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AT24C02B

8Y6 - Mini Map

A

D2

b

 

 

(8X)

Pin 1

 

 

Index

 

 

Area

 

 

E

E2

 

 

 

Pin 1 ID

 

 

L (8X)

D

e (6X)

 

A2

 

A1

 

 

1.50 REF.

 

A3

COMMON DIMENSIONS

(Unit of Measure = mm)

 

SYMBOL

MIN

NOM

MAX

NOTE

 

 

D

 

2.00 BSC

 

 

 

 

 

 

 

 

 

 

 

E

 

3.00 BSC

 

 

 

 

 

 

 

 

 

 

 

D2

1.40

1.50

1.60

 

 

 

 

 

 

 

 

 

 

E2

-

-

1.40

 

 

 

 

 

 

 

 

 

 

A

-

-

0.60

 

 

 

 

 

 

 

 

 

 

A1

0.0

0.02

0.05

 

 

 

 

 

 

 

 

 

 

A2

-

-

0.55

 

 

 

 

 

 

 

 

 

 

A3

 

0.20 REF

 

 

 

 

 

 

 

 

 

 

 

L

0.20

0.30

0.40

 

 

 

 

 

 

 

 

 

 

e

 

0.50 BSC

 

 

 

 

b

0.20

0.25

0.30

2

 

 

 

 

 

 

 

 

Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions, tolerances, datums, etc.

2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.

TITLE

 

2325 Orchard Parkway

8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,

 

San Jose, CA 95131

R

Dual No Lead Package (DFN), (MLP 2x3)

8/26/05

DRAWING NO. REV.

8Y6 C

17

5126B–SEEPR–10/05

5TS1 – SOT23

 

e1

 

5

4

C

E1

E

C

 

 

L

 

 

L1

1

2

3

 

Top View

End View

b

 

 

A2

Seating

 

A1

Plane

e

 

 

D

Side View

NOTES: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-193, Variation AB, for additional information.

2.Dimension D does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.15 mm per side.

3.The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between the top and bottom of the plastic body.

4.These dimensions apply to the flat section of the lead between 0.08 mm and 0.15 mm from the lead tip.

5.Dimension "b" does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the "b" dimension at maximum material condition. The Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and an adjacent lead shall not be less than 0.07 mm.

A

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX

NOTE

A

1.10

 

A1

0.00

0.10

 

A2

0.70

0.90

1.00

 

c

0.08

0.20

4

 

 

 

 

 

D

 

2.90 BSC

 

2, 3

E

 

2.80 BSC

 

2, 3

E1

 

1.60 BSC

 

2, 3

 

 

 

 

 

L1

 

0.60 REF

 

 

 

 

 

 

 

e

 

0.95 BSC

 

 

 

 

 

 

 

e1

 

1.90 BSC

 

 

 

 

 

 

 

b

0.30

0.50

4, 5

 

 

 

 

 

6/25/03

 

1150 E. Cheyenne Mtn. Blvd.

TITLE

DRAWING NO.

REV.

 

5TS1, 5-lead, 1.60 mm Body, Plastic Thin Shrink

PO5TS1

A

R

Colorado Springs, CO 80906

Small Outline Package (SHRINK SOT)

18 AT24C02B

5126B–SEEPR–10/05

AT24C02B

8U3-1 – dBGA2

E

D

1. b

A1

PIN 1 BALL PAD CORNER

A2

Top View

A

 

PIN 1 BALL PAD CORNER

Side View

1

2

3

4

(d1)

d

8

7

6

5

e

(e1)

Bottom View

8 SOLDER BALLS

1. Dimension “b” is measured at the maximum solder ball diameter.

This drawing is for general information only.

COMMON DIMENSIONS

(Unit of Measure = mm)

SYMBOL

MIN

NOM

MAX NOTE

A

0.71

0.81

0.91

A1

0.10

0.15

0.20

A2

0.40

0.45

0.50

b

0.20

0.25

0.30

D1.50 BSC

E2.00 BSC

 

e

0.50 BSC

 

e1

0.25 REF

 

 

 

 

d

1.00 BSC

 

 

 

 

d1

0.25 REF

 

6/24/03

TITLE

DRAWING NO.

REV.

1150 E. Cheyenne Mtn. Blvd. 8U3-1, 8-ball, 1.50 x 2.00 mm Body, 0.50 mm pitch,

PO8U3-1

A

R Colorado Springs, CO 80906 Small Die Ball Grid Array Package (dBGA2)

 

 

19

5126B–SEEPR–10/05

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Printed on recycled paper.

5126B–SEEPR–10/05

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