Nexperia |
BAV99 series |
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High-speed switching diodes |
9. Package outline
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3.0 |
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1.1 |
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2.2 |
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1.1 |
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1.8 |
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0.8 |
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2.8 |
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0.9 |
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3 |
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6 |
5 |
4 |
0.45 |
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0.15 |
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0.45 |
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0.15 |
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2.5 |
1.4 |
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2.2 |
1.35 |
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2.1 |
1.2 |
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2.0 |
1.15 |
pin 1 |
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index |
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1 |
2 |
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1 |
2 |
3 |
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0.48 |
0.15 |
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0.65 |
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0.3 |
0.25 |
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0.38 |
0.09 |
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0.2 |
0.10 |
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1.9 |
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1.3 |
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Dimensions in mm |
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04-11-04 |
Dimensions in mm |
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06-03-16 |
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Fig 7. Package outline BAV99 (SOT23/TO-236AB) |
Fig 8. Package outline BAV99S (SOT363/SC-88) |
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2.2 |
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1.1 |
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1.8 |
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0.8 |
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3 |
0.45 |
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0.15 |
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2.2 |
1.35 |
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2.0 |
1.15 |
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1 |
2 |
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0.4 |
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0.25 |
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1.3 |
0.3 |
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0.10 |
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Dimensions in mm |
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04-11-04 |
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Fig 9. Package outline BAV99W (SOT323/SC-70) |
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10. Packing information
Table 9. |
Packing methods |
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The indicated -xxx are the last three digits of the 12NC ordering code.[1] |
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Type number Package |
Description |
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Packing quantity |
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3000 |
10000 |
BAV99 |
SOT23 |
4 mm pitch, 8 mm tape and reel |
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-215 |
-235 |
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BAV99S |
SOT363 |
4 mm pitch, 8 mm tape and reel; T1 |
[2] |
-115 |
-135 |
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4 mm pitch, 8 mm tape and reel; T2 |
[3] |
-125 |
-165 |
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BAV99W |
SOT323 |
4 mm pitch, 8 mm tape and reel |
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-115 |
-135 |
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[1]For further information and the availability of packing methods, see Section 14.
[2]T1: normal taping
[3]T2: reverse taping
BAV99_SER |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
Rev. 8 — 18 November 2010 |
7 of 14 |
Nexperia |
BAV99 series |
|
High-speed switching diodes |
11. Soldering
3.3
2.9
1.9
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solder lands |
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solder resist |
3 |
1.7 |
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2 |
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solder paste |
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0.7 |
0.6 |
occupied area |
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(3×) |
(3×) |
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Dimensions in mm |
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0.5 |
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(3×) |
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0.6 |
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(3×) |
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1 |
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sot023_fr |
Fig 10. Reflow soldering footprint BAV99 (SOT23/TO-236AB)
2.2
1.2 (2×)
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1.4 |
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(2×) |
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solder lands |
4.6 2.6 |
solder resist |
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occupied area |
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Dimensions in mm |
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1.4 |
preferred transport direction during soldering
2.8
4.5 |
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sot023_fw |
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Fig 11. Wave soldering footprint BAV99 (SOT23/TO-236AB)
BAV99_SER |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
Rev. 8 — 18 November 2010 |
8 of 14 |
Nexperia |
BAV99 series |
|
High-speed switching diodes |
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2.65 |
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solder lands |
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2.35 1.5 0.6 |
0.5 |
0.4 (2×) |
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(4×) (4×) |
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solder resist |
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solder paste |
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0.5 |
0.6 |
occupied area |
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(4×) |
(2×) |
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0.6 |
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Dimensions in mm |
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(4×) |
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1.8 |
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sot363_fr |
Fig 12. |
Reflow soldering footprint BAV99S (SOT363/SC-88) |
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1.5 |
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solder lands |
4.5 |
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0.3 |
2.5 |
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solder resist |
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1.5 |
occupied area |
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Dimensions in mm |
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preferred transport |
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1.3 |
1.3 |
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direction during soldering |
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2.45 |
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5.3 |
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sot363_fw |
Fig 13. |
Wave soldering footprint BAV99S (SOT363/SC-88) |
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BAV99_SER |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
Rev. 8 — 18 November 2010 |
9 of 14 |
Nexperia |
BAV99 series |
|
High-speed switching diodes |
|
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2.65 |
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1.85 |
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1.325 |
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solder lands |
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2 |
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solder resist |
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0.6 |
3 |
1.3 |
solder paste |
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2.35 (3×) |
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1 |
0.5 |
occupied area |
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(3×) |
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Dimensions in mm |
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0.55 |
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(3×) |
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sot323_fr |
Fig 14. |
Reflow soldering footprint BAV99W (SOT323/SC-70) |
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4.6 |
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2.575 |
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1.425 |
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(3×) |
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solder lands |
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solder resist |
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occupied area |
3.65 2.1 |
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1.8 |
Dimensions in mm |
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09 |
preferred transport |
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direction during soldering |
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(2×) |
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sot323_fw |
Fig 15. |
Wave soldering footprint BAV99W (SOT323/SC-70) |
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BAV99_SER |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
Rev. 8 — 18 November 2010 |
10 of 14 |