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Library Expert Surface Mount Families

Pull back Quad Flat No lead (PQFN)

 

 

 

 

 

 

Pull back Quad Flat No Lead

 

PQFN Land Pattern

PQFN Land Pattern

 

 

Zero Rotation A

Zero Rotation B

 

 

 

 

Pull back Quad Flat No lead (PQFN) with Thermal Tab

 

 

 

 

PQFN with Thermal Tab

PQFN with Tab Land Pattern

PQFN with Tab Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

Small Outline No Lead and Quad Flat No Lead with Pullback (unit: mm)

 

 

Lead Part

 

Most

Nominal

Least

 

 

 

 

Density Level A

Density Level B

Density Level C

 

 

 

 

 

 

 

 

Periphery

0.05

0.00

0.05

 

 

 

Round off factor

Round off to the nearest

two place decimal, i.e., 1.00, 1.01, 1.02, 1.03

 

 

 

Courtyard excess

0.40

0.20

0.10

 

 

Dual Flat No Lead (DFN) Less than 1608 (0603)

 

Periphery

0.04

0.04

0.04

Round off factor

Round off to the nearest

two place decimal, i.e., 1.00, 1.01, 1.02, 1.03

Courtyard excess

0.20

0.15

0.10

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© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Land Grid Array (LGA)

 

 

 

 

 

Land Grid Array

LGA Land Pattern

LGA Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

Land Grid Array (LGA) (unit: mm)

 

Lead Part

 

 

 

Maximum (Most)

Median (Nominal)

Minimum (Least)

 

 

 

 

Density Level A

Density Level B

Density Level C

 

 

 

 

 

 

Periphery

 

 

0.05

0.00

 

0.05

 

Round off factor

 

Round off to the nearest

two place decimal, i.e., 1.00, 1.01, 1.02, 1.03

 

Courtyard excess

 

 

0.40

0.20

 

0.10

Leadless Chip Carrier (LCC)

 

 

 

 

 

 

 

 

 

 

 

 

 

Leadless Chip Carrier

 

LCC Land Pattern

 

LCC Land Pattern

 

 

 

 

 

 

Zero Rotation A

 

Zero Rotation B

 

 

 

 

 

 

 

 

 

 

Leadless Chip Carrier (LCC) (unit: mm)

 

Lead Part

 

Most

Nominal

 

Least

 

 

Density Level A

Density Level B

 

Density Level C

 

 

 

 

 

Heel (JH) (to find Z dim)

0.06

0.04

 

0.02

 

Toe (JT) (to find G dim)

0.60

0.50

 

0.40

 

Side (JS)

0.00

0.02

 

0.04

 

Round off factor

Round off to the nearest

two place decimal, i.e., 1.00, 1.05, 1.10, 1.15

 

Courtyard excess

0.40

0.20

 

0.10

 

https://twitter.com/pcblibraries

 

© 2014 2019 PCB Libraries, Inc.

 

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

 

http://www.PCBLibraries.com/forum

 

 

updated 10 21 18

Library Expert Surface Mount Families

Resistor, Side Concave Chip Array (RESCAV)

 

 

 

 

Concave Chip Array Resistor

Chip Array Land Pattern

Chip Array Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

Inductor, Side Flat Chip Array (INDCAV)

 

 

 

 

 

 

Side Flat Chip Array Inductor

 

Chip Array Land Pattern

Chip Array Land Pattern

 

 

Zero Rotation A

Zero Rotation B

 

 

 

 

Resistor, Side Concave Chip Array 4 Sided (RESCAV)

 

 

 

 

Example of 3D STEP model

Chip Array Land Pattern

Chip Array Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Resistor, Convex Chip Array Type E (RESCAXE)

 

 

 

 

Convex Chip Array Type E

Chip Array Land Pattern

Chip Array Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

Resistor, Convex Chip Array Type S (RESCAXS)

 

 

 

 

Convex Chip Array Type S

Chip Array Land Pattern

Chip Array Land Pattern

 

Zero Rotation A

Zero Rotation B

 

 

 

 

Side Flat/Concave/Convex Terminals (unit: mm)

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Side Lead

 

 

 

Least Density Level

 

 

 

Terminal Lead Spacing

 

 

Toe

Heel

 

 

 

 

 

Courtyard

 

 

 

 

Side

 

 

 

 

 

 

 

 

 

 

 

 

Pitch > 2.54 mm

 

0.45

0.02

 

 

 

0.04

 

0.10

 

Pitch > 1.27 and <= 2.54 mm

 

 

0.40

0.00

 

 

 

0.04

 

0.10

 

Pitch > 0.80 and <= 1.27 mm

 

0.35

0.02

 

 

0.05

 

0.10

 

Pitch > 0.65 and <= 0.80 mm

 

 

0.25

0.04

 

 

 

0.06

 

0.10

 

Pitch > 0.50 and <= 0.65 mm

 

0.20

0.05

 

 

0.07

 

0.10

 

Pitch > 0.40 and <= 0.50 mm

 

 

0.15

0.06

 

 

 

0.07

 

0.10

 

Pitch <= 0.40 mm

 

0.10

0.07

 

 

0.07

 

0.10

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Side Lead

 

 

Nominal Density Level

 

Terminal Lead Spacing

 

Toe

Heel

Side

Courtyard

 

 

 

 

 

 

Pitch > 2.54 mm

 

0.55

0.04

0.01

0.20

Pitch > 1.27 and <= 2.54 mm

 

0.50

0.02

0.02

0.20

Pitch > 0.80 and <= 1.27 mm

 

0.45

0.00

0.03

0.20

Pitch > 0.65 and <= 0.80 mm

 

0.35

0.02

0.04

0.20

Pitch > 0.50 and <= 0.65 mm

 

0.30

0.03

0.05

0.20

Pitch > 0.40 and <= 0.50 mm

 

0.25

0.04

0.05

0.20

Pitch <= 0.40 mm

 

0.20

0.05

0.05

0.20

Side Lead

 

 

Most Density Level

 

Terminal Lead Spacing

 

Toe

Heel

 

Side

Courtyard

 

 

 

 

 

 

 

Pitch > 2.54 mm

 

0.65

0.06

0.01

0.40

Pitch > 1.27 and <= 2.54 mm

 

0.60

0.04

0.00

0.40

Pitch > 0.80 and <= 1.27 mm

 

0.55

0.02

 

0.01

0.40

Pitch > 0.65 and <= 0.80 mm

 

0.45

0.00

 

0.02

0.40

Pitch > 0.50 and <= 0.65 mm

 

0.40

0.01

 

0.03

0.40

Pitch > 0.40 and <= 0.50 mm

 

0.35

0.02

 

0.03

0.40

Pitch <= 0.40 mm

 

0.30

0.03

 

0.03

0.40

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Component Terminal Lead Forms

Ball Grid Array

Land Grid Array/Bottom Only Column Grid Array

Cylindrical End Cap

Inward L Lead

Outward L Lead

J Lead

Gull Wing

Side Concave

Corner Concave

Flat No Lead Side

Flat Lead

Under Body Outward L

Inward Flat Ribbon L

Rectangular End Cap

Through Hole

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

 

updated 10 21 18

Library Expert Surface Mount Families

Polarity Marking Legend

The goal of the Polarity Marking Legend is to aid assembly to avoid polarized component packages from being inverted during the assembly machine setup or manual solder process. Therefore, Polarity Marking is only necessary on land patterns that require a specific rotation during the assembly process. For very dense part placements, the polarity marker can be placed under the package and covered up during the assembly process. However, the best practice is to locate the polarity indicator outside the package so that it is visible after the assembly process to allow the end user to visually validate that the assembly insertion process is correct. This is typically known as “Post Assembly Inspection Process”.

Polarity Markings are unique from company to company. Here are samples of the most popular shapes.

The size, rotation and location of the Polarity Markings are user definable. Here are some recommendations.

The most popular polarity marking is a filled Dot. The size of the Polarity Marking is relevant to the size of the component package and pad width. However, the polarity dot size is also dependent on the part placement density and the assembly shops ability to easily locate the dot to avoid component rotation insertion errors. The smallest visible markings range from 0.25 mm – 0.40 mm and are typically used for micro miniature packages or very dense part placement PCB layouts. The average size ranges are 0.50 mm – 0.80 mm. The largest recommended polarity dot is 1.00 mm.

This illustration indicates 3 popular locations for a 0.50 mm dot on an SOP package. The preferred polarity dot placement is at the end of the pad which is the furthest distance from the component package body. This makes the post assembly inspection process easy as the component package may move up ordown during assembly reflow but the dot will always be visible. The acceptable location is the pad center but this location is also a potential via site. It is advisable to keep legend ink off non tented vias or tented via holes. The not recommended location has a higher potential of a via site and the marking could collide with other parts during the part placement process.

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Gull Wing Terminal Lead Legend Polarity Marking Location

The component body outline legend line width should be a minimum of 0.125 mm. The Polarity Marking Symbol and component body legend should have a minimum 0.075 mm gap from the solder mask. The figure below illustrates the anatomy of a land pattern and feature sizes and spaces.

Sample 0.50 mm Pitch SOP Legend and Polarity Marking Rules

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

Library Expert Surface Mount Families

Warning, check with your PCB manufacturer to verify if they can meet the dimensional requirements.

Bottom only termination packages – BGA, LGA, CGA, QFN, PQFN, SON, PSON and DFN

The polarity marking size should match the Terminal Width. The gap between the body legend and the polarity marker should range from 0.15 mm – 0.25 mm

Polarized chip capacitors packages.

https://twitter.com/pcblibraries

© 2014 2019 PCB Libraries, Inc.

https://www.linkedin.com/company/3196824

Get updates at www.PCBLibraries.com/downloads

http://www.PCBLibraries.com/forum

updated 10 21 18

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