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Система автоматизированного проектирования Altium Designer

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Материалы к лабораторным работам / Даташиты / 74HC151_NXP.pdf

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NXP Semiconductors	74HC151; 74HCT151
	8-input multiplexer

12. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

seating plane	D		ME
seating plane		A2	A
L		A1
	e		c
Z	e	w M
		b1
	b	b2	(e1)
	b	b2	MH
	16	9	MH

pin 1 index

								0		5				10 mm

										scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT	A	A 1	A 2	b	b	1	b	2	c	D	(1)	E	(1)		e	e	1	L	M	E	M	H	w	Z (1)
UNIT	max.	min.	max.	b	b		b		c	D		E			e	e		L	M		M		w	max.
	max.	min.	max.																					max.

mm	4.2	0.51	3.2	1.73	0.53		1.25		0.36	19.50		6.48		2.54		7.62		3.60	8.25		10.0		0.254	0.76
mm	4.2	0.51	3.2	1.30	0.38		0.85		0.23	18.55		6.20		2.54		7.62		3.05	7.80		8.3		0.254	0.76
				1.30	0.38		0.85		0.23	18.55		6.20						3.05	7.80		8.3

inches	0.17	0.02	0.13	0.068	0.021		0.049		0.014	0.77		0.26		0.1		0.3		0.14	0.32		0.39		0.01	0.03
inches	0.17	0.02	0.13	0.051	0.015		0.033		0.009	0.73		0.24		0.1		0.3		0.12	0.31		0.33		0.01	0.03
				0.051	0.015		0.033		0.009	0.73		0.24						0.12	0.31		0.33

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

OUTLINE

REFERENCES

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

PROJECTION

SOT38-4

95-01-14

03-02-13

Fig 8. Package outline SOT38-4 (DIP16)

74HC_HCT151

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 11 February 2013

12 of 19

NXP Semiconductors	74HC151; 74HCT151
	8-input multiplexer

SO16: plastic small outline package; 16 leads; body width 3.9 mm

SOT109-1

D		E	A
				X
	c
y		HE		v M A
		HE		v M A
Z
16	9
		Q
		A2	(A3)	A
		A1	(A3)	A
pin 1 index
				θ
		Lp
1	8	L
1	8
e	w M	detail X
	bp

							0		2.5			5 mm

									scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT	A	A1	A2	A3	bp	c	D(1)	E(1)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ
UNIT	max.	A1	A2	A3	bp	c	D(1)	E(1)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ
	max.

mm	1.75	0.25	1.45	0.25	0.49	0.25	10.0	4.0	1.27		6.2	1.05		1.0	0.7	0.25	0.25	0.1	0.7
mm	1.75	0.10	1.25	0.25	0.36	0.19	9.8	3.8	1.27		5.8	1.05		0.4	0.6	0.25	0.25	0.1	0.3	8o
		0.10	1.25		0.36	0.19	9.8	3.8			5.8			0.4	0.6				0.3	8o
																				0o
inches	0.069	0.010	0.057	0.01	0.019	0.0100	0.39	0.16	0.05		0.244	0.041		0.039	0.028	0.01	0.01	0.004	0.028	0o
inches	0.069	0.010	0.057	0.01	0.019	0.0100	0.39	0.16	0.05		0.244	0.041		0.039	0.028	0.01	0.01	0.004	0.028
		0.004	0.049		0.014	0.0075	0.38	0.15			0.228			0.016	0.020				0.012

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

OUTLINE

REFERENCES

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

PROJECTION

SOT109-1

076E07

MS-012

99-12-27

03-02-19

Fig 9. Package outline SOT109-1 (SO16)

74HC_HCT151

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 11 February 2013

13 of 19

NXP Semiconductors	74HC151; 74HCT151
	8-input multiplexer

SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm

SOT338-1

D	E	A
		X
	c
y	HE	v M A
	HE	v M A
Z
16	9

		Q
	A2	(A3)	A
	A1	(A3)
	pin 1 index		θ
			θ
		Lp
		L
1	8	detail X
	w M
e	bp

							0		2.5			5 mm

									scale
DIMENSIONS (mm are the original dimensions)

UNIT	A	A1	A2	A3	bp	c	D(1)	E (1)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ
UNIT	max.	A1	A2	A3	bp	c	D(1)	E (1)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ

mm	2	0.21	1.80	0.25	0.38	0.20	6.4	5.4	0.65		7.9	1.25		1.03	0.9	0.2	0.13	0.1	1.00	8o
mm		0.05	1.65		0.25	0.09	6.0	5.2			7.6			0.63	0.7				0.55	0o
		0.05	1.65		0.25	0.09	6.0	5.2			7.6			0.63	0.7				0.55	0o

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

REFERENCES

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

PROJECTION

SOT338-1

MO-150

99-12-27

03-02-19

Fig 10. Package outline SOT338-1 (SSOP16)

74HC_HCT151

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 11 February 2013

14 of 19

NXP Semiconductors	74HC151; 74HCT151
	8-input multiplexer

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

HE v M A

Z
16	9
			Q
	A	2	(A3)
		2	A
pin 1 index			A1
			θ
			Lp
			L
1	8
	w M		detail X
	w M
e	bp

							0		2.5			5 mm

									scale
DIMENSIONS (mm are the original dimensions)

UNIT	A	A1	A2	A3	bp	c	D (1)	E (2)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ
UNIT	max.	A1	A2	A3	bp	c	D (1)	E (2)		e	HE		L	Lp	Q	v	w	y	Z (1)	θ
	max.

mm	1.1	0.15	0.95	0.25	0.30	0.2	5.1	4.5	0.65		6.6	1		0.75	0.4	0.2	0.13	0.1	0.40	8o
mm		0.05	0.80		0.19	0.1	4.9	4.3			6.2			0.50	0.3				0.06	0o
		0.05	0.80		0.19	0.1	4.9	4.3			6.2			0.50	0.3				0.06	0o

Notes

1.Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2.Plastic interlead protrusions of 0.25 mm maximum per side are not included.

OUTLINE

REFERENCES

EUROPEAN

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

PROJECTION

SOT403-1

MO-153

99-12-27

03-02-18

Fig 11. Package outline SOT403-1 (TSSOP16)

74HC_HCT151

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 4 — 11 February 2013

15 of 19

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