ADS6125, ADS6124
ADS6123, ADS6122
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SLAS560A–OCTOBER 2007–REVISED MARCH 2008
BOARD DESIGN CONSIDERATIONS
Grounding
A single ground plane is sufficient to give good performance, provided the analog, digital and clock sections of the board are cleanly partitioned. See the EVM User Guide (SLWU028) for details on layout and grounding.
Supply Decoupling
As ADS612X already includes internal decoupling, minimal external decoupling can be used without loss in performance. Note that decoupling capacitors can help to filter external power supply noise, so the optimum number of capacitors would depend on the actual application. The decoupling capacitors should be placed very close to the converter supply pins.
It is recommended to use separate supplies for the analog and digital supply pins to isolate digital switching noise from sensitive analog circuitry. In case only a single 3.3-V supply is available, it should be routed first to AVDD. It can then be tapped and isolated with a ferrite bead (or inductor) with decoupling capacitor, before being routed to DRVDD.
Exposed Thermal Pad
It is necessary to solder the exposed pad at the bottom of the package to a ground plane for best thermal performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122) and QFN/SON PCB Attachment (SLUA271).
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Product Folder Link(s): ADS6125, ADS6124 ADS6123, ADS6122