1 V or VCC ± 0.1 V

2.0

0.5

0.5

0.5

V

 

Voltage

|Iout| v 20 μA

3.0

0.9

0.9

0.9

 

 

 

 

4.5

1.35

1.35

1.35

 

 

 

 

6.0

1.80

1.80

1.80

 

 

 

 

 

 

 

 

 

VOH

Minimum High±Level Output

Vin = VIH or VIL

2.0

1.9

1.9

1.9

V

 

Voltage

|Iout| v 20 μA

4.5

4.4

4.4

4.4

 

 

 

 

6.0

5.9

5.9

5.9

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL |Iout| v 2.4 mA

3.0

2.48

2.34

2.20

 

 

 

|Iout| v 4.0 mA

4.5

3.98

3.84

3.70

 

 

 

|Iout| v 5.2 mA

6.0

5.48

5.34

5.20

 

MOTOROLA

2

MC54/74HC393A

DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)

 

 

 

 

Guaranteed Limit

 

 

 

 

 

 

 

 

 

 

 

 

VCC

± 55 to

 

 

 

Symbol

Parameter

Test Conditions

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

 

VOL

Maximum Low±Level Output

Vin = VIH or VIL

2.0

0.1

0.1

0.1

V

 

Voltage

|Iout| v 20 μA

4.5

0.1

0.1

0.1

 

 

 

 

6.0

0.1

0.1

0.1

 

 

 

 

 

 

 

 

 

 

 

Vin = VIH or VIL |Iout| v 2.4 mA

3.0

0.26

0.33

0.40

 

 

 

|Iout| v 4.0 mA

4.5

0.26

0.33

0.40

 

 

 

|Iout| v 5.2 mA

6.0

0.26

0.33

0.40

 

Iin

Maximum Input Leakage Current

Vin = VCC or GND

6.0

± 0.1

± 1.0

± 1.0

μA

ICC

Maximum Quiescent Supply

Vin = VCC or GND

6.0

4

40

160

μA

 

Current (per Package)

Iout = 0 μA

 

 

 

 

 

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)

 

 

 

Guaranteed Limit

 

 

 

 

VCC

 

 

 

 

 

 

 

± 55 to

 

 

 

 

Symbol

Parameter

V

25_C

v 85_C

v 125_C

 

Unit

 

 

 

 

 

 

 

 

fmax

Maximum Clock Frequency (50% Duty Cycle)

2.0

10

9

8

 

MHz

 

(Figures 1 and 3)

3.0

15

14

12

 

 

 

 

4.5

30

28

25

 

 

 

 

6.0

50

45

40

 

 

 

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Clock to Q1

2.0

70

80

90

 

ns

tPHL

(Figures 1 and 3)

3.0

40

45

50

 

 

 

 

4.5

20

25

30

 

 

 

 

6.0

16

21

27

 

 

 

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Clock to Q2

2.0

90

105

180

 

ns

tPHL

(Figures 1 and 3)

3.0

56

70

100

 

 

 

 

4.5

32

38

45

 

 

 

 

6.0

25

31

40

 

 

 

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Clock to Q3

2.0

60

75

90

 

ns

tPHL

(Figures 1 and 3)

3.0

40

55

65

 

 

 

 

4.5

30

40

50

 

 

 

 

6.0

25

35

42

 

 

 

 

 

 

 

 

 

 

tPLH,

Maximum Propagation Delay, Clock to Q4

2.0

200

250

300

 

ns

tPHL

(Figures 1 and 3)

3.0

160

185

210

 

 

 

 

4.5

35

45

60

 

 

 

 

6.0

30

40

50

 

 

 

 

 

 

 

 

 

 

tPHL

Maximum Propagation Delay, Reset to any Q

2.0

80

95

110

 

ns

 

(Figures 2 and 3)

3.0

48

65

75

 

 

 

 

4.5

28

32

40

 

 

 

 

6.0

21

25

30

 

 

 

 

 

 

 

 

 

 

tTLH,

Maximum Output Transition Time, Any Output

2.0

75

95

110

 

ns

tTHL

(Figures 1 and 3)

3.0

27

32

36

 

 

 

 

4.5

15

19

22

 

 

 

 

6.0

13

16

19

 

 

 

 

 

 

 

 

 

 

Cin

Maximum Input Capacitance

Ð

10

10

10

 

pF

NOTES:

 

 

 

 

 

 

 

1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

 

2. Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

 

 

 

 

 

 

 

 

 

Typical @ 25°C, VCC = 5.0 V

 

 

CPD

Power Dissipation Capacitance (Per Counter)*

 

 

35

 

 

pF

* Used to determine the no±load dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

3

MOTOROLA

MC54/74HC393A

TIMING REQUIREMENTS (Input tr = tf = 6 ns)

 

 

 

Guaranteed Limit

 

 

 

VCC

 

 

 

 

 

 

± 55 to

 

 

 

Symbol

Parameter

V

25_C

v 85_C

v 125_C

Unit

 

 

 

 

 

 

 

trec

Minimum Recovery Time, Reset Inactive to Clock

2.0

25

30

40

ns

 

(Figure 2)

3.0

15

20

30

 

 

 

4.5

5

6

10

 

 

 

6.0

5

5

7

 

 

 

 

 

 

 

 

tw

Minimum Pulse Width, Clock

2.0

75

95

110

ns

 

(Figure 1)

3.0

27

32

36

 

 

 

4.5

15

19

22

 

 

 

6.0

13

15

19

 

 

 

 

 

 

 

 

tw

Minimum Pulse Width, Reset

2.0

75

95

110

ns

 

(Figure 2)

3.0

27

32

36

 

 

 

4.5

15

19

22

 

 

 

6.0

13

15

19

 

 

 

 

 

 

 

 

tr, tf

Maximum Input Rise and Fall Times

2.0

1000

1000

1000

ns

 

(Figure 1)

3.0

800

800

800

 

 

 

4.5

500

500

500

 

 

 

6.0

400

400

400

 

 

 

 

 

 

 

 

NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High±Speed CMOS Data Book (DL129/D).

MOTOROLA

4

MC54/74HC393A

PIN DESCRIPTIONS

INPUTS

Clock (Pins 1, 13)

Clock input. The internal flip±flops are toggled and the counter state advances on high±to±low transitions of the clock input.

CONTROL INPUTS

Reset (Pins 2, 12)

Active±high, asynchronous reset. A separate reset is pro-

vided for each counter. A high at the Reset input prevents counting and forces all four outputs low.

OUTPUTS

Q1, Q2, Q3, Q4 (Pins 3, 4, 5, 6, 8, 9, 10, 11)

Parallel binary outputs Q4 is the most significant bit.

 

 

 

SWITCHING WAVEFORMS

 

 

tf

tr

VCC

tw

 

90%

 

VCC

 

50%

 

RESET

CLOCK

 

50%

10%

 

GND

 

 

GND

 

 

 

 

 

 

 

 

tw

 

 

tPHL

 

1/fmax

tPHL

 

 

 

tPLH

Q

50%

 

 

 

 

Q

90%

 

 

trec

50%

 

 

 

10%

 

 

VCC

 

 

 

CLOCK

50%

 

tTLH

tTHL

 

GND

 

 

 

 

Figure 1.

 

 

Figure 2.

 

 

 

TEST

 

 

EXPANDED LOGIC DIAGRAM

 

 

 

POINT

 

 

 

 

 

 

 

OUTPUT

CLOCK

1, 13

C

Q

 

 

 

 

 

 

 

 

 

 

 

3, 11

 

DEVICE

 

 

 

D

Q

Q1

 

 

 

 

UNDER

CL*

 

 

 

 

 

 

TEST

 

 

 

 

 

 

 

 

 

 

C

Q

 

 

 

 

 

 

D

Q

4, 10

Q2

* Includes all probe and jig capacitance

 

 

 

 

 

 

 

 

 

Figure 3. Test Circuit

 

 

 

 

 

 

 

 

 

 

C

Q

 

 

 

 

 

 

D

Q

5, 9

Q3

 

 

 

 

 

 

 

 

 

C

Q

 

 

 

 

 

 

D

Q

6, 8

Q4

 

 

 

 

 

2, 12

RESET

5

MOTOROLA

MC54/74HC393A

TIMING DIAGRAM

0

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

0

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CLOCK

RESET

Q1

Q2

Q3

Q4

COUNT SEQUENCE

 

 

 

Outputs

 

Count

Q4

Q3

Q2

Q1

0

L

L

L

L

1

L

L

L

H

2

L

L

H

L

3

L

L

H

H

4

L

H

L

L

5

L

H

L

H

6

L

H

H

L

7

L

H

H

H

8

H

L

L

L

9

H

L

L

H

10

H

L

H

L

11

H

L

H

H

12

H

H

L

L

13

H

H

L

H

14

H

H

H

L

15

H

H

H

H

MOTOROLA

6

 

 

 

 

 

 

 

 

 

 

 

 

 

MC54/74HC393A

 

 

 

 

 

 

OUTLINE DIMENSIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

J SUFFIX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CERAMIC DIP PACKAGE

 

 

 

 

 

 

 

 

 

-A-

 

 

 

 

CASE 632±08

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ISSUE Y

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

14

 

8

 

 

 

 

 

 

 

1. DIMENSIONING AND TOLERANCING PER ANSI

 

 

 

 

 

 

 

 

 

Y14.5M, 1982.

 

 

 

 

 

 

 

 

-B-

 

 

 

 

 

2. CONTROLLING DIMENSION: INCH.

 

 

 

 

 

 

 

 

 

 

 

3. DIMENSION L TO CENTER OF LEAD WHEN

 

1

 

7

 

 

 

 

 

 

 

FORMED PARALLEL.

 

 

 

 

 

 

 

 

 

 

 

4. DIMESNION F MAY NARROW TO 0.76 (0.030)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

C

L

 

 

 

 

WHERE THE LEAD ENTERS THE CERAMIC

 

 

 

 

 

 

 

 

 

BODY.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

INCHES

MILLIMETERS

 

 

 

 

 

 

 

 

 

 

 

DIM

MIN

MAX

MIN

MAX

 

 

 

 

 

 

 

 

 

 

 

A

0.750

0.785

19.05

19.94

 

 

 

 

 

 

 

 

 

 

 

B

0.245

0.280

6.23

7.11

-T-

 

 

 

 

 

K

 

 

 

 

C

0.155

0.200

3.94

5.08

 

 

 

 

 

 

 

 

 

D

0.015

0.020

0.39

0.50

SEATING

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

F

0.055

0.065

1.40

1.65

PLANE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

G

0.100 BSC

2.54 BSC

F

G

 

 

 

 

M

 

 

 

 

 

 

N

 

 

 

 

 

J

0.008

0.015

0.21

0.38

 

D 14 PL

 

 

 

 

J 14 PL

 

 

 

 

K

0.125

0.170

3.18

4.31

 

 

 

 

 

 

 

 

 

L

0.300 BSC

7.62 BSC

 

0.25 (0.010)

M

T

A

S

0.25 (0.010)

M

T

B

S

M

0°

15°

0°

15°

 

 

 

 

 

 

 

 

 

 

 

N

0.020

0.040

0.51

1.01

N SUFFIX

PLASTIC DIP PACKAGE

CASE 646±06

ISSUE L

14

 

8

 

 

 

 

 

B

 

1

 

7

 

 

 

A

 

 

 

 

F

 

 

L

 

 

 

 

C

 

 

 

N

J

 

 

 

 

 

 

 

SEATING

K

H

G

D

PLANE

M

 

NOTES:

1.LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE POSITION AT SEATING PLANE AT MAXIMUM MATERIAL CONDITION.

2.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.

3.DIMENSION B DOES NOT INCLUDE MOLD FLASH.

4.ROUNDED CORNERS OPTIONAL.

 

INCHES

MILLIMETERS

DIM

MIN

MAX

MIN

MAX

A

0.715

0.770

18.16

19.56

B

0.240

0.260

6.10

6.60

C

0.145

0.185

3.69

4.69

D

0.015

0.021

0.38

0.53

F

0.040

0.070

1.02

1.78

G

0.100 BSC

2.54 BSC

H

0.052

0.095

1.32

2.41

J

0.008

0.015

0.20

0.38

K

0.115

0.135

2.92

3.43

L

0.300 BSC

7.62 BSC

M

0

10

0

10

N

0.015

0.039

0.39

1.01

 

D SUFFIX

 

PLASTIC SOIC PACKAGE

 

CASE 751A±03

±A±

ISSUE F

14 8

±B±

P 7 PL

1

0.25 (0.010) M

B M

7

 

 

G

 

 

 

C

 

R X 45°

 

F

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

SEATING

D 14 PL

 

 

K

 

 

 

M

J

 

 

 

 

 

 

PLANE

 

 

 

 

 

 

 

 

0.25 (0.010)

 

T

B

 

A

 

 

 

 

M

S

S

 

 

NOTES:

1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: MILLIMETER.

3.DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.

4.MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

 

MILLIMETERS

INCHES

DIM

MIN

MAX

MIN

MAX

A

8.55

8.75

0.337

0.344

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.054

0.068

D

0.35

0.49

0.014

0.019

F

0.40

1.25

0.016

0.049

G

1.27

BSC

0.050

BSC

J

0.19

0.25

0.008

0.009

K

0.10

0.25

0.004

0.009

M

0°

7°

0°

7°

P

5.80

6.20

0.228

0.244

R

0.25

0.50

0.010

0.019

7

MOTOROLA

MC54/74HC393A

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

OUTLINE DIMENSIONS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

DT SUFFIX

 

 

 

 

 

 

 

 

 

 

 

PLASTIC TSSOP PACKAGE

 

 

 

 

 

 

 

 

 

 

 

 

 

CASE 948G±01

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

ISSUE O

 

 

 

 

 

 

 

 

 

 

 

14X K REF

 

 

 

 

 

NOTES:

 

 

 

 

 

 

 

 

 

0.10 (0.004) M

T

U

S

V

S

1. DIMENSIONING AND TOLERANCING PER ANSI

 

 

 

 

 

 

Y14.5M, 1982.

 

 

 

0.15 (0.006) T

U

S

 

 

 

 

 

 

 

2.

CONTROLLING DIMENSION: MILLIMETER.

 

 

 

 

 

 

 

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

 

 

 

 

 

 

 

 

 

 

 

 

PROTRUSIONS OR GATE BURRS. MOLD FLASH

 

 

 

 

 

 

 

 

 

N

 

 

OR GATE BURRS SHALL NOT EXCEED 0.15

 

 

 

 

 

 

 

 

 

0.25 (0.010)

 

(0.006) PER SIDE.

 

 

 

 

 

 

 

14

8

 

 

 

 

 

 

 

 

 

 

 

2X L/2

 

 

 

 

 

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

 

 

 

 

 

 

 

 

 

M

 

FLASH OR PROTRUSION. INTERLEAD FLASH OR

 

 

 

 

 

 

 

 

 

 

 

PROTRUSION SHALL NOT EXCEED

 

 

 

 

 

 

 

B

 

 

 

 

 

0.25 (0.010) PER SIDE.

 

 

 

L

 

 

 

 

 

 

 

 

5.

DIMENSION K DOES NOT INCLUDE DAMBAR

 

 

 

 

±U±

 

N

 

 

PROTRUSION. ALLOWABLE DAMBAR

 

 

 

PIN 1

 

 

 

 

 

 

 

 

 

 

 

 

 

F

 

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

 

 

 

IDENT.

 

 

 

 

 

 

 

EXCESS OF THE K DIMENSION AT MAXIMUM

 

 

 

 

1

7

 

 

 

 

 

 

MATERIAL CONDITION.

 

 

 

 

 

 

 

 

 

 

DETAIL E

6. TERMINAL NUMBERS ARE SHOWN FOR

 

 

 

 

 

 

 

 

 

 

 

 

REFERENCE ONLY.

 

 

 

 

 

 

 

 

 

 

 

 

 

7. DIMENSION A AND B ARE TO BE DETERMINED

0.15 (0.006) T

U

S

 

 

 

 

 

 

K

 

AT DATUM PLANE ±W±.

 

 

 

A

 

 

 

 

 

 

MILLIMETERS

INCHES

 

 

 

 

 

 

 

 

 

K1

 

 

 

 

 

 

 

±V±

 

 

 

 

 

DIM

MIN

MAX

MIN

MAX

 

 

 

 

 

 

 

 

 

 

 

A

4.90

5.10

0.193

0.200

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

J J1

 

 

B

4.30

4.50

0.169

0.177

 

 

 

 

 

 

 

 

 

 

C

±±±

1.20

±±±

0.047

 

 

 

 

 

 

 

 

 

 

 

 

D

0.05

0.15

0.002

0.006

 

 

 

 

 

 

 

 

 

 

SECTION N±N

 

F

0.50

0.75

0.020

0.030

 

 

 

 

 

 

 

 

 

 

 

G

0.65 BSC

0.026 BSC

 

 

 

 

 

 

 

 

 

 

 

 

H

0.50

0.60

0.020

0.024

 

 

 

 

 

 

 

 

 

 

 

 

J

0.09

0.20

0.004

0.008

 

 

 

 

C

 

 

 

 

 

 

±W±

J1

0.09

0.16

0.004

0.006

 

 

 

 

 

 

 

 

 

 

K

0.19

0.30

0.007

0.012

 

 

 

 

 

 

 

 

 

 

 

0.10 (0.004)

 

 

 

 

 

 

 

 

 

 

K1

0.19

0.25

0.007

0.010

 

 

 

 

 

 

 

 

 

 

L

6.40 BSC

0.252 BSC

±T±

SEATING

 

D

G

 

H

 

 

DETAIL E

 

M

0

8

0

8

 

 

 

 

 

 

 

 

 

 

 

PLANE

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. ªTypicalº parameters can and do vary in different applications. All operating parameters, including ªTypicalsº must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

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