- •Design Guidelines For pcb Drawings
- •Drawing Definition
- •Purpose & Application
- •Drawing Details
- •Amendments
- •The Schematic View
- •Bill Of Materials
- •Table 1: Bill Of Materials Table
- •Connector Pin-Out
- •Table 2: Connector Pin-Out Table
- •Table 3: In-Circuit Testing Table
- •Led illumination intensity bins
- •Pcb assembly Views
- •Connector Detail View
- •The Bare Board Drawing - 44xxx
- •Figure 2: The standard bare board drawing border
- •Table 4: Artwork Data Reference Table
- •Tolerances
- •General Recommendations
- •Standard Drawing Notes.
Table 1: Bill Of Materials Table
If PCB is to be assembled in-house at MEM, a new column with the MEM part number s MUST be added.
The preferred and alternative suppliers for the components, as well as the part number of the preferred supplier have to be listed in the BOM.
Microcontrollers should be identified and the software part number should be shown in the BOM as a component. Software numbers and revisions should be assigned according to the Software Development Procedure as follows: -
16xxx |
- |
Uxx |
- |
S |
xx |
PCB article number |
- |
IC reference designator |
- |
Software Mark |
Revision |
For example: 16234-U16-S02 refers to the software which should be in microcontrollers with reference designator U16 of PCB assembly 16234 and has revision 02.
Connector Pin-Out
The connector numbering shall be shown on the schematic view as described previously. The signals shall be described in a separate table that relates to the same connector pin numbering.
The table shall have the following format: -
CONNECTOR PIN-OUT TABLE 2 |
|
PIN NUMBER |
FUNCTION |
1 |
+5V SUPPLY |
2 |
GROUND |
3 |
GEAR POSITION OUTPUT |
Table 2: Connector Pin-Out Table
In-Circuit Testing
An In-Circuit Testing table shall be included in the PCB assembly drawing. This table should indicate which electrical tests are to be performed on the PCBs after the components have been assembled. The table shall have the following format: -
IN-CIRCUIT TESTING TABLE 3 |
||
TEST |
TESTING POINTS |
EXPECTED VALUE |
SW1 (NC) |
TP2 – TP11 |
<0.5 OHM |
R1 // R2 |
TP9 – TP12 |
470 OHMS ± 10% |
D1 |
TP2 – TP3 |
0.75 ± 0.05V @ I = 10mA |
Table 3: In-Circuit Testing Table
In the case that any programming and/or calibration procedure is required, this has to be specified in a separate process instructions document. The PCB assembly drawing shall contain a note (either in the general notes list or in this ICT table) referring to this process instructions document, including the file name and version.
Led illumination intensity bins
In most cases, different resistors may be fitted on the PCB, depending on which of the specified LED illumination intensity bins are being assembled. In this case a table showing which resistor values are required for each LED intensity bin shall be included for each LED. It should be noted that two identical LEDs on the same PCB may require different resistor values for same bins, because the illumination may have different optical paths in the product.
When such resistor/LED bin tables are included, an additional table showing similar fields to those in the BOM table will be required for these resistors.
New Boards and or new Plastic will require LED tweaking across all acceptable BINs, resistors values for non-tweaked BINs shall be entered as TBE. This value will then be updated via a CN once the PCB assembler provides PCBs mounted with the available BINs.
A note in the 16xxx drawing is to require the PCB assembler to allow two weeks from the receipt of the new BIN PCBAs for a tweak and drawing update to occur.
