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Electrical Characteristics

Figure 23-6. Power-On Reset Timing

R1

VDD

R3

/POR

(Internal)

R5

/Reset

(Internal)

Figure 23-7. Brown-Out Reset Timing

R2

VDD

/BOR

(Internal)

R4

R6

/Reset

(Internal)

Figure 23-8. Software Reset Timing

SW Reset

/Reset

(Internal)

R8

Figure 23-9. Watchdog Reset Timing

WDOG

Reset (Internal)

/Reset

(Internal)

R9

23.2.5Hibernation Module

The Hibernation Module requires special system implementation considerations since it is intended to power-down all other sections of its host device. The system power-supply distribution and interfaces to the device must be driven to 0 VDC or powered down with the same external voltage regulator controlled by HIB.

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LM3S6965 Microcontroller

The external voltage regulators controlled by HIB must have a settling time of 250 μs or less.

Table 23-12. Hibernation Module AC Characteristics

Parameter No

Parameter

 

 

Parameter Name

Min Nom Max Unit

H1

tHIB_LOW

Internal 32.768

KHz clock reference rising edge to /HIB asserted

-

200

-

μs

H2

tHIB_HIGH

Internal 32.768

KHz clock reference rising edge to /HIB deasserted

-

30

-

μs

H3

tWAKE_ASSERT

/WAKE assertion time

62

-

-

μs

H4

tWAKETOHIB

/WAKE assert to /HIB desassert

62

-

124

μs

H5

tXOSC_SETTLE

XOSC settling timea

20

-

-

ms

H6

tHIB_REG_WRITE

Time for a write to non-volatile registers in HIB module to complete

92

-

-

μs

H7

tHIB_TO_VDD

 

deassert to VDD and VDD25 at minimum operational level

-

-

250

μs

HIB

a. This parameter is highly sensitive to PCB layout and trace lengths, which may make this parameter time longer. Care must be taken in PCB design to minimize trace lengths and RLC (resistance, inductance, capacitance).

Figure 23-10. Hibernation Module Timing

32.768 KHz

(internal)

H1

 

 

 

H2

 

 

/HIB

H4

/WAKE

H3

23.2.6General-Purpose I/O (GPIO)

Note: All GPIOs are 5 V-tolerant.

Table 23-13. GPIO Characteristics

Parameter Parameter Name

Condition

Min Nom Max Unit

tGPIOR

GPIO Rise Time (from 20% to 80% of VDD)

2-mA drive

-

17

26

ns

 

 

4-mA drive

 

9

13

ns

 

 

8-mA drive

 

6

9

ns

 

 

8-mA drive with slew rate control

 

10

12

ns

tGPIOF

GPIO Fall Time (from 80% to 20% of VDD)

2-mA drive

-

17

25

ns

 

 

4-mA drive

 

8

12

ns

 

 

8-mA drive

 

6

10

ns

 

 

8-mA drive with slew rate control

 

11

13

ns

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Preliminary

Electrical Characteristics

23.2.7Analog-to-Digital Converter

Table 23-14. ADC Characteristicsa

Parameter

Parameter Name

Min Nom

Max

Unit

VADCIN

Maximum single-ended, full-scale analog input voltage

-

-

3.0

V

 

Minimum single-ended, full-scale analog input voltage

-

-

0

V

 

Maximum differential, full-scale analog input voltage

-

-

1.5

V

 

Minimum differential, full-scale analog input voltage

-

-

-1.5

V

CADCIN

Equivalent input capacitance

-

1

-

pF

N

Resolution

-

10

-

bits

fADC

ADC internal clock frequency

14

16

18

MHz

tADCCONV

Conversion time

-

-

16

tADCcyclesb

f ADCCONV

Conversion rate

875

1000

1125

k samples/s

INL

Integral nonlinearity

-

-

±1

LSB

DNL

Differential nonlinearity

-

-

±1

LSB

OFF

Offset

-

-

±1

LSB

GAIN

Gain

-

-

±1

LSB

a.The ADC reference voltage is 3.0 V. This reference voltage is internally generated from the 3.3 VDDA supply by a band gap circuit.

b.tADC= 1/fADC clock

23.2.8Synchronous Serial Interface (SSI)

Table 23-15. SSI Characteristics

Parameter No. Parameter

Parameter Name

Min Nom

Max

Unit

S1

tclk_per

SSIClk cycle time

2

-

65024 system clocks

S2

tclk_high

SSIClk high time

-

0.5

-

t clk_per

S3

tclk_low

SSIClk low time

-

0.5

-

t clk_per

S4

tclkrf

SSIClk rise/fall time

-

7.4

26

ns

S5

tDMd

Data from master valid delay time

0

-

20

ns

S6

tDMs

Data from master setup time

20

-

-

ns

S7

tDMh

Data from master hold time

40

-

-

ns

S8

tDSs

Data from slave setup time

20

-

-

ns

S9

tDSh

Data from slave hold time

40

-

-

ns

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Figure 23-11. SSI Timing for TI Frame Format (FRF=01), Single Transfer Timing Measurement

 

S1

 

S2

SSIClk

 

 

S3

SSIFss

 

SSITx

MSB

SSIRx

 

S4

LSB

4 to 16 bits

Figure 23-12. SSI Timing for MICROWIRE Frame Format (FRF=10), Single Transfer

S2

 

 

 

 

 

S1

 

 

 

SSIClk

S3

SSIFss

SSITx

MSB

LSB

 

 

8-bit control

SSIRx

0

MSB

LSB

 

 

4 to 16 bits output data

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Electrical Characteristics

Figure 23-13. SSI Timing for SPI Frame Format (FRF=00), with SPH=1

 

S1

S4

S2

SSIClk

 

(SPO=0)

 

S3

SSIClk

 

 

 

(SPO=1)

 

 

 

 

S6

S7

 

SSITx

MSB

LSB

(master)

 

 

 

S5

S8

S9

 

SSIRx

MSB

LSB

(slave)

 

 

 

SSIFss

 

 

 

23.2.9Inter-Integrated Circuit (I2C) Interface

Table 23-16. I2C Characteristics

Parameter No. Parameter

Parameter Name

Min Nom

Max

Unit

I1a

tSCH

Start condition hold time

36

-

-

system clocks

I2a

tLP

Clock Low period

36

-

-

system clocks

I3b

tSRT

I2CSCL/I2CSDA rise time (VIL =0.5 V to V IH =2.4 V)

-

-

(see note b)

ns

I4a

tDH

Data hold time

2

-

-

system clocks

I5c

tSFT

I2CSCL/I2CSDA fall time (VIH =2.4 V to V IL =0.5 V)

-

9

10

ns

I6a

tHT

Clock High time

24

-

-

system clocks

I7a

tDS

Data setup time

18

-

-

system clocks

I8a

tSCSR

Startconditionsetuptime(forrepeatedstartcondition

36

-

-

system clocks

 

 

only)

 

 

 

 

I9a

tSCS

Stop condition setup time

24

-

-

system clocks

a.Values depend on the value programmed into the TPR bit in the I2C Master Timer Period (I2CMTPR) register; a TPR

programmed for the maximum I2CSCL frequency (TPR=0x2) results in a minimum output timing as shown in the table above. The I2C interface is designed to scale the actual data transition time to move it to the middle of the I2CSCL Low

period. The actual position is affected by the value programmed into the TPR; however, the numbers given in the above values are minimum values.

b.Because I2CSCL and I2CSDA are open-drain-type outputs, which the controller can only actively drive Low, the time I2CSCL or I2CSDA takes to reach a high level depends on external signal capacitance and pull-up resistor values.

c.Specified at a nominal 50 pF load.

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